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961.
The micro-ball grid array (/spl mu/BGA), a form of chip scale package (CSP), was developed as one of the most advanced surface mount devices, which may be assembled by ordinary surface mount technology. In the latest /spl mu/BGA type, eutectic tin-lead solder ball bumps are used instead of plated nickel and gold (Ni/Au) bumps. Assembly and reliability of the /spl mu/BGA's PCB, which is soldered by conventional surface mount technology, has been studied in this paper. The bending cycle test (1000 /spl mu//spl epsi/ to -1000 /spl mu//spl epsi/), is used to investigate the fatigue failure of solder joints of /spl mu/BGA, PBGA, and CBGA packages reflowed with different heating factors (Q/sub /spl eta//), defined as the integral of the measured temperature over the dwell time above liquidus (183/spl deg/C). The fatigue lifetime of the /spl mu/BGA assemblies firstly increases and then decreases with increasing heating factor. The greatest lifetime happens while Q/sub /spl eta// is near 500 second-degree. The optimal Q/sub n/ range is between 300 and 750 s/spl deg/C. In this range, the lifetime of the /spl mu/BGA assembly is greater than 4500 cycles if the assemblies are reflowed in nitrogen ambient. SEM micrographs reveal that both /spl mu/ & P-BGA assemblies fail in the solder joint at all heating factors. All fractures are near and parallel to the PCB pad. In the /spl mu/BGA assemblies cracks always initiate at the point of the acute angle where the solder joint joins the PCB pad, and then propagate in the section between the Ni/sub 3/Sn/sub 4/ intermetallic compound (IMC) layer and the bulk solder. In the CBGA assembly reliability test, the failures are in the form of delamination, at the interface between the ceramic base and metallization pad.  相似文献   
962.
大功率CO2混合模激光束传输参数的精确测量   总被引:2,自引:0,他引:2  
王智勇  陈涛  贺平  左铁钏 《中国激光》2000,27(12):1075-1079
根据大功率 CO2 混合模激光束横截面强度分布的变化规律 ,任选两个横截面的强度分布 ,采用数值迭代方法 ,精确计算出混合模传输的光学参数。  相似文献   
963.
基于TCP/IP协议的PDA和主机之间的无线通信   总被引:1,自引:0,他引:1  
为及时、方便对远程装备的性能进行测试,基于TCP/IP协议,利用C#.NET开发了PDA和主机之间的无线通信软件。该软件已与其它相关软件一起应用于装甲装备的检测线测试系统中,效果良好。文中介绍了PDA和主机间进行无线通信的硬件需求和软件开发过程,其中特别强调了该无线通信的硬件构成、配置步骤、注意事项和用C#.NET开发PDA的一些技术难点。希望能给从事相关研究的同仁一点启发。  相似文献   
964.
高速PCB板的信号完整性设计   总被引:1,自引:0,他引:1  
周萍 《电子质量》2009,(1):32-36
随着集成电路开关速度的提高以及PCB板密度的增加,信号完整性问题已成为高速PCB设计必须关注的问题之一。如何在高速PCB设计过程中充分考虑信号完整性因素,并采取有效的控制措施,已经成为当今系统设计能否成功的关键。此文在充分考虑SI的基础上,利用Cadence的Allegro完成了基于DSP和FPGA的某信号处理机的硬件设计,并使用Mentor公司的Hyperlynx进行仿真分析优化PCB设计,避免了信号完整性的潜在影响。  相似文献   
965.
目的:探讨非手术治疗睑缘肿物的方法及可靠性。方法:应用Nd-YAG激光及多功能电离子治疗仪治疗睑缘肿物。结果:临床285例患者治疗效果满意。讨论:非手术方法治疗睑缘肿物不但疗效确切,而且更具有临床美学效果。  相似文献   
966.
