Reliability assessment for solders with a stress buffer layer using ball shear strength test and board-level finite element analysis

The stress buffer layer (SBL) is a widely applied improvement in many advanced packages used to release the stress concentration at solder joints. However, it has been generally found that the metal line adjacent to the SBL may suffer larger deformation and its reliability should be addressed. In this study, the panel level package (PLP) technology with solder on polymer (SOP) structure is selected as the testing sample to investigate the effect of SBL. The ball shear strength test is conducted first to investigate the reliability of metal trace in PLP. In addition, finite element (FE) analysis is applied to understand the actual thermo-mechanical behavior of PLP after its assembly. The package-level and board-level reliability assessments are compared, and the suggested layout of the redistribution layer on the SBL is provided herein.     

A wafer-level microcap array to enable high-yield microsystem packaging

Packaging represents a significant and expensive obstacle in commercializing microsystem technology (MST) devices such as microelectromechanical systems (MEMS), microopticalelectromechanical systems (MOEMS), microsensors, microactuators, and other micromachined devices. This paper describes a novel wafer-level protection method for MSTs which facilitate improved manufacturing throughput and automation in package assembly, wafer-level testing of devices, and enhanced device performance. The method involves the use of a wafer-sized microcap array. This array consists of an assortment of small caps molded onto a material with adjustable shapes and sizes to serve as protective structures against the hostile environments associated with packaging. It may also include modifications which enhance its adhesion to the MST wafer or increase the MST device function. Depending on the application, the micromolded cap can be designed and modified to facilitate additional functions, such as optical, electrical, mechanical, and chemical functions, which are not easily achieved in the device by traditional means. The fabrication and materials selection of the microcap device is discussed in this paper. The results of wafer-level microcap packaging demonstrations are also presented.     

Birefringence in benzocyclobutene strip optical waveguides

We report the fabrication of benzocyclobutene strip optical waveguides and the measurement of their birefringence properties. To take into account the stress-induced birefringence in the waveguide, we generalize the formulas reported previously for the analysis of strip waveguides. Our experimental results are shown to agree closely with the theoretical calculation. The condition for achieving zero modal birefringence by control of the aspect ratio of the strip of the waveguide is highlighted. The dependence of the birefringence in the waveguides on the temperature is also measured and discussed.     

Effects and properties of poly(arylene ether benzonitrile)s of various molecular weights blended with sulfonated poly(ether ether ketone)

Poly(arylene ether benzonitrile) (PAEBN) was synthesized with 2,6‐dichlorobenzonitrile and biphenol. PAEBNs with various molecular weights (MWs), 1,640,000 and 185,000 g/mol, were synthesized by control of the stoichiometry of the monomers and were blended with sulfonated poly(ether ether ketone) (SPEEK). The effects of MW on the water uptake, swelling, methanol permeability, and proton conductivity of the SPEEK/PAEBN blend membranes were investigated. The molecular mobility of the SPEEK/PAEBN blends was also examined in this study. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

ROI-based Watermarking Scheme for JPEG 2000

A new region of interest (ROI)-based watermarking method for JPEG 2000 is presented. The watermark is embedded into the host image based on the characteristics of the ROI to protect rights to the images. This scheme integrates the watermarking process with JPEG 2000 compression procedures. Experimental results have demonstrated that the proposed watermark technique successfully survives JPEG 2000 compression, progressive transmission, and principal attacks.     

Synthesis of polyurethane elastomers hypercross-linked by partially hydrated polyhydroxylated C60

Utilization of polyhydroxylated C₆₀ (fullerenols) in a condensation reaction with diisocyanated oligo(tetramethylene oxide) led to the successful fabrication of elastomeric poly (urethane-ether) networks. These polymer networks exhibit interesting thermal behavior at low temperatures, improved tensile strength and elongation at ambient temperatures, and enhanced thermal mechanical stability at high temperatures, as compared with those of the parent linear polyurethane analogues; or with the conventional oligo (tetramethylene oxide)-derived polyurethane elastomers cross-linked by trihydroxylated reagents (1,I,1-trismethylol propane) or tetrahydroxylated reagents (pentaerythritol). The presence of a limited quantity of water molecules in the condensation reaction of fullerenols with diisocyanated prepolymers modified the physical properties of the resulting elastomeric products with a notable increase in tensile strength, modulus, and Ts over those of elasotmers prepared under anhydrous conditions. These water molecules contributed effectively to the increase of the number of cross-linking centers during the reaction.     

Fullerene Derivatives Attenuate Bronchoconstriction Induced by Xanthine-Xanthine Oxidase

The intratracheal instillation of xanthine-xanthine oxidase caused a marked decrease in dynamic respiratory compliance, indicating airway constriction. The constriction was significantly attenuated by fullerenol-1, but not by other agents or receptor antagonists.     

Comparison of calcium phosphate cement mixture and pure calcium hydroxide as direct pulp-capping agents

This review reports the different genetic factors that have been identified either as risk factor for Alzheimer's disease (AD) or directly causing the disease. First are reviewed epidemiological data and biological mechanisms about the apoplipoprotein E gene allele epsilon 4 that is a major risk factor for Alzheimer's disease. The second part describes the mutations responsible for early-onset autosomal dominant AD found in three different genes. The gene located on chromosome 21 encodes the amyloid precusor protein (APP). The presenilin 1 and presenilin 2 genes, located on chromosome 14 and 1 respectively, encode not yet known membrane proteins.