Catalyst-free formation of vertically-aligned carbon nanorods as induced by nitrogen incorporation

We found that nitrogen incorporation can induce the formation of vertically-aligned hydrogenated carbon nanorods without the use of catalysts. These nitrogen incorporated hydrogenated carbon nanorods (CN_x:H) were synthesized by radio-frequency plasma-enhanced chemical vapor deposition (PE-CVD). We have evaluated the structural and chemical evolution of these CN_x:H films as a function of the deposition duration by using high-resolution scanning electron microscopy (HRSEM), high-resolution transmission electron microscopy (HRTEM), Fourier transform infrared spectroscopy (FTIR), and Auger electron spectroscopy. Results indicate that the incorporation of nitrogen is responsible to the formation of these nanorods. The alignment of the nanorods is enhanced at longer deposition period and is correlated to the increase in nitrogen contents and isonitrile bonds [–NC] in the nanorods. The growth mechanism of this catalyst-free formation of nitrogen incorporated carbon nanorods is proposed.     

Accelerating number theoretic transform in GPU platform for fully homomorphic encryption

The Journal of Supercomputing - In scientific computing and cryptography, there are many applications that involve large integer multiplication, which is a time-consuming operation. To reduce the...     

An effective analytical model of selective laser melting

Selective Laser Melting (SLM) is a laser-based powder bed Additive Manufacturing process that can produce near net shape products with metallic powders according to Computer-Aided Design models. In this paper, a useful analytical model of SLM is proposed by investigating the energy requirement of the process. Results from the experiments on SLM of pure nickel and pure tin are reported. By compiling process parameter data from various literatures and experiments, this model has shown to enable predictions of the energy input required to process different metallic materials to an order of magnitude despite the many assumptions made. Possible explanations for the deviation in predictions and actual energy inputs are also discussed.     

Wear characteristics of titanium alloy Ti54 for cryogenic sliding applications

Cryogenic wear behaviour of Ti-5Al-4V-0.6Mo-0.4Fe (Ti54) alloy sliding against tungsten carbide is investigated at different speeds, loads and distances. Empirical models based RSM are developed to predict wear characteristics of Ti54 alloy as a function of sliding conditions. It is found that experimental and predicted results are in good agreement. Besides, cryogenic wear is substantially lower than dry wear. SEM and EDS analyses of worn surfaces and wear debris reveal that cryogenic sliding is significantly influenced by changing material properties along with boundary lubrication performance. The study has shown that modes in dry sliding are adhesion and delamination whereas in cryogenic sliding they are abrasion and delamination.     

Thermal properties of tropical wood–polymer composites

Wood–polymer composites (WPC) of Geronggang (GE; Cratoxylon arborescens), a light tropical hardwood, impregnated with methyl methacrylate (MMA), styrene-co-acrylonitrile (3: 2; STAN), methyl methacrylate-co-bis (2-chloroethyl) vinyl phosphonate (3 : 1; MVP) and methyl methacrylate-co-bis (chloropropyl)-2-propene phosphonate (3:1;MPP), were prepared by in situ polymerization using γ-radiation or catalyst-heat treatment. Thermal characterization of these WPC by limiting oxygen index measurements (LOI), thermogravimetry (TG), and differential scanning calorimetry (DSC) showed that the impregnants greatly modified the wood properties. The LOI values of the GE–MVP and GE–MPP composites were much higher than that for GE and the other composites, indicating the effectiveness of the phosphonates as flame retardants. Concomitantly, the flaming characteristics also compared favorably against that for GE and the other composites. The decomposition temperature and maximum rate of weight loss determined by TG for GE–MVP and GE–MPP were substantially reduced, whereas the char yields were greatly higher. These observations again indicate that phosphonates imparted flame-retarding properties to their composites. The thermal properties of GE–MMA and GE–STAN composites were not vastly different from that of untreated GE. Flame retardancy in the phosphonate-containing composites was effected through both the condensed- and gaseous-phase mechanisms due to the presence of phosphorus and chlorine, respectively. Indication of grafting of polymer to wood was found for GE–STAN, GE–MVP, and GE–MPP composites, but not for GE–MMA. Composites prepared by γ-radiation or by the catalyst-heat treatment had similar thermal characteristics.     

