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11.
基于阴极爆炸发射电子和电子对气体的碰撞电离模型 ,用胞中粒子 (PIC)模拟方法对单间隙冷阴极气体放电过程中阴极爆炸发射产生的电子和电子碰撞电离产生质子的动力学特性进行了研究。分别给出了在 1.33× 10 - 2 Pa氢气压和 10kV间隙电压下 ,气体放电过程中电子和质子的空间和相空间分布、速度统计分布以及轴线上电荷密度分布 ,分析了阴极爆炸发射电子电离过程。模拟结果表明 ,间隙中电子的最大速度达 5 .8× 10 7m/s ,而只有少数的气体电离产生的质子最大速度达到 1.3× 10 6 m/s。 相似文献
12.
A novel body-tied silicon-on-insulator(SOI) n-channel metal-oxide-semiconductor field-effect transistor with grounded body electrode named GBSOI nMOSFET has been developed by wafer bonding and etch-back technology. It has no floating body effect such as kink phenomena on the drain current curves, single-transistor latch and drain current overshoot inherent in a normal SOI device with floating body. We have characterized the interface trap density, kink phenomena on the drain current (IDS-VDS) curves, substrate resistance effect on the IDS-VDS curves, subthreshold current characteristics and single transistor latch of these transistors. We have confirmed that the GBSOI structure is suitable for high-speed and low-voltage VLSI circuits. 相似文献
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The modified direct observation method is employed for the determination of the liquidus lines in the (Hg1_xZnx)1_yTey, ternary system. The liquidus temperatures of the ternary samples of various compositions withx from 0.05 to 0.30 andy from 0.5 to 0.9 are measured. The temperature-composition phase diagrams and some liquidus isotherms are established for
this system. 相似文献
15.
ODLC是当今用户接入网的新型设备,它一方面可取代端局,解决通信线路紧张和远距离大容量放号问题,另一方面也可满足日益增多的增值业务的需求。本文ODLC技术的基本原理,结合目前国内外常见ODLC系统,总结和对比了其基本特点,优势,并指明ODLC的技术发展方向和中国应用的前景。 相似文献
16.
On-line diagnosis of the machining operations is essential because it can prevent potential problems caused by abnormal conditions. So far, little research has been done for the on-line diagnosis of tapping operations. However, tapping is a very important machining operation. And the on-line diagnosis is essential. In this work, an artificial neural network was utilized for the diagnosis of the tapping operation. The input vector for the neural network is obtained by processing the signals of the thrust, torque, and lateral forces during the tapping operations. A total of ten indices were used in the input layer of the network. The output of the artificial neural network provides the tapping states. Five different tapping states were investigated: normal operation, tap wear, misalignment, oversize hole, and undersize hole. The weights and thresholds of the artificial neural network can be modified by the generalized delta rule. Experimental results showed that diagnosis of tapping operations through an artificial neural network can reach a success rate of over 95%. 相似文献
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Herein a novel Dyadic Green's Function (DGF) is presented to calculate the field in ElectroMagnetic Compatibility (EMC) chamber. Due to the difficulty of simulating the whole chamber environment, the analysis combines the DGF formulation and the FEM method, with the latter deals with the reflection from absorbers. With DGF formulation for infinite periodic array structures, this paper investigates electromagnetic field in chamber with truncated arrays. The reflection from the absorber serves as the virtual source contributing to the total field. Hence the whole chamber field calculation can be separated from the work of absorber model set-up. Practically the field homogeneity test and Normal Site Attenuation (NSA) test are carried out to evaluate the chamber performance. Based on the method in this paper, the simulation results agree well with the test, and predict successfully the victim frequency points of the chamber. 相似文献
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Supply chain management has offered a way to improve the industrial environment becomes more competitive. While, the commonly seen methodologies may be effective in solving the production–distribution problem only from supplier- or customer-oriented consideration, those cannot present the interactive relationship between upstream and downstream enterprises. In the competitive semiconductor industry environment, considering the viewpoints of the supplier and consumer simultaneously is particularly required, because multiple manufacturing and demanding steps are performed at separate situations, concurrently. In this paper, we propose an interaction-oriented approach, which bases on the analytic hierarchy process (AHP) methodology and proportional rule, to solve the semiconductor distribution problem with multiple quantitative and qualitative criteria. The developed approach gives an expected satisfaction for the all participators of the whole chain while the cooperative information is shared perfectly and effectively. Analysis results demonstrate the proposed methodology is efficient and effective through a real world case study. 相似文献