Integrated optical waveguide polarizer based on photobleaching-induced birefringence in an electrooptic polymer

A TE-pass waveguide polarizer is fabricated by utilizing the photobleaching-induced birefringence at room temperature in an electrooptic polymer. The polarizer consists of the photobleached waveguide supporting only TE mode, which is integrated in the middle of the etched rib waveguide supporting both TE and TM modes. It has a simple structure and requires no high temperature process like poling. The measured polarization extinction ratio is about 21 dB at the wavelengths of 1.3 and 1.55 /spl mu/m, and the estimated excess loss is about 0.4 dB.     

High-performance embedded SOI DRAM architecture for the low-powersupply

This paper presents the high-performance DRAM array and logic architecture for a sub-1.2-V embedded silicon-on-insulator (SOI) DRAM. The degradation of the transistor performance caused by boosted wordline voltage level is distinctly apparent in the low voltage range. In our proposed stressless SOI DRAM array, the applied electric field to the gate oxide of the memory-cell transistor can he relaxed. The crucial problem that the gate oxide of the embedded-DRAM process must be thicker than that of the logic process can be solved. As a result, the performance degradation of the logic transistor can be avoided without forming the gate oxides of the memory-cell array and the logic circuits individually. In addition, the data retention characteristics can be improved. Secondly, we propose the body-bias-controlled SOI-circuit architecture which enhances the performance of the logic circuit at sub-1.2-V power supply voltage, Experimental results verify that the proposed circuit architecture has the potential to reduce the gate-delay time up to 30% compared to the conventional one. This proposed architecture could provide high performance in the low-voltage embedded SOI DRAM     

Optical packet switching in core networks: between vision andreality

The research on optical packet switching (OPS) has witnessed considerable progress in the 1990s. We examine the future potential of OPS in the core network by discussing this switching approach and the current status of a number of its enabling technologies. Many of these technologies are still in the stage of research and experimentation. We see that optical packet switching may be deployed in the long-term future subject to satisfaction of three main conditions/developments. First, additional technological developments have to take place to overcome remaining implementation challenges while making OPS cost-effective to deploy. Second, a rational migration scenario of the network toward gradual deployment of packet-based optical switching approaches should exist. Finally, carriers have to become more interested in packet-based optical switching solutions     

10 Gbit/s transmission over 50 km nonzero dispersion-shifted fibreusing 1.3 μm directly modulated uncooled transmitters

A 1.3 μm uncooled transmitter with wide-open eye diagrams at laser temperatures of 20, 50, and 85°C is presented. Using this transmitter, it is demonstrated that 10 Gbit/s transmission is possible over a 50 km nonzero dispersion-shifted Lucent TrueWave-RS fibre. This result is compared with transmission over a 55 km standard singlemode fibre     

Coherence-Based 3-D and Spectral Imaging and Laser-Scanning Microscopy

The basics of three-dimensional (3-D) and spectral imaging techniques that are based on the detection of coherence functions and other related techniques are reviewed. The principle of the 3-D source retrieval is based on understanding the propagation law of optical random field through the free space. The 3-D and spectral information are retrieved from the cross-spectral density function of optical random field or numerical calculation of the inverse propagation of the cross-spectral density. We will first introduce the coherence-based spectral tomography techniques with low-coherence light sources. These techniques limit their scheme of coherence detection only along the optical axis and some of them achieve simultaneously the high resolution and high speed of detection taking advantage of an imaging lens. We then provided explanations of the principle of 3-D source retrieval that is based on the propagation law of optical random field through the free space along with the introduction of the numerical holography and computed tomography techniques. We will lastly show 3-D spectral imaging schemes with the concurrent laser-scanning cross-sectioning techniques: one is the confocal laser scanning microscopy and the other is the two-photon laser-scanning fluorescence microscopy.     

