Study of inductively coupled Cl2/BCl3 plasma process for high etch rate selective etching of via-holes in GaAs

We have investigated the selective etching of 50 μm diameter via-holes for etch depth >200 μm using 30 μm thick photo resist mask in Inductively Coupled Plasma system with Cl₂/BCl₃ chemistry. Resultant etch rate/etch profiles are studied as a function of ICP process parameters and photo resist mask sidewall profile. Etch yield and aspect ratio variation with process pressure and substrate bias is also investigated at constant ICP power. The etch yield of ICP process increased with pressure due to reactant limited etch mechanism and reached a maximum of ∼19 for 200 μm depth at 50 mTorr pressure, 950 W coil power, 80 W substrate bias with an etch rate ∼4.9 μm/min. Final aspect ratio of etched holes is increased with pressure from 1.02 at 20 mTorr to 1.38 at 40 mTorr respectively for fixed etch time and then decreased to 1.24 at 50 mTorr pressure. The resultant final etch profile and undercut is found to have a strong dependence on the initial slope of photo resist mask sidewall angle and its selectivity in the pressure range of 20-50mTorr.     

Mechanisms of molecular interactions in polybase–polyacid complex formed by copolymers of N,N‐dimethylaminoethylmethacrylate with alkylmethacrylates and methacrylic acid with ethylacrylate

Mechanisms of molecular interaction in the blends of a polybase, a copolymer of N,N‐dimethylaminoethylmethacrylate with methylmethacrylate and butylmethacrylate (PDMAEMA–MMA/BMA), with a polyacid, a copolymer of methacrylic acid with ethylacrylate (PMAA‐co‐EA), and plasticizer, triethylcitrate (TEC), have been investigated with FTIR Spectroscopy and potentiometry. To evaluate the strengths of hydrogen and ionic bonds in the polyelectrolyte complexes, quantum‐chemical calculations were performed. According to this analysis, the energy of ionic and hydrogen bonding diminishes in the order: multi‐component complexes involving protonated aminogroup of DMAEMA (ammonium cation) in the presence of chlorine counterion with ionized or unchanged carboxyl groups and water molecules (690–520 kJ/mol) > ternary H‐bonded acid‐base complexes associated with molecule of water (520–420 kJ/mol) > binary ionic complex of carboxylate anion and ammonium cation (404 kJ/mol) > H‐bonded complex of carboxylate and ammonium ions (257 kJ/mol) > binary H‐bonded complex of uncharged carboxyl group with ammonium cation (114 kJ/mol) > ternary H‐bonded complex of uncharged carboxyl group, aminogroup and water molecule (43 kJ/mol) > binary H‐bonded complex between nonionized carboxyl and amino groups (26 kJ/mol). Proton‐donating capability of functional groups in the studied polyelectrolyte blends diminishes in the order: HN⁺(CH₃)₂ ? > HOOC? > HO? . The proton‐donating capacity can be significantly improved in the presence of Cl^? ions, the effect of which may be appreciably inhibited if Na⁺ cations are available in the blend or solution. Proton‐accepting capability weakens in the order: uncharged aminogroup > carboxylate anion > uncharged carboxyl group > hydroxyl group. The results of quantum chemical calculations facilitate interpretation of FTIR spectra. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Scheme to measure quantum stokes parameters and their fluctuations and correlations

Abstract

We propose a scheme to measure quantum Stokes parameters, their fluctuations and correlations. The proposal involves measurements of intensities and intensity-intensity correlations for suitably defined modes, which can be produced by a combination of half-wave and quarter-wave plates.     

Thousand-Core Chips [Roundtable]

The 2007 Design Automation Conference (DAC) had a special session entitled "1000 Core Chips," which was organized by Radu Marculescu (Carnegie Mellon University) and Li-Shiuan Peh (Princeton University). This session examined some of the ramifications of multicore chip design from four perspectives: technology, architecture, programming, and design automation. In this roundtable, held immediately following the conference session, the presenters expounded on the future of multicore chips with respect to education, programming languages, operating systems, and design automation.     

Photoelectrochemical solar cell fabrication with tungsten diselenide single crystals

Recent reports on highly efficient photoelectrochemical solar cells withn-type WSe₂ have prompted us to grown-type single crystals of WSe₂ using a chemical vapour transport method. Different transporting agents have been used. It is seen that SeCl₄ transporter leads to very large single crystals ofp-type WSe₂, whereas the same transporting agent with excess amount of Se leads ton-type single crystals. PEC solar cells fabricated withp-type andn-type crystals thus grown have been reported and the results discussed.     

Growth of polysilicon and silicide films for MOS-VLSI application

Doped and undoped polycrystalline silicon films were grown byapcvd and thermal evaporation techniques. The effect of growth and annealing conditions on the crystalline nature of the films and their properties were studied by electrical, optical, x-ray diffraction andsem techniques. Metal silicides such as TiSi₂ and PtSi₂ were prepared by co-evaporation technique over polysilicon layers to study their suitability in microelectronic applications. Some of the properties of polysilicon and silicides are discussed.     

Supporting ordinal four-state classification decisions using neural networks

Many accounting and finance problems require ordinal multi-state classification decisions, (e.g., control risk, bond rating, financial distress, etc.), yet few decision support systems are available to aid decision makers in such tasks. In this study, we develop a Neural Network based decision support system (NN-DSS) to classify firms in four ordinal states of financial condition namely healthy, dividend reduction, debt default and bankrupt. The classification results of the NN-DSS model are compared with those of a Naïve model, a Multiple Discriminant Analysis (MDA) model, and an Ordinal Logistic Regression (OLGR) model. Four different evaluation criteria are used to compare the models, namely, simple classification accuracy, distance-weighted classification accuracy, expected cost of misclassification (ECM) and ranked probability score. Our study shows that NN-DSS models perform significantly better than the Naïve, MDA, and OLGR models on the ECM criteria, and provide better results than MDA and OLGR on other criteria, although not always significantly better. The effect of the proportion of firms of each state in the training set is also studied. A balanced training set leads to more uniform (less skewed) classification across all four states, whereas an unbalanced training set biases the classification results in favor of the state with the largest number of observations.     

Serial interfacing for embedded-memory testing

A serial interfacing scheme in which several embedded memories share the built-in, self-test circuit is presented. For external testing, this approach requires only two serial pins for access to the data path. There is considerable savings in routing area, and fewer external pins are needed to test random-access memories with wide words, such as those in application-specific integrated circuits for telecommunications. Even though the method uses serial access to the memory, a test pattern is applied every clock cycle because the memory itself shifts the test data. The method has been adapted to four common algorithms. In implementations of built-in self-test circuitry on several product chips, the area overhead was found to be acceptable