首页 | 本学科首页   官方微博 | 高级检索  
文章检索
  按 检索   检索词:      
出版年份:   被引次数:   他引次数: 提示:输入*表示无穷大
  收费全文   44622篇
  免费   3851篇
  国内免费   2101篇
电工技术   2427篇
技术理论   3篇
综合类   3095篇
化学工业   7500篇
金属工艺   2255篇
机械仪表   2851篇
建筑科学   3581篇
矿业工程   1210篇
能源动力   1406篇
轻工业   2486篇
水利工程   777篇
石油天然气   3086篇
武器工业   344篇
无线电   5203篇
一般工业技术   5508篇
冶金工业   2006篇
原子能技术   555篇
自动化技术   6281篇
  2024年   185篇
  2023年   683篇
  2022年   1179篇
  2021年   1666篇
  2020年   1271篇
  2019年   1142篇
  2018年   1231篇
  2017年   1412篇
  2016年   1276篇
  2015年   1579篇
  2014年   2065篇
  2013年   2478篇
  2012年   2536篇
  2011年   2838篇
  2010年   2452篇
  2009年   2340篇
  2008年   2378篇
  2007年   2258篇
  2006年   2397篇
  2005年   1991篇
  2004年   1467篇
  2003年   1663篇
  2002年   1919篇
  2001年   1672篇
  2000年   1321篇
  1999年   1399篇
  1998年   1020篇
  1997年   866篇
  1996年   871篇
  1995年   677篇
  1994年   584篇
  1993年   446篇
  1992年   308篇
  1991年   228篇
  1990年   176篇
  1989年   156篇
  1988年   156篇
  1987年   93篇
  1986年   55篇
  1985年   37篇
  1984年   25篇
  1983年   18篇
  1982年   22篇
  1981年   14篇
  1980年   11篇
  1979年   10篇
  1976年   1篇
  1971年   2篇
排序方式: 共有10000条查询结果,搜索用时 15 毫秒
11.
We demonstrate the first programmable group-delay module based on polarization switching. With a unique binary tuning mechanism, the device can generate any differential group delay value from -45 to +45 ps with a resolution of 1.40 ps, or any true-time-delay value from 0 to 45 ps with a resolution of 0.7 ps. The delay varying speeds for both applications are under 1 ms and can be as fast as 0.1 ms. We evaluate both the dynamic and static performances of the device while paying special attention to its dynamic figures of merit for polarization-mode dispersion emulation and compensation applications. Our experiment shows that the device exhibits a negligible transient-effect induced power penalty (<0.2 dB) in a 10-Gb/s nonreturn-to-zero system.  相似文献   
12.
The effect of the atomic mobility on a film surface has been studied by using a three-dimensional atomistic thin-film deposition model which simulates three-dimensional thin-film images, surface profiles and cross-sectional area pictures. In addition, quantitative results of surface RMS roughness, average film thickness, atomic coordination number and its distribution, and solid fraction of the deposited thin films, were obtained from the simulations. When the film surface mobility increased from 0.3 to 3.0, RMS roughness decreased from 6.5 to 1.1, solid fraction increased from 0.27 to 0.56 and average film thickness decreased from 40 to 28, due to the reduction of the voids within the film. The full-width half magnitude of the atomic coordination distribution became narrower indicating the increased degree of crystallization. With increase in surface mobility crossing the boundary to 1.5, the film evolved from a porous or loose columnar structure with voids, to a densely packed fibrous grain structure which can be categorized by the zone structure models.  相似文献   
13.
本文比较了几种常用的α厚层测量法的定标方法。实验结果表明,共沉淀法是一种比较理想的定标方法,它所制得的标准样品的定标曲线线性较好,探测效率较稳定。  相似文献   
14.
转移法色交换   总被引:1,自引:0,他引:1  
将图G的着色由一种变为中一种,通常用Kempe法以交换。但是,对于某些情况,用此法无效。针对这个问题,本文提出了一种转移法色交换,它适用于平面图着色,方法直观,清晰且有效。  相似文献   
15.
16.
The semiconductor device trend for increasing functionalities and performances yet with smaller overall feature sizes presents escalating obstacles to the decreasing form factor along with demanding thermal carrying capability required at the package level. To confront this compounding issue, ultrafine-pitch wirebond interconnect coupled with thermally enhanced copper heat spreader attached to the package are introduced. However, the additional copper heat spreader thickness introduced within the package challenges the design of the package's wire, its loop height, and the molding process control to prevent wire sweeping occurrences. This study investigates the impact of different ultrafine pitched wire types, wire loop designs, copper heat spreader structures, and mold material types on eliminating device short from occurring due to the wire sweeping phenomena. A full factorial experiment is performed using an active silicon device packaged in a thermally enhanced ball grid array (BGA) test vehicle. In addition, test characterization is carried out using x-ray and multiinsertions hot/cold continuity tests. Then, a detailed failure analysis is performed by package decapsulation and scanning electron microscopy/energy-dispersive x-ray (SEM/EDX) to confirm the experimental findings. In conclusion, the study finds that for an ultrafine-pitched thermally enhanced BGA package, wire type is insignificant to reduce wire shorting occurrences. However, mold material and copper heat spreader structure using an optimized wire loop design are significant factors in eliminating wiresweep shorting phenomena. This study concludes with a wirebond interconnect and heat slug design recommended along with an improved process parameters and assembly material sets found from the experiment.  相似文献   
17.
Crystallite growth characteristics of coprecipitated superfine zirconia powders have been investigated. It was found that the crystallite growth in powders follows a cubic law at 800 and 1000°C; however, the crystallite size data for compacts of both Y-TZP and YSZ cannot be fitted with a traditional parabolic or cubic law, but with a linear relation between crystallite size and the logarithm of time. In addition, it was also found that the degree of agglomeration of the powders can affect the crystallite growth.  相似文献   
18.
The paper describes some geotechnical properties of the soft soils in Guangzhou College City, China, which are difficult to both sample and test. Laboratory and in situ tests were carried out to assess the physical and mechanical indices of the soils. The data were statistically analyzed and linear regression undertaken such that equations could be developed by which the geotechnical properties of the soft soils can be predicted. The statistical validity of the degree of correlation confirmed that using these equations, the mechanical indices can be estimated from physical indices determined by routine testing.   相似文献   
19.
This paper addresses the general single-machine earliness-tardiness problem with distinct release dates, due dates, and unit costs. The aim of this research is to obtain an exact nonpreemptive solution in which machine idle time is allowed. In a hybrid approach, we formulate and then solve the problem using dynamic programming (DP), while incorporating techniques from branch-and-bound (BB). This approach (DP-BB) has been proven to be effective in solving certain types of scheduling problems. We further propose a new adaptation of the approach to a general problem with a nonregular objective function. To address some shortcomings of DP-BB, we also apply a BB approach in which partial dynamic programming dominance (BB-PDP) is exploited. Computational experiments were conducted with randomly generated test instances in order to evaluate the effectiveness of the two approaches. The results clearly showed that our new approaches can solve all the instances with up to 40 jobs and most of the instances with 50 jobs, which outperforms those frequently used approaches in scheduling research.  相似文献   
20.
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号