LF6铝合金的超塑性／扩散连接组合工艺试验及理论研究EI

本文研究了ＬＦ６铝合金的超塑性／扩散连接组合工艺，用变形和再结晶的方法细化晶粒，成功地进行了ＳＰＦ／ＤＢ工艺试验，利用电子探针观察了扩散连接接头的界面微观区域，并从机理上分析了金属的超塑性／扩散连接两种工艺之间的内部联系及其金属学行为。     

Process and design analysis for ultrafine-pitched wiresweep elimination in advanced copper heat spreader BGA package

The semiconductor device trend for increasing functionalities and performances yet with smaller overall feature sizes presents escalating obstacles to the decreasing form factor along with demanding thermal carrying capability required at the package level. To confront this compounding issue, ultrafine-pitch wirebond interconnect coupled with thermally enhanced copper heat spreader attached to the package are introduced. However, the additional copper heat spreader thickness introduced within the package challenges the design of the package's wire, its loop height, and the molding process control to prevent wire sweeping occurrences. This study investigates the impact of different ultrafine pitched wire types, wire loop designs, copper heat spreader structures, and mold material types on eliminating device short from occurring due to the wire sweeping phenomena. A full factorial experiment is performed using an active silicon device packaged in a thermally enhanced ball grid array (BGA) test vehicle. In addition, test characterization is carried out using x-ray and multiinsertions hot/cold continuity tests. Then, a detailed failure analysis is performed by package decapsulation and scanning electron microscopy/energy-dispersive x-ray (SEM/EDX) to confirm the experimental findings. In conclusion, the study finds that for an ultrafine-pitched thermally enhanced BGA package, wire type is insignificant to reduce wire shorting occurrences. However, mold material and copper heat spreader structure using an optimized wire loop design are significant factors in eliminating wiresweep shorting phenomena. This study concludes with a wirebond interconnect and heat slug design recommended along with an improved process parameters and assembly material sets found from the experiment.     

破片式战斗部优化设计技术研究

侧重研究了破片式战斗部装药外形的优化设计技术。提出了装药外形与破片飞散特性（如破片飞散角，分布带宽等）之间的数学描述；建立了圆弧和对数螺线装药外形母线与战斗部其他设计参数间的数学模型。在假定约束条件下，优化设计了破片了聚焦式战斗部的结构参数；静爆试验结果表明，破片分布与理论计算吻合较好。     

加强电炉钢短流程生产工艺研究与技术开发的建议

论述了加强电炉钢短流程生产工艺研究与技术开发的必要性和主要课题，并提出关于组织合金钢短流程生产工艺研究与技术开发“九五”国家科技攻关及提高高研究开发投资强度的建议。     

MX345芯片及单片机控制

MX345芯片用于产生模拟信令—CTCSS单音.本文在介绍MX345编码/解码器工作原理的基础上,设计出MX345芯片与单片机的接口电路.最后给出控制软件.     

Crystallite growth characteristics in superfine zirconia powders and compacts

Crystallite growth characteristics of coprecipitated superfine zirconia powders have been investigated. It was found that the crystallite growth in powders follows a cubic law at 800 and 1000°C; however, the crystallite size data for compacts of both Y-TZP and YSZ cannot be fitted with a traditional parabolic or cubic law, but with a linear relation between crystallite size and the logarithm of time. In addition, it was also found that the degree of agglomeration of the powders can affect the crystallite growth.     

高度有序多孔氧化铝模板的制备工艺与生长机制的研究

采用二次氧化法制备出高度有序的多孔氧化铝模板，结合扫描电镜和原子力显微镜对其结构、形貌进行观察和表征。研究了铝箔预处理和温度等对多孔氧化铝模板孔洞有序性的影响，讨论了有序孔洞的自组织生长机理。     

基于遗传算法的工作辊温度场参数优化模型

针对热连轧机工作辊热辊形计算中温度场模型的热交换等参数难以确定的问题 ,建立了基于遗传算法的参数优化模型 ,可以解决复杂条件下的热参数的求解问题。利用优化参数计算的轧辊温度场与实际测量结果一致。