Non-functionalized soluble diketopyrrolopyrrole: Simplest p-channel core for organic field-effect transistors

We report the synthesis, characterization and behavior in field-effect transistors of non-functionalized soluble diketopyrrolopyrrole (DPP) core with only a solubilizing alkyl chain (i.e. –C₁₆H₃₃ or –C₁₈H₃₇) as the simplest p-channel semiconductor. The characteristics were evaluated by UV–vis and fluorescence spectroscopy, X-ray diffraction, cyclic voltammetry (CV), thermal analysis, atomic force microscopy (AFM) and density functional theory (DFT) calculation. For top-contact field-effect transistors, two types of active layers were prepared either by a solution process (as a 1D-microwire) or thermal vacuum deposition (as a thin-film) on a cross-linked poly(4-vinylphenol) gate dielectric. All the devices showed typical p-channel behavior with dominant hole transports. The device made with 1D-microwiress of DPP-R18 showed field-effect mobility in the saturation region of 1.42 × 10^?2 cm²/V s with I_ON/I_OFF of 1.82 × 10³. These findings suggest that the non-functionalized soluble DPP core itself without any further functionalization could also be used as a p-channel semiconductor for low-cost organic electronic devices.     

Ultra-low temperature sensitive deep-well quantum cascade lasers (λ - 4.8 μm) via uptapering conduction band edge of injector region

A new design feature for deep-well quantum cascade (QC) lasers, in which the conduction band edge of the injector region is uptapered, results in virtual suppression of carrier leakage out of the active regions of 4.8 mm emitting devices. For heatsink temperatures in the 20?90°C range the characteristic temperature coefficients for threshold, T₀, and slope efficiency, T₁, reach values as high as 278 and 285 K, respectively, which are nearly twice the values for conventional QC lasers. At 20°C, the threshold current density for uncoated, 30 period, 3 mm-long devices is only ~1.8 kA/cm².     

A Novel Uplink MIMO Transmission Scheme in a Multicell Environment

Uplink multiple-input multiple-output (MIMO) transmission scheme is developed for time division duplex (TDD) systems in a multicell environment. We propose a precoding scheme that maximizes the total achievable rate and works in the decentralized manner with only locally available channel state information (CSI) at each transmitter. We first establish and solve a decentralized optimization problem for the case of multiple-input single-output (MISO) channels, introducing a new precoding design metric called signal to generated interference plus noise ratio (SGINR). By extending the result to general MIMO channels, we propose an SGINR-based precoding scheme where the number of transmit streams is selected adaptively to the surrounding environments. Simulation results confirm that the proposed precoding scheme offers significant throughput enhancement in multicell environments.     

Energy Loss Mechanism in Organic and Inorganic Light-Emitting Diodes

We report that there exists a similar energy loss mechanism in fluorescent/phosphorescent organic light-emitting diodes (F/P OLEDs) and inorganic semiconductor optoelectronic devices [1310-nm InGaAsP-InP superluminescent diodes (SLDs)]. The loss of energy in inorganic SLDs based on thickness-altered asymmetric multiple quantum-well (QW) structures occurs depending sensitively on the sequence of QWs, an analogous behavior also observed in F/P OLEDs depending on the sequence of phosphorescent dopants for different colors. It is shown that such an energy (power) loss is evitable by placing long-wavelength QWs near the p-side in inorganic SLDs and similarly long-wavelength phosphors near the hole-transporting layer in F/P OLEDs.     

Microstructure characterization of Sn-Ag solder joints between stud bumps and metal pads

The microstructure of the flip-chip solder joints fabricated using stud bumps and Pb-free solder was characterized. The Au or Cu stud bumps formed on Al pads on Si die were aligned to corresponding metal pads in the substrate, which was printed with Sn-3.5Ag paste. Joints were fabricated by reflowing the solder paste. In the solder joints fabricated using Au stud bumps, Au-Sn intermetallics spread over the whole joints, and the solder remained randomly island-shaped. The δ-AuSn, ε-AuSn₂, and η-AuSn₄ intermetallic compounds formed sequentially from the Au stud bump. The microstructure of the solder joints did not change significantly even after multiple reflows. The AuSn₄ was the main phase after reflow because of the fast dissolution of Au. In the solder joints fabricated using Cu stud bumps, the scallop-type Cu₆Sn₅ intermetallic was formed only at the Cu interface, and the solder was the main phase. The difference in the microstructure of the solder joints with Au and Cu stud bumps resulted from the dissolution-rate difference of Au and Cu into the solder.