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181.
M Mohri M Oka Y Aoki Y Gonda S Hirata K Gomi T Kiyota T Sugihara S Yamamoto T Ishida 《Canadian Metallurgical Quarterly》1994,45(4):298-303
This study demonstrated that intravenous infusion of recombinant human soluble thrombomodulin (rhs-TM) could inhibit disseminated intravascular coagulation (DIC) caused by 4 hr infusion of tissue factor (TF) in rats. Extended infusion of TF reduced fibrinogen and platelet counts and elevated serum FDP level. Pretreatment and coinfusion of rhs-TM could block changes of these DIC-parameters without prolongation of APTT. Heparin, which is a potent anti-DIC drug, could also inhibit these changes with extra prolongation of APTT and PT. Thus, these results suggest thrombomodulin prevent DIC less bleeding tendency than heparin. 相似文献
182.
Noriyuki Hayashi Hiroko Satomi Takahiro Mohri Toshinori Kajiwara Tetsuo Tanabe 《IEEJ Transactions on Electrical and Electronic Engineering》2009,4(5):674-676
A luminous body (LB) was produced by a pulsed electric discharge that initiated at the tip of the cathode and widely propagated on the surface of an electrolyte in the atmosphere. Entire images of the LB transition taken by a high-speed camera are visually demonstrated for the first time. It is indicated that the entire phenomenon of the LB transition can be classified into three sequential processes, regardless of the experimental conditions. It is estimated that the bright and octopus-like discharge, which may act as a source of high-energy ions and atoms, plays an essential role to make the mechanism of LB phenomena clear. Copyright © 2009 Institute of Electrical Engineers of Japan. Published by John Wiley & Sons, Inc. 相似文献
183.
Mamoru Mohri Masayoshi Esashi Shuji Tanaka 《Electronics and Communications in Japan》2014,97(9):42-51
This paper describes a versatile and reliable wafer‐level hermetic packaging technology using an anodically bondable low‐temperature co‐fired ceramic (LTCC) wafer, in which multilayer electrical feedthroughs can be embedded. The LTCC wafer allows many kinds of microelectromechanical systems (MEMS) to be more flexibly designed and more easily packaged. The hermeticity of vacuum‐sealed cavities was confirmed after 3000 cycles of thermal shock (–40 30 min/+125 30 min) by the diaphragm method. To practically apply the LTCC wafer to a variety of MEMS, the electrical connection between the MEMS on a Si wafer and feedthroughs in the LTCC should be established by a simple and reliable method. We have developed a new electrical connection method: the electrical connection is established by porous Au bumps, which are part of the Au vias exposed in wet‐etched cavities on the LTCC wafer. A 100% yield of both electrical connection and hermetic sealing was demonstrated. A thermal shock test up to 3000 cycles confirmed the reliability of this packaging technology. 相似文献