Numerical solutions of the singular integral equations in the crack analysis using the body force method

In this paper, numerical solutions of the singular integral equations of the body force method in the crack problems are discussed. The stress fields induced by two kinds of displacement discontinuity are used as fundamental solutions. Then, the problem is formulated as a hypersingular integral equation with the singularity of the form r ². In the numerical calculation, two kinds of unknown functions are approximated by the products of the fundamental density function and the Chebyshev polynomials. As examples, the stress intensity factors of the oblique edge crack, kinked crack, branched crack and zig-zag crack are analyzed. The calculation shows that the present method gives accurate results even for the extremely oblique edge crack and kinked crack with extremely short bend which has been difficult to analyze by the previous method using the approximation by the products of the fundamental density function and the stepped functions etc.     

Mechanical property changes in sapphire by nickel ion implantation and their dependence on implantation temperature

Sapphire plates, cut parallel to an {0001} plane, have been implanted with 300 keV nickel ions to doses ranging from 5×10¹² to 1×10¹⁷ Ni cm^–2 at specimen temperatures of 100, 300 and 523 K, in order to investigate the effect of implantation temperature on the mechanical property changes in sapphire caused by ion implantation. The measured changes in surface hardness, surface fracture toughness and bulk flexural strength were found to depend strongly on the implantation temperature, and were largely correlated with the residual surface compressive stress measured by using a cantilever beam technique. The surface amorphization that occurred only by the implantation at 100 K and at doses larger than 2×10s15 Ni cm^–2 reduced the hardness to 0.6 relative to the value of the unimplanted sapphire, and considerably increased the surface plasticity. Furthermore, the amorphization was found to involve a large volume expansion of 30% and to change drastically the apparent shape and size of a Knoop indentation flaw made prior to implantation. This effect was suggested to reduce stress concentrations at surface flaws and hence to increase the flexural strength.     

Shear-rate dependence of first normal stress difference of poly(isoprene-b-styrene) in solution near the order-disorder transition temperature

Viscoelastic properties of poly(isoprene-b-styrene) in dioctylphthalate under steady shear flow were measured near the order—disorder transition temperature. In ordered states, first normal stress difference N₁ is proportional to shear rate at low region, but becomes proportional to at the high region, similar to the N₁ behaviour of polymer blends undergoing shear-induced homogenization. Because the existence of microdomains was confirmed at the high region by the flow birefringence method, it is concluded that the above N₁ behaviour is not caused by shear-induced homogenization, but is probably caused by the shear-induced alignment of the microdomain structure.     

碳基钨涂层在退火过程中的组织和结构变化

用真空等离子体喷涂(VPS)技术在C／C复合材料基体上制备了厚度为0．5mm的钨(W)涂层，涂层的表面通过物理气相沉积(PVD)预沉积钨、铼(Re)多层作为碳(C)的扩散势垒。涂层经过1200℃--2000℃的电子束退火，其微观结构和化学构成发生变化。经测量涂层的再结晶温度约为1400℃，再结晶的活性能为63kJ／mol。当退火温度高于1300℃时，涂层表面的多层W、Re结构将由于W、Re和C之间的相互扩散而发生改变，并在1600℃以上退火lh后由于脆性碳化钨在界面的形成而完全失效，碳化钨层的厚度将随着退火漏度的升高和退火时间的延长而迅速增加。     

Cylindrical coils created with 3D X-ray lithography and metallization

The demand for microactuators is increasing recently. The key technology to realizing practical microactuators is microfabrication process. In the production of microminiature components, the technologies for processing high-aspect-ratio structures are essential. As one of these technologies, the LIGA process is widely known. Our laboratory researches the LIGA process to three-dimensional microfabrication and established the cylindrical-microcoil production process. In this paper, we have fabricated the cylindrical-microcoil for the solenoidal electromagnetic type microactuator. We designed and analyzed microactuators, and fabricated and evaluated microactuator coils produced by the combination of three-dimensional X-ray lithography and level copper plating. We succeeded in creating threaded groove-shaped structures with 10 μm line width, 20 μm pitch, and aspect ratio of 5 on the surface of an acrylic pipe by means of three-dimensional X-ray lithography. As a measure to suppress void generation, which is one of the shortcomings of electrolytic plating processes, the sputtering apparatus and plating equipment were improved, a pretreatment process was additionally provided, and the actual electrolytic plating method was improved. As a result, a void-free metallic deposit could be formed on a thin coil line. The processing technology enables the formation of thin-wire coil lines whose current paths feature a large allowable current-carrying capacity, enabling the production of miniature, high-output microactuators.     