Solving Hierarchical Constraints over Finite Domains with Local Search

Many real world problems have requirements and constraints which conflict with each other. One approach for dealing with such over-constrained problems is with constraint hierarchies. In the constraint hierarchy framework, constraints are classified into ranks, and appropriate solutions are selected using a comparator which takes into account the constraints and their ranks. In this paper, we present a local search solution to solving hierarchical constraint problems over finite domains (HCPs). This is an extension of local search for over-constrained integer programs WSAT(OIP) to constraint hierarchies and general finite domain constraints. The motivation for this work arose from solving large airport gate allocation problems. We show how gate allocation problems can be formulated as HCPs using typical gate allocation constraints. Using the gate allocation benchmarks, we investigate how constraint heirarchy selection strategies and the problem formulation using two models: a 0–1 linear constraint hierarchy model and a nonlinear finite domain constraint hierarchy model.     

Cyber–Physical Production Systems for Data-Driven,Decentralized, and Secure Manufacturing—A Perspective

With the concepts of Industry 4.0 and smart manufacturing gaining popularity, there is a growing notion that conventional manufacturing will witness a transition toward a new paradigm, targeting innovation, automation, better response to customer needs, and intelligent systems. Within this context, this review focuses on the concept of cyber–physical production system (CPPS) and presents a holistic perspective on the role of the CPPS in three key and essential drivers of this transformation: data-driven manufacturing, decentralized manufacturing, and integrated blockchains for data security. The paper aims to connect these three aspects of smart manufacturing and proposes that through the application of data-driven modeling, CPPS will aid in transforming manufacturing to become more intuitive and automated. In turn, automated manufacturing will pave the way for the decentralization of manufacturing. Layering blockchain technologies on top of CPPS will ensure the reliability and security of data sharing and integration across decentralized systems. Each of these claims is supported by relevant case studies recently published in the literature and from the industry; a brief on existing challenges and the way forward is also provided.     

高压单边器件的衬底电流再次升高和相关的热载流子注入效应

基于泊松方程和幸运电子模型,推出了适用于高压n型器件衬底电流(ISUB)的公式,并且为模拟和实验测量的结果所验证.普通n型低压器件的热载流子注入(HCI)效应和ISUB相关.因此,ISUB特征曲线的解释理论和基于理论的正确公式表述对于确保器件设计的可靠性尤为重要.高压器件的ISUB随栅极电压变化在峰值后再次升高.然而在普通低压器件的经典特征曲线中,ISUB仅呈现一个峰.高压器件的ISUB再次升高及其相关的可靠性问题成为新的研究热点.最广为接受的理论(Kirk effect)认为,ISUB再次升高是因为栅控沟道内的经典强电场区移动到沟道外n+漏极的边缘.本文与之不同,认为高压器件ISUB的再次升高并非因为经典强电场区的移动,而是因为在n+漏极边缘出现独立的强电场区,和经典强电场区同时并存,这就是双强电场模型.该双强电场模型仅有经典强电场的ISUB方程不适用于高压器件,新的ISUB方程也由此双强电场模型推导出来,公式与实验结果吻合.进一步地,双强电场模型引进了空穴在氧化层的陷落机制,解释了高压器件的热载流子注入效应.     

Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications

For thin-profile fine-pitch BGA (TFBGA) packages, board level solder joint reliability during the thermal cycling test is a critical issue. In this paper, both global and local parametric 3D FEA fatigue models are established for TFBGA on board with considerations of detailed pad design, realistic shape of solder joint, and nonlinear material properties. They have the capability to predict the fatigue life of solder joint during the thermal cycling test within ±13% error. The fatigue model applied is based on a modified Darveaux’s approach with nonlinear viscoplastic analysis of solder joints. A solder joint damage model is used to establish a connection between the strain energy density (SED) per cycle obtained from the FEA model and the actual characteristic life during the thermal cycling test. For the test vehicles studied, the maximum SED is observed at the top corner of outermost diagonal solder ball. The modeling predicted fatigue life is first correlated to the thermal cycling test results using modified correlation constants, curve-fitted from in-house BGA thermal cycling test data. Subsequently, design analysis is performed to study the effects of 14 key package dimensions, material properties, and thermal cycling test condition. In general, smaller die size, higher solder ball standoff, smaller maximum solder ball diameter, bigger solder mask opening, thinner board, higher mold compound CTE, smaller thermal cycling temperature range, and depopulated array type of ball layout pattern contribute to longer fatigue life.