The reservoir effect on electromigration reliability is analyzed using the normalized vacancy concentration distribution in the reservoir region of multi-level Al–0.5%Cu interconnect structure. With the assumption of steady state for the vacancy concentration and the fact that no current flow conducts in the reservoir region during electromigration test, a simple equation for calculation of the vacancy concentration is induced. Then direct calculation of the equation is carried out utilizing the hydrostatic stress distribution computed from finite element method to estimate the probability of initial void formation in the reservoir region. Finally, three multi-level Al–0.5%Cu interconnect structures with different reservoir lengths are constructed and electromigration lifetime for the structures is measured to clarify these computational results. From the results of this study, we conclude that the normalized vacancy concentration under the assumption of steady state can be regarded as a quantitative parameter to analyze the reservoir effect on electromigration reliability. 相似文献
The microstructure of Sn-37Pb and Sn-8Zn-3Bi solders and the full strength of these solders with an Au/Ni/Cu pad under isothermal
aging conditions were investigated. The full strengths tended to decrease as the aging temperature and time increased, regardless
of the properties of the solders. The Sn-8Zn-3Bi had higher full strength than Sn-37Pb. In the Sn-37Pb solder, Ni3Sn4 compounds and irregular-shaped Pb-rich phase were embedded in a β-Sn matrix. The Ni3Sn4 compounds were observed at the interface between the solder and pad. The microstructure of the as-reflowed Sn-8Zn-3Bi solder
mainly consists of the β-Sn matrix scattered with Zn-rich phase. Zinc first reacted with Au and then was transformed to the
AuZn compound. With aging, Ni5Zn21 compounds were formed at the Ni layer. Finally, a Ni5Zn21 phase, divided into three layers, was formed with column-shaped grains, and the thicknesses of the layers were changed. 相似文献
We present a new comprehensive scheme for generating grain boundary conformed, volumetric mesh elements from a three-dimensional voxellated polycrystalline microstructure. From the voxellated image of a polycrystalline microstructure obtained from the Monte Carlo Potts model in the context of isotropic normal grain growth simulation, its grain boundary network is approximated as a curvature-maintained conformal triangular surface mesh using a set of in-house codes. In order to improve the surface mesh quality and to adjust mesh resolution, various re-meshing techniques in a commercial software are applied to the approximated grain boundary mesh. It is found that the aspect ratio, the minimum angle and the Jacobian value of the re-meshed surface triangular mesh are successfully improved. Using such an enhanced surface mesh, conformal volumetric tetrahedral elements of the polycrystalline microstructure are created using a commercial software, again. The resultant mesh seamlessly retains the short- and long-range curvature of grain boundaries and junctions as well as the realistic morphology of the grains inside the polycrystal. It is noted that the proposed scheme is the first to successfully generate three-dimensional mesh elements for polycrystals with high enough quality to be used for the microstructure-based finite element analysis, while the realistic characteristics of grain boundaries and grains are maintained from the corresponding voxellated microstructure image. 相似文献
The ruthenium(II)‐ or rhodium(III)‐catalyzed pyrimidinyl‐directed Grignard‐type C−H additions of N‐heterocycles with activated aldehydes and ketones are described. A cationic ruthenium catalyst and sodium acetate additive in dichloroethane as solvent were found to be optimal catalytic system for the construction of C‐7 alkylated indolines. In sharp contrast, a cationic rhodium complex allows the generation of C‐2 alkylated indoles and pyrroles as well as C‐1 alkylated carbazoles. The site‐selective C−H functionalization of these heterocyclic scaffolds could be an important asset towards the development of novel bioactive compounds.
Sequential copper‐catalyzed [3+2] cycloaddition, rhodium‐catalyzed O H insertion, intramolecular 1,8‐addition, and rearrangement starting from 1‐alkynes, N‐sulfonyl azides, and tropolones is demonstrated for the synthesis of the 2‐functionalized aminotropones in one pot. These results indicate that sequential functionalization of O H and C(sp2) O bonds smoothly occurs in the C(sp2) O H bonds of tropolone
The durability of PEMFCs is one of the most important issues for application in automotive vehicles with a repeated start-up
and shut-down system. The understanding of degradation phenomena such as causes, mechanisms and influence of working condition
is essential to improving the performance and lifetime of PEMFC. We conducted on/off cyclic operation in a single cell configuration
with ultra purity nitrogen gas to investigate the physical degradation of membrane electrode assembly (MEA). After on/off
cycle operation for 100,000 cycles under different humid condition, the characteristics of the MEAs were examined by in situ
and ex situ analyses techniques. The physical degradation of MEA by on/off cycling led to a change in the membrane-electrode
interfacial structure, which is mainly attributed to the loss of cell performance. 相似文献
Stretchable and transparent thin film transistors (TFTs) with intrisically brittle oxide semiconductors are built using a wavy structural configuration that can provide high flexibility and stretchability. After device fabrication procedures including high temperature annealing, the oxide semiconductor‐based TFT arrays can be transferred directly to plastic or rubber substrates, without an additional device process, using transfer printing methods. This procedure can avoid some of the thermal degradation problems associated with plastic or rubber substrates by separating them from the annealing procedure needed to improve the device performance. These design and fabrication methods offer the possibility of developing a new format of stretchable electronics. 相似文献
Feedback reduction in multiuser orthogonal frequency-division multiplexing (OFDM) systems has become an important issue due to the excessive amount of feedback required to use opportunistic scheduling, particularly when the number of users and carriers is large. In this paper, we propose a novel feedback-reduction scheme for efficient downlink scheduling. In the proposed scheme, each user determines the amount of feedback based on the so-called feedback efficiency in a distributed manner. The key idea is to give more of an opportunity for feedback to users who are more often scheduled. Simulation results demonstrate that the proposed scheme can substantially decrease the feedback load while achieving almost the same scheduling performance as in the case of full feedback. In addition, the proposed scheme offers unique advantages over existing ones. First, it is not tailored to a specific scheduling policy; thus, it has adaptability to the change of the underlying scheduling policy. Second, the total feedback load can be maintained below a target level, regardless of the number of users in the system. 相似文献