PVC as a food packaging material

Manufacture of polyvinyl chloride (PVC) in western Europe for all applications is now almost 4 m tonnes and the UK accounts for about 400 kt of this.The aim of this paper is to illustrate the relative importance of PVC as a packaging material where, in the UK for example, for food packaging it accounts for almost 40 kt (10%) of the PVC used.The different types of PVC packaging material—bottles, foil, cling film and cap sealing—and their method of manufacture are described, together with the range of food packaging applications in which they are used. The physical properties of PVC are described and, additionally, its cost and competitiveness with other materials are compared. The chemical nature of PVC compositions arising from the addition of heat stabilisers and plasticisers to achieve the desired properties is also described, with particular reference to heat stability.With the VCM toxicity issue now behind us, and PVC polymer with a maximum level of 1 ppm vinyl chloride monomer (VCM) being supplied for food packaging, PVC must be the most stringently controlled and thoroughly researched material for food packaging. Recent developments in polymerisation technology and polymer manufacture, which have enabled this level to be achieved, are briefly described.The current situation on the global migration issue, on which attention is currently focused, not only for plasticised PVC, but also other packaging materials as well, is briefly reviewed.     

TEM study of PLZT ceramics

The microscopic structures of PLZT(7.9/70/30 and x/65/35, x = 7 or 8) ceramics were studied by means of transmission electron microscopy. The presence of micro-regions in PLZTs was first verfied.     

Operation of an experimental facility for fabrication of fuel elements and fuel assemblies of the bor-60 containing vibrocompacted fuel

Translated from Atomnaya Énergiya, Vol. 67, No. 5, pp. 320–323, November, 1989.     

Prediction of electromagnetic radiation of a multilayer board

The moment method technique was used to determine the radiation from a multilayer board in the frequency range 30-200 MHz. A portion of clock trace, board ground plane and reflecting plane were modelled using several straight round wires which formed a radiating structure. The equivalent wire radius was obtained from the cross-section of the square traces. The clock pulse information was entered into the computer program in which the frequency spectrum was determined. The amplitude of each spectrum represented the peak voltage source fed into the radiating structure. Comparisons between the measured and calculated data indicated that the moment method technique can provide an excellent prediction, provided that the input impedances of the chip are known at every frequency.     

Biographies

This biography of William F. Ballhaus Jr. discusses his role in creating the field of computational fluid dynamics at the NASA Ames Research Center.     

A Compositional Framework for Hardware/Software Co-Design

We describe a compositional framework, together with its supporting toolset, for hardware/software co-design. Our framework is an integration of a formal approach within a traditional design flow. The formal approach is based on Interval Temporal Logic and its executable subset, Tempura. Refinement is the key element in our framework because it will derivefrom a single formal specification of the system the software and hardware parts of the implementation, while preserving all properties of the system specification. During refinement simulation is used to choose the appropriate refinement rules, which are applied automatically in the HOL system. The framework is illustrated with two case studies. The work presented is part of a UK collaborative research project between the Software Technology Research Laboratory at the De Montfort University and the Oxford University Computing Laboratory.     

A randomized voltage vector switching scheme for three-level powerinverters

In this paper, a feasibility study of a randomized space vector switching scheme for three-level inverters is reported. Based on the traditional space vector concept for pulse width modulation (PWM) inverters, the sequence of the space vector is randomized in this scheme. The overall vector, resulting from the randomization, is mathematically identical to that of the traditional space vector. It has been found that the randomized scheme can effectively spread the switching noise over a wide frequency range and at the same time keep the steady-state link capacitor voltage balanced. The proposed scheme has been implemented in real time in a digital controller and its features have been experimentally confirmed     

Design and performance of expanded mode fiber using microoptics

In order to relax alignment tolerances on single-mode fiber interconnection, we propose an end face treatment to realize an expanded mode fiber. This new technique consists of splicing fibers with various lengths and characteristics. The spot size and coupling properties are analyzed numerically considering the effects of gap, offset, and tilt. Low loss, wide misalignment tolerances, and low cost are achieved. The fabrication process and experiment results are presented. The performance of a connector with this expanded fiber is reported.