84.
An Ag–Al die attach material having a fixed Ag–Al nanoparticles weight percent content (80–20 %), as well as varying organic additives weight percent content was formulated. The total nanoparticle weight percent content was varied between 84.7 and 87.0 %. As the organic additives content in the Ag
80–Al
20 die attach material decreased from 15.3 to 13.0 %, the nanopaste’s viscosity increased. The die attach material was sintered at 380 °C for 30 min to form Ag
2Al and Ag
3Al compounds. With decreasing organics content from 15.3 to 13.0 %, the porosity of the post-sintered samples also decreased from 30 to 19 %, while the density increased from 2.36 to 6.42 g/cm
3. The highest melting point was recorded for the sample with the least organic weight percent content at 519 °C. The coefficient of thermal expansion and electrical conductivity values varied between 6.99–7.74 × 10
?6/ °C and 0.95–1.01 × 10
5 (ohm-cm)
?1 respectively with decreasing organic content from 15.3 to 13.0 %. The electrical conductivity values recorded were higher than or equal to that of most solder alloy die attach materials. By changing the organic additives content in the Ag
80–Al
20 die attach material, suitable properties are obtained for high temperature die attach applications.
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