UV nano embossing for polymer nano structures with non-transparent mold insert

In recent years, UV nano embossing (or imprinting) process has been widely used for mass replication of nano structures. Most of the UV embossing machines use a UV transparent mold insert (e.g. quartz or glass). However, when a master of nano structures of interest could be realized only in a UV non-transparent mold material, it would be desirable to have a UV embossing machine which could be operated with such a UV non-transparent mold insert. In this regard, we have designed and manufactured a new UV embossing system in such a way that UV non-transparent (e.g., metal or ceramic) mold inserts can also be used as the master for the mass replication of nano structures. For the new UV embossing system, we fabricate several metal mold inserts: a nickel electroformed mold insert having grating nano structures and two AAO (anodic aluminum oxide) mold inserts having dimple nano structures and high-aspect-ratio nanopores. Finally, corresponding nano structures are successfully replicated via the UV nano embossing machine developed in this study.     

Systematic reliability analysis of a class of application-specific embedded software framework

Dramatic advances in computer and communication technologies have made it economically feasible to extend the use of embedded computer systems to more and more critical applications. At the same time, these embedded computer systems are becoming more complex and distributed. As the bulk of the complex application-specific logic of these systems is realized by software, the need for certifying software systems has grown substantially. While relatively mature techniques exist for certifying hardware systems, methods of rigorously certifying software systems are still being actively researched. Possible certification methods for embedded software systems range from formal verification to statistical testing. These methods have different strengths and weaknesses and can be used to complement each other. One potentially useful approach is to decompose the specification into distinct aspects that can be independently certified using the method that is most effective for it. Even though substantial-research has been carried out to reduce the complexity of the software system through decomposition, one major hurdle is the need to certify the overall system on the basis of the aspect properties. One way to address this issue is to focus on architectures in which the aspects are relatively independent of each other. However, complex embedded systems are typically comprised of multiple architectures. We present an alternative approach based on the use of application-oriented-frameworks for implementing embedded systems. We show that it is possible to design such frameworks for embedded applications and derive expressions for determining the system reliability from the reliabilities of the framework and the aspects. The method is illustrated using a distributed multimedia collaboration system.     

Moving object detection in the encrypted domain

Multimedia Tools and Applications - The privacy-preserving moving object detection has drawn a lot of interest lately. Nevertheless, current approaches use Paillier’s scheme for encryption...     

Detecting pattern-based outliers

Outlier detection targets those exceptional data that deviate from the general pattern. Besides high density clustering, there is another pattern called low density regularity. Thus, there are two types of outliers w.r.t. them. We propose two techniques: one to identify the two patterns and the other to detect the corresponding outliers.     

Deep features-based speech emotion recognition for smart affective services

Emotion recognition from speech signals is an interesting research with several applications like smart healthcare, autonomous voice response systems, assessing situational seriousness by caller affective state analysis in emergency centers, and other smart affective services. In this paper, we present a study of speech emotion recognition based on the features extracted from spectrograms using a deep convolutional neural network (CNN) with rectangular kernels. Typically, CNNs have square shaped kernels and pooling operators at various layers, which are suited for 2D image data. However, in case of spectrograms, the information is encoded in a slightly different manner. Time is represented along the x-axis and y-axis shows frequency of the speech signal, whereas, the amplitude is indicated by the intensity value in the spectrogram at a particular position. To analyze speech through spectrograms, we propose rectangular kernels of varying shapes and sizes, along with max pooling in rectangular neighborhoods, to extract discriminative features. The proposed scheme effectively learns discriminative features from speech spectrograms and performs better than many state-of-the-art techniques when evaluated its performance on Emo-DB and Korean speech dataset.

     

Dual-wavelength cascaded Raman fibre laser

Dual-wavelength lasing at 1480 and 1500 nm has been demonstrated from a cascaded Raman fibre laser with a WDM coupler and two pairs of Bragg gratings. Intensity-adjustable, wavelength-tunable laser operation was achieved by tensile stress wavelength tuning of the gratings     

Novel Maskless Bumping for 3D Integration

A novel, maskless, low‐volume bumping material, called solder bump maker, which is composed of a resin and low‐melting‐point solder powder, has been developed. The resin features no distinct chemical reactions preventing the rheological coalescence of the solder, a deoxidation of the oxide layer on the solder powder for wetting on the pad at the solder melting point, and no major weight loss caused by out‐gassing. With these characteristics, the solder was successfully wetted onto a metal pad and formed a uniform solder bump array with pitches of 120 µm and 150 µm.     

A formation of cobalt silicide on silicon field emitter arrays byelectrical stress

A novel process utilizing electrical stress is proposed for the formation of Co silicide on single crystal silicon (c-Si) FEAs to improve the field emission characteristics. Co silicide FEAs formed by electrical stress (ES) exhibited a significant improvement in turn-on voltage and emission current compared with c-Si FEAs. The improvement mainly comes from the lower effective work function of Co silicide and less blunting of tips during silicidation by electrical stress in an ultra high vacuum (UHV) environment less than 10^-8 torr     

Pixel‐Structured Scintillator with Polymeric Microstructures for X‐Ray Image Sensors

We introduce a pixel‐structured scintillator realized on a flexible polymeric substrate and demonstrate its feasibility as an X‐ray converter when it is coupled to photosensitive elements. The sample was prepared by filling Gd₂O₂S:Tb scintillation material into a square‐pore‐shape cavity array fabricated with polyethylene. For comparison, a sample with the conventional continuous geometry was also prepared. Although the pixelated geometry showed X‐ray sensitivity of about 58% compared with the conventional geometry, the resolving power was improved by about 70% above a spatial frequency of 3 mm^?1. The spatial frequency at 10% of the modulation‐transfer function was about 6 mm^?1.     

Interconnection Technology Based on InSn Solder for Flexible Display Applications

A novel interconnection technology based on a 52InSn solder was developed for flexible display applications. The display industry is currently trying to develop a flexible display, and one of the crucial technologies for the implementation of a flexible display is to reduce the bonding process temperature to less than 150°C. InSn solder interconnection technology is proposed herein to reduce the electrical contact resistance and concurrently achieve a process temperature of less than 150°C. A solder bump maker (SBM) and fluxing underfill were developed for these purposes. SBM is a novel bumping material, and it is a mixture of a resin system and InSn solder powder. A maskless screen printing process was also developed using an SBM to reduce the cost of the bumping process. Fluxing underfill plays the role of a flux and an underfill concurrently to simplify the bonding process compared to a conventional flip‐chip bonding using a capillary underfill material. Using an SBM and fluxing underfill, a 20 μm pitch InSn solder SoP array on a glass substrate was successfully formed using a maskless screen printing process, and two glass substrates were bonded at 130°C.