Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

Global stability of Internet congestion controllers with heterogeneous delays

In this paper, we study the problem of designing globally stable, scalable congestion control algorithms for the Internet. Prior work has primarily used linear stability as the criterion for such a design. Global stability has been studied only for single node, single source problems. Here, we obtain conditions for a general topology network accessed by sources with heterogeneous delays. We obtain a sufficient condition for global stability in terms of the increase/decrease parameters of the congestion control algorithm and the price functions used at the links.     

Improving narrow bandgap a-SiGe:H alloys grown by hot-wire chemical vapor deposition

We have improved the electronic properties of narrow-bandgap (Tauc gap below 1.5 eV) amorphous-silicon germanium alloys (a-SiGe:H) grown by hot-wire chemical vapor deposition (HWCVD) by lowering the substrate temperature and deposition rate. Prior to this work, we were unable to grow a-SiGe:H alloys with bandgaps below 1.5 eV that had photo-to-dark conductivity ratios comparable with our plasma-enhanced CVD (PECVD) grown materials [B.P. Nelson et al., Mater. Res. Soc. Symp. 507 (1998) 447]. Decreasing the filament diameter from our standard configuration of 0.5 mm to 0.38 or 0.25 mm provides first big improvements in the photoresponse of these alloys. Lowering the substrate temperature from our previous optimal temperatures (T_sub starting at 435 °C) to at 250 °C provides additional photo-to-dark conductivity ratio increasing by two orders of magnitude for growth conditions containing 20–30% GeH₄ in the gas phase (relative to the total GeH₄+SiH₄ flow).     

TEM Studies of High Temperature Corrosion Behaviour of TiAl Intermetallics with Surface Modifications

The oxidation/sulphidation behaviour of a Ti‐46.7Al‐1.9W‐0.5Si alloy with a TiAl₃ diffusion coating was studied in an environment of H₂/H₂S/H₂O at 850^oC. The kinetic results demonstrate that the TiAl₃ coating significantly increased the high temperature corrosion resistance of Ti‐46.7Al‐1.9W‐0.5Si. The SEM, EDX, XRD and TEM analysis reveals that the formation of an Al₂O₃ scale on the surface of the TiAl₃‐coated sample was responsible for the enhancement of the corroison resistance. The Ti‐46.7Al‐1.9W‐0.5Si alloy was also modified by Nb ion implantation. The Nb ion implanted and as received sampels were subjected to cyclic oxidation in an open air at 800^oC. The Nb ion implantation not only increased the oxidation resistance but also substantially improved the adhesion of scale to the substrate.     

Estimating crystallinity in high density polyethylene fibers using online Raman spectroscopy

Online Raman spectra, obtained at different points along the spin line during pilot‐scale nonisothermal melt spinning of high density polyethylene (HDPE) fibers, are presented for the first time. The fraction of the crystalline phase corresponding to each spectrum was determined from the normalized integrated intensity of the 1418 cm^?1 Raman band. It is well established that this band represents the orthorhombic crystalline phase in polyethylene. The estimates of percent crystallinity obtained from decomposition of the Raman spectrum were compared with the percent crystallinity from differential scanning calorimetry (DSC) measurements. It is concluded that online Raman spectroscopy can be successfully used to monitor the development of crystallinity in HDPE fibers as a function of distance from the spinneret. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 88: 545–549, 2003     

FIRE: fractal indexing with robust extensions for image databases

As already documented in the literature, fractal image encoding is a family of techniques that achieves a good compromise between compression and perceived quality by exploiting the self-similarities present in an image. Furthermore, because of its compactness and stability, the fractal approach can be used to produce a unique signature, thus obtaining a practical image indexing system. Since fractal-based indexing systems are able to deal with the images in compressed form, they are suitable for use with large databases. We propose a system called FIRE, which is then proven to be invariant under three classes of pixel intensity transformations and under geometrical isometries such as rotations by multiples of /spl pi//2 and reflections. This property makes the system robust with respect to a large class of image transformations that can happen in practical applications: the images can be retrieved even in the presence of illumination and/or color alterations. Additionally, the experimental results show the effectiveness of FIRE in terms of both compression and retrieval accuracy.     

Small–Capacity Modular Units. Experience in Startup and Management

A series of small–capacity units has recently been constructed in regions of oil field development and crude oil and gas condensate production to satisfy the requirements for such petroleum products as naphtha, diesel fuel, kerosene, and boiler fuel and to reduce costs for delivery of these products. There are almost no data in the technical literature, particularly in periodicals, on the construction and operation of small–capacity units. We attempt to generalize the experience of Orgeneftekhimzavody Trust in this area. We hope that this experience will be useful to specialists in the development and management of small–capacity plants.     

Application of convolutional error correcting codes in ultrawideband M-ary PPM signaling

The interference issues related to ultrawideband (UWB) radio pose tight restrictions on the maximum data rate of UWB radio telecommunication systems. A possible solution is to reduce the required signal to interference ratio (SIR) that gives satisfactory performance to the UWB system. In this letter, we propose coded M-ary UWB radio communication systems. Two classes of convolutional codes, namely, low-rate superorthogonal codes and high-rate punctured codes are considered for this purpose. Simulation results on the bit error rate of the proposed system indicates that the system is capable to work in lower SIR's and therefore supports higher data transmission rates in a real interference environment compared to the previously proposed UWB communication systems.