Run-to-run control of inductively coupled C2F6 plasma etching of SiO2: Construction of a numerical process with a computational fluid dynamics code

A numerical process to simulate SiO₂ dry etching with inductively coupled C₂F₆ plasmas has been constructed using a commercial CFD code as a first step to design a run-to-run control system. The simulator was found to reasonably predict the reactive ion etching behavior of C₂F₆ plasmas and used to investigate the effects of plasma operating variables on the etch rate and uniformity. The relationship between the operating variables and the etching characteristics was mathematically modeled through linear regression for future run-to-run control system design.     

Preparation of bao-pbo-nd2o3-tio2 powders by hydrothermal synthesis

Homogeneous and nano-sized BPNT [(Ba_1-xPb_x)Nd₂Ti₅O₁₄] powders were prepared under various hydrothermal conditions. Crystallinity and homogeneity of the synthetic powders were investigated. The microwave dielectric properties of the filters prepared with hydrothermal powders were compared with those of the filters prepared with conventional powders. The microwave dielectric properties of the filter prepared with the hydrothermal powders were also better than those of the filter manufactured with the conventional powders. The dielectric constant, quality constant and temperature coefficient of resonance frequency of hydrothermally prepared filter under optimum condition and measured at 3.5 GHz around were about 93, 6067 and 0 ppm/°C, respectively.     

A procedural framework for dynamic changes of human interactions in knowledge intensive services

The knowledge intensive service processes should be managed in a human-oriented way since humans who naturally undertake complex operations of an intellectual nature in the processes are the most valuable resources. The most fundamental nature of human work is collaborative and dynamic. Humans interact and communicate with each other to accomplish their jobs in the process. To help them to work together, a strong representation of the process should be provided to facilitate them to clearly understand who they should interact with and what activities need to be performed. For the clear representation, Human Interaction Management (HIM), which has been suggested to comprehensively support human work, adopts a role-based approach to process modeling. It, however, tends to hide elements of interactions although the collaborative human interaction is one of the most fundamental nature of human work. To remedy this problem, a state-driven modeling approach to human interactions was presented. It clearly visualizes the interactions so that humans can be guided through it. However, they do not just follow the previously defined sequence of activities, but continuously work out how they are going to proceed from now on according to the state of things they encounter throughout the life of the work. To fully support the dynamic nature of human work, human interactions should be flexibly managed. Therefore, this paper presents a framework for the flexible management of human interactions. The framework provides a capability to flexibly manage the interactions in a decentralized way by allowing interaction participants to dynamically change the involved interaction based on the continuous negotiation of how to achieve the ultimate goal of the interaction. It will be a basis for realization of decentralized management of human interactions in knowledge intensive service processes.     

Development of environmentally responsive hydrogels with metal affinity behavior

This work describes initial efforts to incorporate affinity ligands within an environmentally responsive hydrogel. Metal affinity ligands were chosen as model affinity groups and thermally responsive N‐isopropyl acrylamide/acrylamide copolymers were used as the base hydrogels. The ? NH₂ group of the acrylamide serves as a reactive group for functionalization with metal affinity ligands. The gels were synthesized by free radical polymerization and Cu²⁺ was bound to the gel via 1,4‐butanediol diglycidyl ether (BDE) as a linker and iminodiacetic acid (IDA) as a chelating ligand. The base acrylamide gels were also functionalized with metal affinity ligands to allow for comparison with thermally responsive affinity gels. The results show the effectiveness of this technique for both these types of gels, and an improved method to immobilize metal affinity groups on to thermally sensitive N‐isopropyl acrylamide gels was also developed. It was seen that the yields for the reaction with BDE decreased with increased reaction time in both kinds of gels, whereas reaction with IDA showed a decrease in yields with increase in temperature for N‐isoporpyl acrylamide gels and increase in yields for acrylamide gels. Further techniques were developed to overcome diffusional resistances and stresses in the thermally responsive N‐isopropyl acrylamide gels so as to improve the distribution of Cu²⁺ ions. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007     

Nondestructive sensing evaluation of surface modified single-carbon fiber reinforced epoxy composites by electrical resistivity measurement

Nondestructive sensing of a single-carbon fiber reinforced epoxy composites was evaluated by the measurement of electrical resistivity under reversible cyclic loading. For the strain–stress sensing, the strain up to the maximum load of a bare carbon fiber itself is larger than that of carbon fiber composite. As curing temperature increased, apparent modulus up to the maximum load increased and the elapsed time became shorter. Higher residual stress might contribute to the improved interfacial adhesion. The strain up to the maximum load at low temperature was larger than that at higher temperature. The strain of electrodeposition (ED) treated carbon fiber was smaller than that of the untreated carbon fiber composite until the maximum load reached. This could be due to higher apparent modulus of composite based on the improved interfacial shear strength (IFSS). Since the electrical resistivity was responded well quantitatively with various parameters, such as matrix modulus, the fiber surface modification, the electrical resistivity measurement can be a feasible method of nondestructive sensing evaluation for conductive fiber reinforced composites inherently.     

