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21.
S. Mardnio P. Lucena Randall Q. Snurr Clio L. Cavalcante Jr. 《Microporous and mesoporous materials》2008,111(1-3):89-96
The adsorption of xylene isomers in AlPO4-11 (AEL network) was investigated using biased grand canonical Monte Carlo (GCMC) simulations. Preferential o-xylene adsorption was predicted by the simulations, in agreement with previously reported experimental data. In AlPO4-11 the selective adsorption behavior comes from the smaller length of the o-xylene molecule along the crystallographic c-axis compared to p-xylene. This is in contrast to AlPO4-5 and AlPO4-8, where the ortho-selectivity is caused by the characteristic face-to-face positioning of o-xylene. Energy minimization studies were also performed in a flexible AlPO4-11 lattice to study the structural changes upon xylene adsorption. The energy minimization study showed that the AlPO4-11 crystal distorts upon p- and o-xylene adsorption. The distortion mechanism is related to the strong interaction between xylene methyl groups and the sieve oxygen atoms in the O3 position in the wide region of the pore. 相似文献
22.
We present a numerical study of the packing of uniform spheres under three-dimensional vibration using the discrete element method (DEM), focusing on the effects of vibration condition (amplitude and frequency) and inter-particle frictions (sliding and rolling frictions). The results are analysed in terms of packing density, coordination number (CN), radial distribution function (RDF) and pore structure. It is shown that increasing either the vibration amplitude or frequency causes packing density to increase initially to a maximum and then decrease. Both vibration frequency and amplitude should be considered to characterize the effect of vibration process on packing structure. The sliding and rolling frictions between particles can decrease packing density since they dissipate energy, although the effect of rolling friction is less significant. In line with the change of packing density, microstructural properties such as CN, RDF and pore distribution also change: a looser packing often corresponds to smaller CN, less peaked RDF and larger but more widely distributed pores. 相似文献
23.
Seyeong Choi Alouini M.-S. Qaraqe K.A. Hong-Chuan Yang 《Wireless Communications, IEEE Transactions on》2008,7(2):495-499
We propose and analyze new finger assignment techniques that are applicable for RAKE receivers in the soft handover (SHO) region. Specifically, extending the results for the case of two-base station (BS), we consider the multi-BS situation, attack the statistics of several correlated generalized selection combining (GSC) stages, and provide closed-form expressions for the statistics of the output signal-to-noise ratio (SNR). By investigating the tradeoff among the error performance, the average number of required path estimations/comparisons, and the SHO overhead, we show through numerical examples that the new schemes offer commensurate performance in comparison with more complicated GSC-based diversity systems while requiring a smaller estimation load and SHO overhead. 相似文献
24.
van Driel W.D. van Gils M.A.J. Xuejun Fan Zhang G.Q. Ernst L.J. 《Components and Packaging Technologies, IEEE Transactions on》2008,31(2):260-268
Exposed pad packages were introduced in the late 1980s and early 1990s because of their excellent thermal and electrical performance. Despite these advantages, the exposed pad packages experience a lot of thermo-hygro-mechanical related reliability problems during qualification and testing. Examples are die lift, which occurs predominantly after moisture sensitivity level conditions, and die-attach to leadframe delamination leading to downbond stitch breaks during temperature cycling. In this chapter, nonlinear finite element (FE) models using fracture mechanics based J-integral calculations are used to assess the reliability problems of the exposed pad package family. Using the parametric FE models any geometrical and material effects can be explored to their impact on the occurrence diepad delamination, and dielift. For instance the impact of diepad size is found to be of much less importance as the impact of die thickness is. Using the fracture mechanics approach, the starting location for the delamination from thermo-hygro-mechanical point of view is deducted. The results indicate that when diepad delamination is present, cracks are likely to grow beneath the die and dielift will occur. The interaction between dielift and other failure modes, such as lifted ball bonds, are not found to be very significant. The FE models are combined with simulation-based optimization methods to deduct design guidelines for optimal reliability of the exposed pad family. 相似文献
25.
Bin Xie Shi X.Q. Han Ding 《Components and Packaging Technologies, IEEE Transactions on》2008,31(2):361-369
In an anisotropic conductive adhesive (ACA) assembly, the electrical conduction is usually achieved with the conductive particles between the bumps of integrated circuit (IC) and corresponding conductive tracks on the glass substrate. Fully understanding of the mechanical and electrical characteristics of ACA particles can help to optimize the assembly process and improve the reliability of ACA interconnection. Most conductive particles used in the ACA assembly are with cracks in the metal coating of the particles after the ACA bonding. This paper introduced the fracture analysis by applying the cohesive elements in the numerical model of the nickel-coated polymer particle and further simulating the cracks initiation and propagation in the nickel coating during the ACA bonding. The simulation results showed that the stress distribution on the nickel-coated particle with cracks was significantly different from that on the nickel-coated particle without crack, indicating that the stress analysis by taking the crack into consideration is very important for the reliability assessment of the ACA interconnection. The stress analysis of cohesive elements indicated that the cracks initiated at the central area of the nickel coating and propagated to the polar area. Furthermore, by the introduction of a new parameter of the virtual resistance, a mathematical model was established to describe the electrical characteristics of the nickel-coated particle with cracks. The particle resistance of the nickel-coated particle with cracks was found to be much higher than that of the particle without crack in the optimized bonding pressure range, indicating that it is necessary to take the crack into consideration for the particle conduction analysis as well. Therefore, the fracture analysis on the conductive particle by taking the crack into consideration could accurately evaluate the reliability of ACA interconnection and avoid serious reliability issues. 相似文献
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简要介绍了鞍钢现有人造富矿生产能力,分析了鞍钢生产1600万t/a生铁所需要的炉料数量、品种和质量,并提出了解决炉料缺口的方法和措施。 相似文献