Fabrication of large area diffraction grating using LIGA process

X-ray imaging is a very important technology in the fields of medical, biological, inspection, material science, etc. However, it is not enough to get the clear X-ray imaging with low absorbance. We have produced a diffraction gratings for obtaining high resolution X-ray phase imaging, such as X-ray Talbot interferometer. In this X-ray Talbot interferometer, diffraction gratings were required to have a fine, high accuracy, high aspect ratio structure. Then, we succeeded to fabricate a high aspect ratio diffraction grating with a pitch of 8 μm and small area using a deep X-ray lithography technique. We discuss that the diffraction gratings having a narrow pitch and an large effective area to obtain imaging size of practical use in medical application. If the pitch of diffraction gratings were narrow, it is expected high resolution imaging for X-ray Talbot interferometer. We succeeded and fabricated the diffraction grating with pitch of 5.3 μm, Au height of 28 μm and an effective area of 60 × 60 mm².     

Gap symmetry and intrinsic intraplane pinning of untwinned YBa2Cu3O7 single crystals

The interplane (cb) and intraplane (ab) anisotropy of untwinned YBa₂ Cu₃0₇ single crystals has been investigated by means of the torque magnetometry. To extract the reversible and irreversible components, the torque was measured as a function of increasing angle as well as decreasing angle. The interplane irreversible torque _irr shows two-fold peaks at _c =90 ° and270 ° (of half width11 ° at77 K) due to the well-known intrinsic interplane pinning. A novel intrinsic pinning has been discovered in the intraplane irreversible torque, i.e., _irr shows four-fold peaks of half width20° at77 K when _a =0 °, 90 °, 180 ° and270 °. We argue that the intrinsic intraplane pinning comes from the four-fold nature of the gap parameter.     

Fabrication of high hardness Ni mold with electroless nickel–boron thin layer

The nickel electroforming method using a high-concentration nickel sulfamate bath is commonly used to fabricate micro metal molds in the LIGA process; however, this method does not produce micro metal molds of sufficient hardness. One means of improving the hardness of micro metal molds made using the nickel electroforming method is to include additives in the nickel plating solution. Another method is nickel alloy plating or a similar technique. In this research, we used a nickel–boron (Ni–B) electroless alloy plating method to obtain a hard nickel plated film having hardness of 832 Hv. It was also ascertained that Ni–B electroless alloy plated film retains its high hardness even during heat treatment in conditions of 250°C for 1 h. To deal with the high stresses developed in high-hardness plated films, we proposed double-layer nickel electroforming. This method is covered and used on conventional nickel electroforming layer by high hardness micro mold. High hardness micro metal mold using double-layer was fabricated by nickel electroforming and Ni–B electroless alloy plating method.     

Preparation of ferroelectric Ba(Ti/sub 0.85/Sn/sub 0.15/)O/sub 3/ thin films by metal-organic decomposition

Ferroelectric Ba(Ti/sub 0.85/Sn/sub 0.15/)O/sub 3/ (BTS/sub 15/) thin film is newly prepared on the Pt/Ti/SiO/sub 2//Si substrate by metal-organic decomposition. The firing condition is determined by thermogravimetric and differential thermal analysis. The BTS/sub 15/ thin film with a flat surface and uniform thickness is obtained by spin coating in N/sub 2/ atmosphere that avoids moisture. The BTS/sub 15/ film has a perovskite phase and a preferential [110] texture. It is also found that the crystalline structure is cubic at 24/spl deg/C with a lattice constant of 4.01 /spl Aring/, and a grain size of about 30 nm was estimated by Scherrer equation and SEM image. From P-E hysteresis loop at 20/spl deg/C, the polarization at E=0 and the electric field at P=0 are found to be 1.07 /spl mu/C/cm/sup 2/ and 24.0 kV/cm, respectively. It is observed that the dielectric constant decreases monotonously from about 830 to 630 with increasing temperature ranging from 20/spl deg/C to 50/spl deg/C. Finally, it is found that the BTS/sub 15/ thin film shows a sufficient ferroelectricity and is an attractive material for functional ferroelectric devices, such as thermal-type infrared sensors.