A quasi-distributed Fabry-Perot fiber optic temperature sensor array using optical time domain reflectometry (OTDR) technique is presented. The F-P sensor is made by two face to face single-mode optical fibers and their surfaces have been polished. Due to the low reflectivity of the fiber surfaces, the sensor is described as low Fresnel Fabry-Perot interferometer (FPI). The working principle is analyzed using twobeam optical interference approximation. To measure the temperature, a certain temperature sensitive material is filled in the cavity. The slight changes of the reflective intensity which is induced by the refractive index of the material was caught by OTDR. The length of the cavity is obtained by monitoring the interference spectrum which is used for the setting of the sensor static characteristics within the quasi-linear range. Based on our design, a three point sensor array are fabricated and characterized. The experimental results show that with the temperature increasing from -30℃ to 80℃, the reflectivity increase in a good linear manner. The sensitivity was approximate 0.074 dB℃. For the low transmission loss, more sensors can be integrated.  相似文献   
967.
In this paper, we propose a new technique for reducing cell loss in multi‐banyan‐based ATM switching fabrics. We propose a switch architecture that uses incremental path reservation based on previously established connections. Path reservation is carried out sequentially within each banyan but multiple banyan planes can be concurrently reserved. We use a conflict resolution approach according to which banyans make concurrent reservation offers of conflict‐free paths to head of the line cells waiting in input buffers. A reservation offer from a given banyan is allocated to the cell whose source‐to‐destination path uses the largest number of partially allocated switching elements which are shared with previously reserved paths. Paths are incrementally clustered within each banyan. This approach leaves the largest number of free switching elements for subsequent reservations which has the effect of reducing the potential of future conflicts and improves throughput. We present a pipelined switch architecture based on the above concept of path‐clustering which we call path‐clustering banyan switching fabric (PCBSF). An efficient hardware that implements PCBSF is presented together with its theoretical basis. The performance and robustness of PCBSF are evaluated under simulated uniform traffic and ATM traffic. We also compare the cell loss rate of PCBSF to that of other pipelined banyan switches by varying the switch size, input buffer size, and traffic pattern. Copyright © 2001 John Wiley & Sons, Ltd.  相似文献   
968.
An ATM transit switch is proposed based on direct sequence optical code division multiple access technique. No buffering is necessary to facilitate the switching. Code conversion is used instead to emulate the switching function. The switch not only provides asynchronous access to the users but also has a limited capability of dynamic bandwidth allocation. It is free from timing jitters and switching delay is significantly reduced. A look‐up table is employed in the switching and updated through network management functions. The switch provides a new approach to asynchronous cross‐connection in the ATM core network. The performance of the new switch is evaluated by a set of prime codes and modified prime codes. Copyright © 2001 John Wiley & Sons, Ltd.  相似文献   
969.
Developing efficient interfacial hole transporting materials (HTMs) is crucial for achieving high‐performance Pb‐free Sn‐based halide perovskite solar cells (PSCs). Here, a new series of benzodithiophene (BDT)‐based organic small molecules containing tetra‐ and di‐triphenyl amine donors prepared via a straightforward and scalable synthetic route is reported. The thermal, optical, and electrochemical properties of two BDT‐based molecules are shown to be structurally and energetically suitable to serve as HTMs for Sn‐based PSCs. It is reported here that ethylenediammonium/formamidinium tin iodide solar cells using BDT‐based HTMs deliver a champion power conversion efficiency up to 7.59%, outperforming analogous reference solar cells using traditional and expensive HTMs. Thus, these BDT‐based molecules are promising candidates as HTMs for the fabrication of high‐performance Sn‐based PSCs.  相似文献   
970.
Soft acoustic metamaterials that embed soft materials in a host media have promising applications in aqueous environments. However, the preparation of soft metamaterials under water and realization of low‐frequency soft acoustic metamaterials remains a challenge. By combining 3D printing technology and surface hydrophobic properties, this work presents a general approach to construct 3D soft acoustic metamaterials using bubbles as resonator units. Low‐frequency broadband locally resonant metamaterials can be realized using patterned bubbles with bandgaps that are orders of magnitude wider than other locally resonant metamaterials. In addition, a water‐to‐air ultratransmission metasurface is prepared by patterning a layer of bubbles beneath the water surface, which allows for the ultratransmission of sound across an air–water interface. This strategy opens up promising avenues for many applications based on locally resonant metamaterials such as deep subwavelength acoustic superlenses or negative‐refraction metamaterials.  相似文献   
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