Interconnection reliability and interfacial structure between Au alloy bump and Al pad using ultrasonic bonding*

Flip chip technology with Au bumps on a substrace has been widely applied to electronic equipment such as smart phones. The purposes of this study are to examine the effect of Al pad thickness on the bondability of flip chip using ultrasonic bonding and to clarify interfacial structures between Au alloy bumps and Al pads by ultrasonic bonding compared before and after a thermal cycle test. Suitable Al thickness for excellent initial Au/Al bonding without chip cracking are 0.8 μm because a thin Al layer could not reduce stress to a chip under an Al pad during the ultrasonic bonding process. Intermetallic compounds between the Au alloy bump and chip after reflows consisted of five Au-Al layers, and a pure Al layer remained. On the other hand, after the temperature cycle test at 218/423 K, intermetallic compounds between the Au alloy bump and chip were changed into two kinds of Au-Al layers, so a pure Al layer did not exist. In addition, if thick intermetallic compound layers existed around the bonding region, bondability deteriorated easily by thermal stress due to a thermal cycle test, therefore the open failure rate was rising when the Au thickness was 1.2 μm.     

A simple screening procedure for heterotrophic nitrifying bacteria with oxygen-tolerant denitrification activity

Various naturally occurring strains of heterotrophic nitrifying bacteria were isolated by enrichment culture using acetamide as the C and N source, and 21 strains were identified as heterotrophic nitrifiers. Using a new simple procedure, these 21 strains were also investigated for the ability to carry out denitrifcation in the presence of oxygen. Several of the nitrifying strains were found to exhibit a distinct activity that allows for denitrifcation via nitrite (NO2-) in the presence of oxygen, indicating that they have an oxygen-tolerant denitrifcation system. A wide variety of bacteria possessing both nitrification and denitrifcation capabilities in the presence of oxygen were isolated and partially characterized by using the simple screening combinatorial procedure described in this paper.     

Formation Processes of β-C2S by the Decomposition of Hydrothermally Prepared C-S-H with Ca(OH)2

A mixture of CaO and silicic acid prepared with a Ca/Si ratio of 2.0 was hydrothermally synthesized at 80° to 200°C, and the thermal decomposition behavior of the products (C-S-H with Ca(OH)₂) was analyzed using XRD, ²⁹Si MAS NMR, and the trimethylsililation method (TMS). It was found that the main silicate anion structure of C-S-H was a mixture of a dimer and a single-chain polymer (larger than Si₅O₁₆) and that polymerization advanced with an increase of the synthesizing temperature. On heating, the products decomposed to form β-C₂S. It was found that the decomposition was gradual and that the-higher the temperature of hydrothermal synthesis, the lower was the temperature of the decomposition into β-C₂S. Although the decomposition proceeded to form a monomer (β-C₂S) from the polymer and dimer, this dimer was resistant to heat and did not decompose unless heated to above 400°C.     

PMMA-SiO2杂化材料对天然橡胶的增强作用

提取了活性硅烷醇,用自由基共聚合法成了含硅高聚物,分析了SiO2含量对硫化天然橡胶力学性能的影响。     

Preparation of poly(ethylene glycol)-modified poly(amidoamine) dendrimers with a shell of hydrophobic amino acid residues and their function as a nanocontainer

We studied the use of poly(ethylene glycol) (PEG)-modified dendrimers as a nanocapsule with a biocompatible surface. We designed PEG-modified dendrimers having a shell of hydrophobic amino acid residues in the peripheral moiety of the dendrimer to increase their encapsulation ability. Subsequently, l-phenylalanine or γ-benzyl-l-glutamate residues were introduced to all chain ends of the poly(amidoamine) G4 dendrimers. Furthermore, PEG (MW 2000) chains were attached to the amino acid residues. These hydrophobic amino acid residues rendered the PEG-modified dendrimers as more compact. After binding of Rose Bengal (RB) guest molecules to dendrimers, an assay using the Klotz plot showed that the hydrophobic amino acid layer slightly affected the guest site number, but significantly increased intrinsic binding of the dendrimers to guest molecules. The PEG-modified dendrimers with the hydrophobic amino acid layer were better able to retain guest molecules than the dendrimer without the layer: they are therefore useful for drug delivery.     

