Extraction of copper from aqueous solutions with carboxylic acids

The distribution equilibrium data at 25°C for the extraction of copper from aqueous solutions, containing sodium nitrate or sodium sulphate, by carboxylic acids using toluene, benzene and carbon tetrachloride as diluents have been measured. The carboxylic acids used are n-myristic, n-lauric and n-capric. The results obtained led to the conclusion that the composition of the extracted species corresponds to (CuR₂.HR)₂, being irrespective of both the nature of organic phase and the aqueous phase. The addition of sodium sulphate, instead of sodium nitrate, decreases the extraction efficiency due to the formation a CuSO₄ ion-pair into the aqueous phase. The diluent effect has been related to the activity of the dimerised carboxylic acid in the diluent.     

Performance evaluation of MADM-based methods for network selection in a multimedia wireless environment

Wireless Networks - As mobile devices have become more affordable, easy to use and powerful, the number of mobile users and their bandwidth demands have experienced a significant growth....     

Study on TSV isolation liners for a Via Last approach with the use in 3D-WLP for MEMS

This paper discusses approaches for the isolation of deep high aspect ratio through silicon vias (TSV) with respect to a Via Last approach for micro-electro-mechanical systems (MEMS). Selected TSV samples have depths in the range of 170…270 µm and a diameter of 50 µm. The investigations comprise the deposition of different layer stacks by means of subatmospheric and plasma enhanced chemical vapour deposition (PECVD) of tetraethyl orthosilicate; Si(OC₂H₅)₄ (TEOS). Moreover, an etch-back approach and the selective deposition on SiN were also included in the investigations. With respect to the Via Last approach, the contact opening at the TSV bottom by means of a specific spacer-etching method have been addressed within this paper. Step coverage values of up to 74 % were achieved for the best of those approaches. As an alternative to the SiO₂-isolation liners a polymer coating based on the CVD of Parylene F was investigated, which yields even higher step coverage in the range of 80 % at the lower TSV sidewall for a surface film thickness of about 1000 nm. Leakage current measurements were performed and values below 0.1 nA/cm² at 10 kV/cm were determined for the Parylene F films which represents a promising result for the aspired application to Via Last MEMS-TSV.     

MEMS fluxgate magnetometer for parallel robot application

An advanced real-time workspace monitoring for parallel kinematic machines including tasks like self-calibration and exception handling demands integrated sensors measuring the angular position of the robot joints. This work introduces a single-axis MEMS fluxgate magnetometer developed for the specified application. The sensor is composed of high aspect ratio helical coils with generating and sensing functions around an electrodeposited nickel–iron core featuring ferromagnetic behavior. The core is designed in racetrack geometry causing an excellent directional sensitivity of the sensor for measuring the magnetic orientation of permanent magnets which rotate on the joint shaft. This approach allows the real-time detection of the required joint angle and the simplified analytical solution of direct kinematics.