Challenges of Raman Amplification

Raman amplifiers are often regarded as a typical example of technologies rapidly developed in the midst of turmoil created by the so-called wavelength division multiplexing (WDM) bubble. Indeed, Raman amplifiers turned out to be technically very attractive in all the aspects of capacity, reach, and bit rate. Even though Raman amplifiers are actually being deployed into systems in commercial service, the practical issues, such as cost, reliability and safety, are yet to be further discussed, particularly for the configuration of distributed amplification. After summarizing the advantages of Raman amplification and reviewing pump laser technologies, this paper will highlight ongoing efforts on practical issues, which include reliability and safety issues of fiber under high-power operations. Finally, it is concluded that by overcoming the above-mentioned practical issues, Raman amplification will stay as a key technology for future optical communications because of its compelling unique advantages.     

Optoelectronic and microwave transmission characteristics of indium solder bumps for low-temperature flip-chip applications

This paper describes low-temperature flip-chip bonding for both optical interconnect and microwave applications. Vertical-cavity surface-emitting laser (VCSEL) arrays were flip-chip bonded onto a fused silica substrate to investigate the optoelectronic characteristics. To achieve low-temperature flip-chip bonding, indium solder bumps were used, which had a low melting temperature of 156.7/spl deg/C. The current-voltage (I-V) and light-current (L-I) characteristics of the flip-chip bonded VCSEL arrays were improved by Ag coating on the indium bump. The I-V and L-I curves indicate that optical and electrical performances of Ag-coated indium bumps are superior to those of uncoated indium solder bumps. The microwave characteristics of the solder bumps were investigated by using a flip-chip-bonded coplanar waveguide (CPW) structure and by measuring the scattering parameter with an on-wafer probe station for the frequency range up to 40 GHz. The indium solder bumps, either with or without the Ag coating, provided good microwave characteristics and retained the original characteristic of the CPW signal lines without degradation of the insertion and return losses by the solder bumps.     

Parallel optical transmitter module using angled fibers and a V-grooved silicon optical bench for VCSEL array

We propose an advanced structure of optical subassembly (OSA) for packaging of the vertical-cavity surface-emitting laser (VCSEL) array, using (111) facet mirror of the V-groove ends formed in a silicon optical bench (SiOB) and angled fiber apertures. The feature of our OSA can provide a low optical crosstalk between neighboring channels, a low feedback reflection, and a large misalignment tolerance along the V-groove. We describe the optimized design of fiber angle, VCSEL position, and fiber position. The fabricated OSA structure consists of 12 channels of angled fiber array, 54.7/spl deg/ V-grooves, Au-coated mirrors on (111) end facet of the V-grooves, and flip-chip-bonded VCSEL array on a SiOB. In this structure, the beam emitted from the VCSEL is deflected at the 54.7/spl deg/ mirror of (111) end facet and propagated into the angled fiber. The angled fiber array was polished by 57/spl deg/. Fabricated OSAs showed a coupling efficiency of 30%-50% that is 25 times larger than that obtained from an OSA with a vertically flat fiber array. Our OSA showed large misalignment tolerance of about 90 /spl mu/m along the longitudinal direction in the V-groove. We fabricated a parallel optical transmitter module using the OSA and demonstrated 12 channels /spl times/2.5 Gb/s data transmission with a clear eye diagram.     

Dielectric characteristics of Pb(Zn<Subscript>1/3</Subscript>Ta<Subscript>2/3</Subscript>)O<Subscript>3</Subscript>-BaTiO<Subscript>3</Subscript> ceramics with/without PbTiO<Subscript>3</Subscript> modification

Stabilization tendencies of the perovskite structure in a Pb(Zn_1/3Ta_2/3)O₃-BaTiO₃ pseudobinary system with/without compositional modification by 20 mol% PbTiO₃ introduction were compared. In order to promote perovskite phase formation, the B-site precursor method (which is conceptually similar to the columbite process) was employed in this study. Dielectric properties of sintered samples were investigated as functions of composition and measurement frequency. Dielectric constant spectra, in the paraelectric temperature region, were further analyzed in terms of diffuseness. Microstructures of sintered specimens were also investigated and correlated with perovskite stabilization.