Investigation of Mechanical and Electrical Characteristics for Cracked Conductive Particle in Anisotropic Conductive Adhesive (ACA) Assembly

In an anisotropic conductive adhesive (ACA) assembly, the electrical conduction is usually achieved with the conductive particles between the bumps of integrated circuit (IC) and corresponding conductive tracks on the glass substrate. Fully understanding of the mechanical and electrical characteristics of ACA particles can help to optimize the assembly process and improve the reliability of ACA interconnection. Most conductive particles used in the ACA assembly are with cracks in the metal coating of the particles after the ACA bonding. This paper introduced the fracture analysis by applying the cohesive elements in the numerical model of the nickel-coated polymer particle and further simulating the cracks initiation and propagation in the nickel coating during the ACA bonding. The simulation results showed that the stress distribution on the nickel-coated particle with cracks was significantly different from that on the nickel-coated particle without crack, indicating that the stress analysis by taking the crack into consideration is very important for the reliability assessment of the ACA interconnection. The stress analysis of cohesive elements indicated that the cracks initiated at the central area of the nickel coating and propagated to the polar area. Furthermore, by the introduction of a new parameter of the virtual resistance, a mathematical model was established to describe the electrical characteristics of the nickel-coated particle with cracks. The particle resistance of the nickel-coated particle with cracks was found to be much higher than that of the particle without crack in the optimized bonding pressure range, indicating that it is necessary to take the crack into consideration for the particle conduction analysis as well. Therefore, the fracture analysis on the conductive particle by taking the crack into consideration could accurately evaluate the reliability of ACA interconnection and avoid serious reliability issues.     

Optimal and self‐tuning fusion Kalman filters for discrete‐time stochastic singular systems

Based on the optimal fusion estimation algorithm weighted by scalars in the linear minimum variance sense, a distributed optimal fusion Kalman filter weighted by scalars is presented for discrete‐time stochastic singular systems with multiple sensors and correlated noises. A cross‐covariance matrix of filtering errors between any two sensors is derived. When the noise statistical information is unknown, a distributed identification approach is presented based on correlation functions and the weighted average method. Further, a distributed self‐tuning fusion filter is given, which includes two stage fusions where the first‐stage fusion is used to identify the noise covariance and the second‐stage fusion is used to obtain the fusion state filter. A simulation verifies the effectiveness of the proposed algorithm. Copyright © 2008 John Wiley & Sons, Ltd.     

计算机高速并行通信的实现方案

利用CPLD芯片实现单片机与ISA总线接口之间的高速并行通信，给出系统的总体设计方法及程序框图。采用这种通信方式，在12MHz晶振的MCS51单片机控制的数据采集系统中，可以满足与PCI04 ISA总线接口实时通信的要求，通信速率达200khit／s。在开发工具MAX plusⅡ下，完成了整个设计的输入、编译和仿真，达到了预期效果。本设计方案能够推广应用到计算机的高速并行通信中。     

贵冶二期闪速炉失重给料螺旋运行实践

本文介绍了贵冶失重给料螺旋的性能、生产准备、点检维修、技术攻关、缺陷改进。     

RTK技术在黄土塬地震勘探测量中的应用

在对RTK技术进行简要介绍的基础上，叙述了这一技术在黄土塬地区地震勘探测量中的应用，及所取得的良好测量资料。     

薄板坯连铸生产SS400钢工艺技术研究

对唐钢薄板坯连铸机生产的SS400钢的生产工艺进行了分析,认为薄板坯连铸机生产的SS400钢,在采取了精炼站在线定氧,将钢水全氧控制在25×10~(-6)左右,同时连铸采取保护浇注和轻压下等技术后,能够确保薄板坯连铸SS400钢的顺利浇注,轧制的板带材表面质量良好,机械性能符合要求。     

扇形段电磁搅拌对82B钢连铸坯成分和组织的影响

进行了结晶器搅拌和结晶器 +扇形段电磁搅拌连铸 82B钢 2 80mm× 380mm方坯的工业试验。结果表明 ,扇形段搅拌降低和改善了铸坯的中心偏析、疏松和夹杂物分布。 82B钢铸坯经扇形段搅拌后 ,中心部位碳含量峰值明显减小 ,碳偏析指数降低 5 7%～ 1 0 8% ,铸坯成分的方差值 (σ)减小 32 %～ 34 9%。     

我国内螺纹铜管的生产技术与发展方向

本文论述了我国内螺纹铜管业生产、工艺、产品技术条件、齿型及市场现状 ,提出了内螺纹铜管的研发方向。     

新型银铁电触头材料试验研究

对采用粉末冶金与化学热处理相结合的方法研制的电触头材料进行了理化性能、显微组织和抗氧化性能试验，探讨其机理及对性能的影响因素。试验表明：所研制的触头的理化性能基本达到了国标规定的相近触头的指标，其显微组织和抗氧比性能则优于国标规定。Ａ＿（ｃ４）加速模拟电寿命试验的结果证实该种触头材料应用前景良好。     

PSD激光直线度测量仪

介绍了采用PSD传感器设计的激光直线度测量的工作原理，以及激光器、光靶和计算机系统的设计。