Enhanced thermal stability of a sputtered titanium-nitride film as a diffusion barrier for capacitor-bottom electrodes

The effect of a thin RuO_x layer formed on the Ru/TiN/doped poly-Si/Si stack structure was compared with that on the RuO_x/TiN/doped poly-Si/Si stack structure over the post-deposition annealing temperature ranges of 450–600°C. The Ru/TiN/poly-Si/Si contact system exhibited linear behavior at forward bias with a small increase in the total resistance up to 600°C. The RuO_x/TiN/poly-Si/Si contact system exhibited nonlinear characteristics under forward bias at 450°C, which is attributed to no formation of a thin RuO_x layer at the RuO_x surface and porous-amorphous microstructure. In the former case, the addition of oxygen at the surface layer of the Ru film by pre-annealing leads to the formation of a thin RuO_x layer and chemically strong Ru-O bonds. This results from the retardation of oxygen diffusion caused by the discontinuity of diffusion paths. In particular, the RuO_x layer in a nonstoichiometric state is changed to the RuO₂-crystalline phase in a stoichiometric state after post-deposition annealing; this phase can act as an oxygen-capture layer. Therefore, it appears that the electrical properties of the Ru/TiN/poly-Si/Si contact system are better than those of the RuO_x/TiN/poly-Si/Si contact system.     

Over GHz electrical circuit model of a high-density multiple line grid array (MLGA) interposer

The multiple line grid array (MLGA) interposer was recently introduced as a future high-density high-speed bonding method. In this paper, we introduce an electrical model and high-frequency characteristics of the MLGA interposer. The high-frequency electrical model was extracted from microwave S-parameter measurements up to 20 GHz as well as from fundamental microwave network analysis. For the parameter fitting process during model extraction, an optimization method was used. Several different types of MLGA interposers were designed, assembled and tested. The test vehicles contained coplanar waveguides, probing pads and an MLGA interposer structure. The height of the MLGA, the conductor shape inside the MLGA, and the dielectric insulator of the MLGA were varied. From the model, an MLGA with a height of 0.4 mm and a polymer dielectric insulator was found to have 203 pH of self inductance, 49 pH of mutual inductance with the nearest ground conductor line, and 186 fF of mutual capacitance. By reducing the height of the MLGA and by using an insulator with a lower dielectric constant, parasitic inductance and capacitance is further reduced. TDR/TDT simulation and measurement showed the validity of the extracted model parameters of the MLGA interposer. Circuit simulation based on the extracted model revealed that the MLGA interposer could be successfully used for microwave device packages up to 20 GHz and for high-speed digital device packages with a clock cycle up to 5 GHz.     

Reconstruction of conductivity and current density images using only one component of magnetic field measurements

Magnetic resonance current density imaging (MRCDI) is to provide current density images of a subject using a magnetic resonance imaging (MRI) scanner with a current injection apparatus. The injection current generates a magnetic field that we can measure from MR phase images. We obtain internal current density images from the measured magnetic flux densities via Ampere's law. However, we must rotate the subject to acquire all of the three components of the induced magnetic flux density. This subject rotation is impractical in clinical MRI scanners when the subject is a human body. In this paper, we propose a way to eliminate the requirement of subject rotation by careful mathematical analysis of the MRCDI problem. In our new MRCDI technique, we need to measure only one component of the induced magnetic flux density and reconstruct both cross-sectional conductivity and current density images without any subject rotation.     

A fiber depolarizer using polarization beam splitter loop structure for narrow linewidth light source

A new fiber depolarizer employing a polarization beam splitter loop structure is proposed and demonstrated. The depolarizer is devised for broad-band operation and the depolarization of narrow linewidth light source without any help of polarization controllers or Faraday rotator mirrors. A polarizing method is developed that shows good performance without polarization control unit. Therefore, the proposed depolarizer can be cost-effective and easily configured. From experiments, low output degree of polarization less than 10% is obtained for a narrow linewidth light source.     

A Structurable Gel‐Polymer Electrolyte for Sodium Ion Batteries

In this work, a structurable gel‐polymer electrolyte (SGPE) with a controllable pore structure that is not destroyed after immersion in an electrolyte is produced via a simple nonsolvent induced phase separation (NIPS) method. This study investigates how the regulation of the nonsolvent content affects the evolving nanomorphology of the composite separators and overcomes the drawbacks of conventional separators, such as glass fiber (GF), which has been widely used in sodium ion batteries (SIBs), through the regulation of pore size and gel‐polymer position. The interfacial resistance is reduced through selective positioning of a poly(vinylidene fluoride‐co‐hexa fluoropropylene) (PVdF‐HFP) gel‐polymer with the aid of NIPS, which in turn enhances the compatibility between the electrolyte and electrode. In addition, the highly porous morphology of the GF/SGPE obtained via NIPS allows for the absorption of more liquid electrolyte. Thus, a greatly improved cell performance of the SIBs is observed when a tailored SGPE is incorporated into the GF separator through charge/discharge testing compared with the performance observed with pristine GF and conventional GF coated with PVdF‐HFP gel‐polymer.     

Effects of isothermal aging and temperature–humidity treatment of substrate on joint reliability of Sn–3.0Ag–0.5Cu/OSP-finished Cu CSP solder joint

This study examined the effects of isothermal aging and temperature–humidity (TH) treatment of substrate on the joint reliability of a Sn–3.0Ag–0.5Cu (wt.%)/organic solderability preservative (OSP)-finished Cu solder joint. Two types of OSP-finished chip-scale-package (CSP) substrates were used, those subjected and not subjected to the TH test. This study revealed an association between the interfacial reaction behaviors, void formation and mechanical reliability of the solder joint. Many voids were formed at the interface of the OSP-finished Cu joint subjected to the TH test. These voids were caused by the oxidation of the OSP-finished Cu substrate during the TH test. In the shear tests, the shear force of the joint with the substrate not subjected to the TH test was slightly higher than that with the TH test. The mechanical reliability of the solder joint was degraded by voids at the interface.