Thermal stability of FeF3 cathode for Li-ion batteries

The thermal stability of a FeF₃ cathode was quantitatively studied by differential scanning calorimetry (DSC). The cycled electrode without electrolyte was examined and found to become more thermally stable after Li-ion insertion. On the other hand, mixtures of cycled electrodes and electrolyte were investigated by changing the ratio of cycled electrode to electrolyte. The thermal decomposition of the electrolyte was mainly responsible for the exothermic heat for the discharged electrode and electrolyte combination. Although a reaction between the active materials of the electrode and electrolyte was observed for the mixture of the charged electrode and electrolyte, the exothermic heats were small. In contrast to lithium transition-metal oxide cathodes for lithium-ion batteries, the exothermic heat was suppressed by the FeF₃ electrode. Therefore, FeF₃ as a cathode for Li-ion batteries shows more thermal stability at elevated temperatures.     

Effect of metal-sulfide additives on electrochemical properties of nano-sized Fe2O3-loaded carbon for Fe/air battery anodes

In the present study, K₂S and Bi₂S₃ were used as additives in electrolytes and electrodes, respectively. The effects of these additives on the electrochemical properties of nano-sized Fe₂O₃-loaded carbon electrodes were investigated using cyclic voltammetry (CV), galvanostatic cycling performance and scanning electron microscopy (SEM), along with electron dispersive spectroscopy (EDS). The results showed that both K₂S and Bi₂S₃ significantly reduced hydrogen evolution and benefited the Fe₂O₃-loaded carbon electrode, such as by retarding passivation and improving the discharge capacity. The effects of metal sulfide additives depended on the carbon used. For Bi₂S₃ additive, all carbons provided larger capacities than acetylene black (AB) while AB gave greater capacity than other carbons when K₂S was used.     

Cycle characterizations of LiMxMn2−xO4 (M=Co, Ni) materials for lithium secondary battery at wide voltage region

LiM_xMn_2−xO₄ (M=Co, Ni) materials have been synthesized by a melt-impregnation method using γ-MnOOH as the manganese source. Highly crystallized LiM_xMn_2−xO₄ compounds were synthesized at a calcination temperature of 800°C for 24 h in air. All compounds show a single phase except for LiNi_0.5Mn_1.5O₄ based on the X-ray diffraction (XRD) diagram. With the increase of the doping content from 0.1 to 0.5, the capacity of doping materials decreases mainly in the 4 V region.

Although LiM_0.5Mn_1.5O₄ (M=Co, Ni) compound shows a small capacity in the (3+4) V region compared with parent LiMn₂O₄, it is a very effective material in reducing capacity loss in the 3 V region that is caused by the Jahn–Teller distortion. The doping of Co and Ni ions in the LiMn₂O₄ cathode material promotes the stability of this structure and provides an excellent cyclability.     

Solid electrolyte of tantalum oxide thin film deposited by reactive DC and RF magnetron sputtering for all-solid-state switchable mirror glass

All-solid-state switchable mirror glass was prepared by magnetron sputtering. The device exhibited the multi-layer structure of Mg₄Ni/Pd/Ta₂O₅ on WO₃/ITO/glass substrate. The Mg₄Ni, Pd, and Ta₂O₅ in the device acted as optical switches, proton injector and solid electrolyte, respectively. Reactive DC magnetron sputtering was employed as a new deposition method for Ta₂O₅ electrolyte thin film for the device. The transmittance of the device, at a wavelength of 670 nm using reactive DC-sputtered Ta₂O₅ thin film, reached 0.1% (a reflective state) to 48% (a transparent state). The transmittance change occurred in less than 40 s when 5 V was applied, and the switching speed was 60 times faster than that of the device using reactive RF-sputtered Ta₂O₅ thin film.