Dielectric Drying

ABSTRACT

Dielectric heating is a term which covers both radio frequency (RF) and microwave systems. It has been used for industrial drying for many years because it has a number of advantages over other drying processes. These advantages include the volumetric dissipation of energy throughout a product, and the ability to automatically level any moisture variation within it. It is generally true to say that these techniques can only be justified in processes involving material of “high” value being processed in modest quantities but when combination with other fuel fired techniques there may be opportunities to broaden the range of applications. In addition to a desciption of current industrial applications, the theory of dielectric heating, the similarities and differences between RF and microwave are discussed together the effects of the dielectric roperties of a product on the design of the equipment     

STEAM DRYLNG OF WOOD FUELS

ABSTRACT

The objective of this work is to investigate some of the important aspects in the design of a steam band dryer for wood fuels. For this purpose the drying of the material in a bench-scale fixed bed dryer has been studied.

Drying times and thermal efficiencies for experiments conducted under different conditions are compared. The investigated materials are soft-and hardwood chips and softwood bark.

The thermal efficiency, the part of the sensible heat which is used during one passage of the steam through the bed, increases with increasing mass load (mass of dry matter per unit area) and with decreasing steam mass flux. At a mass load of 30 kg/m the thermal efficiency is about 0.85 even at steam mass fluxes as high as 0.6 kg/m² s (1.2 m/s). The thermal efficiency proves to be almost independent of pressure and temperature of the steam.

Due to the very inhomogeneous materials the steam mass flow distribution was uneven. This causes a decreased thermal efficiency. When bark     

Charring rates for double beams made from laminated veneer lumber (LVL)

This paper examines charring rates for different cross‐sections of single and double timber beams made from laminated veneer lumber, with nailed, screwed or glued connection types for the double beams. Charring rates and burning characteristics were examined both in a small furnace and in a larger pilot furnace. The bottom charring rates were sometimes greater than the side charring rates for very narrow beams dominated by corner effects and for double beams where the two components could separate during the fire exposure. The nail‐connected double laminated veneer lumber beams experienced the largest separation, leading to charring between the two components. The best performance was from the glued connection, which showed similar charring rates as a solid timber beam. Both the large‐scale and small‐scale testing showed that suitably placed screws (preferably full‐length threaded) can be used to give almost the same performance as a glued connection. Experimental findings were compared with results from a finite element analysis. There was reasonable agreement while the char layer was small, but less agreement in later stages as the char layer increased in thickness. Experimental findings were used to modify a spreadsheet design tool that predicts the fire resistance of a timber–concrete composite floor. Copyright © 2012 John Wiley & Sons, Ltd.     

Water Uptake by NaCl Particles Prior to Deliquescence and the Phase Rule

Using an environmental transmission electron microscope (ETEM), we show that a significant amount of water, far exceeding the multilayers caused by surface adsorption, is reversibly associated prior to deliquescence with substrate-supported NaCl particles (dry diameters of ～ 40 nm to 1.5 μ m; ～ 18°C). We hypothesize that the water is present as an aqueous solution containing dissolved Na and Cl ions. Water uptake occurs at relative humidities (RH) as low as 70%, and the resulting liquid layer coating the particles is stable over extended times if the RH is held constant. We exposed CaSO ₄ and CaSO ₄ · 2H ₂ O particles to elevated RH values in the ETEM to show that chemically nonspecific condensation of gas-phase water on the TEM substrate does not explain our observations. Furthermore, damage to the NaCl surface induced by the electron beam and small fluctuations in RH do not seem to contribute to or otherwise affect water uptake. We have similar observations of water association for other alkali halide particles, including NaBr and CsCl, prior to deliquescence. To explain the observations, we derive the phase rule for this geometry and show that it allows for the coexistence of liquid, solid, and vapor for the binary NaCl/H ₂ O system across a range of RH values. The derivation includes the effects of heterogeneous pressure because of the Laplace-Young relations for the subsystems. Furthermore, in view of the lever rule and the absence of similar observations for free-floating pure NaCl aerosol particles, we hypothesize that the surface energy necessary to support these effects is provided by sample-substrate interactions. Thus, the results of this study may be relevant to atmospheric systems in which soluble compounds are associated with insoluble materials.     

Strength and fracture analysis of silicon-based components for embedding

Single-crystalline silicon chips are widely employed in printed circuit boards (PCBs) as embedded components. Their design often requires one side patterned with metal contacts, whereas the opposite one is constituted by pure silicon. These components must possess a minimum strength to withstand the loads occurring during both production and operation of the board. In this work, the strength and fracture behaviour of miniaturised Si chips (dimensions: 2 mm × 2 mm × 0.125 mm) has been assessed under biaxial loading on both the pure silicon side and the metal-patterned side by means of a miniaturised ball-on-three-balls (B3B) fixture. Experimental results showed significant difference in the characteristic fracture load between the silicon-side (P₀ = 21.2 N, Weibull modulus m ≈ 2.6) and the metal-patterned side (P₀ = 8.6 N, m ≈ 12.3). Fracture mechanics and fractographic analyses, together with FE simulations of the loading process, helped clarifying the effect of the metal contacts on the overall fracture behaviour of the Si-chips.