Heuristic Solution to the Diffraction Problem on a Superconducting Half-Plane

Journal of Communications Technology and Electronics - Abstract—The article presents a rigorous numerical solution, using the Wiener–Hopf method, to the problem of plane wave...     

Anomaly-Based Intrusion Detection System in RPL by Applying Stochastic and Evolutionary Game Models over IoT Environment

Wireless Personal Communications - The rapid development of Information and Communication Technology and the growing number of devices connected to the Internet make the Internet of Things (IoT) as...     

Multilevel Recording in Ge2Sb2Te5 Thin Films

Semiconductors - The current–voltage characteristics measured on Ge2Sb2Te5 thin films in the current mode are studied. The effect of multilevel recording is established when applying...     

Optimal Placement of Dampers on Multistorey Frames Using Dynamic Analysis

Strength of Materials - The use of a damping system is one of the seismic protection systems that improve the seismic response of structures. The proposed methodology estimates the location (which...     

Effect of the Porous Skeletal Iron Structure on the Infiltration of Aluminum Melts

Powder Metallurgy and Metal Ceramics - The infiltration of aluminum melts into porous metal skeletons produced by powder metallurgy methods, including 3D printing, under a pressure gradient was...     

A review on ultrasonic spot welding of copper alloys

As a solid state joining process, ultrasonic spot welding has been proven to be a promising technique for joining copper alloys. However, challenges still remain in employing ultrasonic spot welding to join copper alloys. This article comprehensively reviews the current state of ultrasonic spot welding of copper alloys with a number of critical issues including materials flow, plastic deformation, temperature distribution, vibration, relative motion, vertical displacement, interface friction coefficient, online monitoring technique, coupled with the macrostructure and microstructure, the mechanical properties and electrical conductivity. In addition, the future trends in this field are provided.