铸造充型过程流场及温度场模拟

根据砂型铸造充型特点建立模型，并利用ANSYS软件的FLOTRAN CFD模块，实现了对铸件充型过程的流场与温度场的模拟。研究结果表明：计算机模拟结果与实际试验结果相符。     

基于Solid Edge参数化设计的两种方法

通过使用VB语言对Solid Edge软件进行二次开发，利用完全程序化建模方法实现对斜齿轮的参数化设计，利用变量化设计建模的方法实现对螺栓的参数化设计。     

冷连轧过程控制数据管理系统的研究

数据管理系统逐渐成为冷连轧过程控制中的重要组成部分。介绍了一种基于组态软件的数据管理系统,重点介绍了过程数据的采集和存储,及其在冷连轧过程控制中的应用等。     

超音速电弧喷涂耐磨涂层在电站锅炉受热面上的应用

阐述了超音速电弧喷涂技术的原理、特点及其应用.为防止锅炉受热面泄漏,可在电站锅炉吹灰器吹损的管壁表面喷涂耐磨涂层.指出应用超音速电弧喷涂技术对防止锅炉受热面泄漏问题,具有重要的实际意义.     

三峡永久船闸导垂孔施工用电镀金刚石钻头的研制

为了满足导垂孔施工孔径大、垂直精度高（扎斜允许偏差在1‰以内）的要求,本文采用复合电镀技术研制出大口径会刚石钻头,所用胎体材料为镍钴合金,钻进金刚石的品级为MBD8、MBD10,其中MBD10占总量的60％,金刚石粒度分别为40／45、45／50、50／60、60／70,各种粒度的比例（质量比）分别为20％、30％、35％、15％。电镀金刚石钻头在室温下进行,pH值在3～5之间,电流密度在0．5—0．9A／dm^2范围内。文章还提出了基体设计和强化方案,分析了钢体、金刚石参数、胎体对钻进过程的影响,采用混目金刚石扩大了钻头的适用范嗣,提高了钻头的自锐性。使用结果表明：胎体配方、工艺流程、电镀参数和钢体强化没汁是合理的,研制的电镀金刚石钻头在二峡永久船闸倒垂孔钻进中,其平均使用寿命达到16米,钻进时效为0．3～0．5m．     

利用变频调速器对砂布砂纸生产线进行恒张力控制

本文根据弹性力学中的虎克定律，结合砂布砂纸生产特点，分析计算了生产线中基体、应变、速度、张力、转速等参数之间的关系，建立了砂布砂纸生产线中传动辊转速（频率）运动方程。然后利用此规律通过交流变频调速器对电机转速的控制，实现了砂布砂纸生产线的恒定张力控制。系统控制简捷、稳定，调节方便，节约能耗，重复性好，实用性强。     

MICROSTRUCTURE AND MECHANICAL PROPERTIES OF Mg-Li ALLOY WITH Ca ADDITION

Mg-9wt%Li-2wt%Zn alloy was prepared and studied in this article. The addition of Ca to the alloy from 0.1wt% to 1wt% can refine the α-Mg and the best effect of refinement occurs when Ca content is 0.4wt%-0.5wt%. The billets can be rolled to thin sheets at room temperature, from which it is obvious that the addition of Ca improves alloys ormalin. while it decreases with the excess addition of Ca. The results also show that the ultimate tensile strength （UTS） and yield strength （YS） of the alloy with lwt% Ca may rise by 28% and 25%, respectively, however, the elongation decreases. It is clarified that the adsorption of proper Ca on the grain boundaries refines α-Mg and improves the tensile properties, but the presence of excess Ca and stable Ca2Mg6Zn3phase worsens the elongation.     

盖包法生产球墨铸铁的几点注意事项

根据盖包法生产特性及工艺，分别从可操作性、铁液定量、密封性、反应空间和铁液流五个方面进行了总结，并针对盖包法在我国的应用，根据现场经验提出了相应改进措施，旨在提高盖包法球化处理效果，使盖包球化处理法在国内推广。     

A simple experimental tooling with internal pressure source used for evaluation of material formability in tube hydroforming

Material properties have powerful impact on the tube hydroforming (THF) process and the quality of the deformed tube, so it is important to select proper materials and evaluate the material formability prior to conducting the process. A simplified and applied tooling, which has no use for any external hydraulic pressure source but internal one, was designed for charactering the material formability in THF. A pressurized-fluid supplier is automatically established to provide the internal pressure and axial load synchronously required for THF, and the ratio of the two loads is achieved by proper design of the supplier. As a stand-alone hydraulic bulging fixture, the tooling can be worked on a conventional press, even on a single action press. Free bulge forming (FBF), bulge forming with axial loading (BFAL), free and restrained bulge forming (free and fixed ends) can be fulfilled by the tooling, and furthermore, bulge forming with proportional loading to some extend can be realized. Comparative bulge forming experiments under various forming conditions were carried out with the tooling to validate this project and the results suggest that restrained conditions on the tube ends highly affect the FBF, while the ratio of the two loads dominates the BFAL.     

A new Cu–Hf–Al ternary bulk metallic glass with high glass forming ability and ductility

We have discovered a new Cu-based bulk metallic glass (BMG). Although of a simple Cu₄₉Hf₄₂Al₉ ternary composition, the as-cast alloy is a monolithic, uniform BMG with a critical diameter as large as 10 mm. The width of the supercooled liquid region ΔT_x and the reduced glass transition temperature T_rg for this glass are 85 K and 0.62, respectively. In addition to its high glass-forming ability and high density of 11 g/cc, this BMG exhibits high ductility with a compressive plastic strain of 11–13%, making it a good candidate for applications as well as for studies of deformation behavior of Cu-based BMGs.