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41.
Qunsheng Cao Yinchao Chen 《Antennas and Propagation, IEEE Transactions on》2003,51(2):350-357
We apply an anisotropic perfectly matched layer (APML) absorber for open boundary truncation in implementation of the multiresolution time domain (MRTD) scheme. We develop an APML update algorithm to handle a general APML region in the MRTD formulations with the content of the leapfrog algorithm applied in the conventional finite-difference time-domain method. We also discuss the boundary truncations for both perfectly electric conductor (PEC) and perfectly magnetic conductor (PMC) walls using the image techniques. We validate the algorithm by analyzing various guided wave and antenna structures. It is found that the APML performs well for absorbing electromagnetic waves in the MRTD algorithm. 相似文献
42.
论文将Fermat素性检验的思想运用于不可约多项式的判断,给出了一个对于不可约判断问题的Monte Carlo 算法,分析了该算法的计算复杂度问题,并且给出了次数在200以内的检验结果。 相似文献
43.
With the creation of a pattern recognition system for metal transfer mode, this article has collected five kinds of spectrum signals in gas metal arc welding (MIG, MAG and CO2) and take them as training samples. These samples have been pretreated by computer, several key characteristic parameters of the spectrum signal have been creatively extracted, and a corresponding recognition function and a minimum-distance-classifier have been constructed. The results show that the pattern recognition of several kinds of metal transfer modes for the metal gas arc welding can be done successfully, and relative important parameters in welding process, such as the frequency of droplet transfer and the approximate diameter of each droplet, can also be obtained. 相似文献
44.
In this paper, the moving least-squares differential quadrature (MLSDQ) method is employed for free vibration of thick antisymmetric laminates based on the first-order shear deformation theory. The generalized displacements of the laminates are independently approximated with the centered moving least-squares (MLS) technique within each domain of influence. The MLS nodal shape functions and their partial derivatives are computed quickly through back-substitutions after only one LU decomposition. Subsequently, the weighting coefficients in the MLSDQ discretization are determined with the nodal partial derivatives of the MLS shape functions. The MLSDQ method combines the merits of both the differential quadrature and meshless methods which can be conveniently applied to complex domains and irregular discretizations without loss of implementation efficiency and numerical accuracy. The natural frequencies of the laminates with various edge conditions, ply angles, and shapes are calculated and compared with the existing solutions to study the numerical accuracy and stability of the MLSDQ method. Effects of support size, order of completeness of basis functions, and node irregularity on the numerical accuracy are investigated in detail. 相似文献
45.
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47.
传统的数据采集器多采用Inte151系列或Inte196系列的CPU,运算能力差,速度慢,精度低,尤其是浮点运算能力限制了技术指标的进一步提高。有鉴于此,各科研单位及数据采集器产家正积极开发新一代的数据采集器。如采用高性能的嵌入式芯片,或带有数字信号处理功能的芯片等。TI公司的TMS320VC33数字信号处理芯片已能支持高达150MFLOPS的运行速度,是需浮点运算的电子产品应用场合中一种较理想的微处理器件。 相似文献
48.
A mechanism of soldering of an aluminum alloy die casting to a steel die is proposed. A soldering critical temperature is
postulated, at which iron begins to react with aluminum to form an aluminum-rich liquid phase and solid intermetallic compounds.
The liquid joins the die with the casting upon solidification. The critical temperature is determined by the elements in both
the casting alloy and the die material and is equal to the solidus temperature of the resulting alloy. The critical temperature
is used to predict the onset of die soldering, and the local liquid fraction is related to the soldering tendency. Experiments
have been carried out to validate the concept and to determine the critical temperature for die soldering in an iron-aluminum
system. Thermodynamic calculations are used to determine the critical temperature and soldering tendency for the cases of
pure aluminum and a 380 alloy in a steel mold. Factors affecting the soldering tendency are discussed, and methods for reducing
die soldering are suggested. 相似文献
50.
Chou Y.C. Leung D. Lai R. Grundbacher R. Barsky M. Kan Q. Tsai R. Wojtowicz M. Eng D. Tran L. Block T. Liu P.H. Nishimoto M. Oki A. 《Electron Device Letters, IEEE》2003,24(6):378-380
The authors have investigated the reliability performance of G-band (183 GHz) monolithic microwave integrated circuit (MMIC) amplifiers fabricated using 0.07-/spl mu/m T-gate InGaAs-InAlAs-InP HEMTs with pseudomorphic In/sub 0.75/Ga/sub 0.25/As channel on 3-in wafers. Life test was performed at two temperatures (T/sub 1/ = 200 /spl deg/C and T/sub 2/ = 215 /spl deg/C), and the amplifiers were stressed at V/sub ds/ of 1 V and I/sub ds/ of 250 mA/mm in a N/sub 2/ ambient. The activation energy is as high as 1.7 eV, achieving a projected median-time-to-failure (MTTF) /spl ap/ 2 /spl times/ 10/sup 6/ h at a junction temperature of 125 /spl deg/C. MTTF was determined by 2-temperature constant current stress using /spl Delta/G/sub mp/ = -20% as the failure criteria. The difference of reliability performance between 0.07-/spl mu/m InGaAs-InAlAs-InP HEMT MMICs with pseudomorphic In/sub 0.75/Ga/sub 0.25/As channel and 0.1-/spl mu/m InGaAs-InAlAs-InP HEMT MMICs with In/sub 0.6/Ga/sub 0.4/As channel is also discussed. The achieved high-reliability result demonstrates a robust 0.07-/spl mu/m pseudomorphic InGaAs-InAlAs-InP HEMT MMICs production technology for G-band applications. 相似文献