Design of Engineered Elastomeric Substrate for Stretchable Active Devices and Sensors

In the field of flexible electronics, emerging applications require biocompatible and unobtrusive devices, which can withstand different modes of mechanical deformation and achieve low complexity in the fabrication process. Here, the fabrication of a mesa‐shaped elastomeric substrate, supporting thin‐film transistors (TFTs) and logic circuits (inverters), is reported. High‐relief structures are designed to minimize the strain experienced by the electronics, which are fabricated directly on the pillars' surface. In this design configuration, devices based on amorphous indium‐gallium‐zinc‐oxide can withstand different modes of deformation. Bending, stretching, and twisting experiments up to 6 mm radius, 20% uniaxial strain, and 180° global twisting, respectively, are performed to show stable electrical performance of the TFTs. Similarly, a fully integrated digital inverter is tested while stretched up to 20% elongation. As a proof of the versatility of mesa‐shaped geometry, a biocompatible and stretchable sensor for temperature mapping is also realized. Using pectin, which is a temperature‐sensitive material present in plant cells, the response of the sensor shows current modulation from 13 to 28 °C and functionality up to 15% strain. These results demonstrate the performance of highly flexible electronics for a broad variety of applications, including smart skin and health monitoring.     

Molecularly‐Engineered, 4D‐Printed Liquid Crystal Elastomer Actuators

Three‐dimensional structures that undergo reversible shape changes in response to mild stimuli enable a wide range of smart devices, such as soft robots or implantable medical devices. Herein, a dual thiol‐ene reaction scheme is used to synthesize a class of liquid crystal (LC) elastomers that can be 3D printed into complex shapes and subsequently undergo controlled shape change. Through controlling the phase transition temperature of polymerizable LC inks, morphing 3D structures with tunable actuation temperature (28 ± 2 to 105 ± 1 °C) are fabricated. Finally, multiple LC inks are 3D printed into single structures to allow for the production of untethered, thermo‐responsive structures that sequentially and reversibly undergo multiple shape changes.     

OFDM with reduced peak-to-average power ratio by multiple signal representation

In this paper two highly effective, flexible and distortionless peak power reduction schemes for orthogonal frequency division multiplexing (ofdm) with low amount of additional complexity and almost vanishing redundancy are presented. The schemes work with arbitrary numbers of subcarriers and signal sets. The first approach generates a set of several alternative multicarrier signals and selects that transmit signal with the lowest peak power value. The second method optimally combines partial transmit sequences to minimize the peak-to-average power ratio (PAR-coefficient). The schemes are analyzed theoretically and their performance is covered by simulations.     

Fully Solution‐Processed Photonic Structures from Inorganic/Organic Molecular Hybrid Materials and Commodity Polymers

Managing the interference effects from thin (multi‐)layers allows for the control of the optical transmittance/reflectance of widely used and technologically significant structures such as antireflection coatings (ARCs) and distributed Bragg reflectors (DBRs). These rely on the destructive/constructive interference between incident, reflected, and transmitted radiation. While known for over a century and having been extremely well investigated, the emergence of printable and large‐area electronics brings a new emphasis: the development of materials capable of transferring well‐established ideas to a solution‐based production. Here, demonstrated is the solution‐fabrication of ARCs and DBRs utilizing alternating layers of commodity plastics and recently developed organic/inorganic hybrid materials comprised of poly(vinyl alcohol) (PVAl), cross‐linked with titanium oxide hydrates. Dip‐coated ARCs exhibit an 88% reduction in reflectance across the visible compared to uncoated glass, and fully solution‐coated DBRs provide a reflection of >99% across a 100 nm spectral band in the visible region. Detailed comparisons with transfermatrix methods (TMM) highlight their excellent optical quality including extremely low optical losses. Beneficially, when exposed to elevated temperatures, the hybrid material can display a notable, reproducible, and irreversible change in refractive index and film thickness while maintaining excellent optical performance allowing postdeposition tuning, e.g., for thermo‐responsive applications, including security features and product‐storage environment monitoring.     

Grain morphology of Cu damascene lines

The evolution of the grain structure through annealing of narrow damascene Cu interconnects is important for any further design of highly integrated circuits. Here we present a comprehensive transmission electron microscopy study of damascene lines between 80 nm and 3000 nm wide. Experimental results clearly indicate that morphology evolutions through annealing are strongly influenced by the line width. If the lines are wider than 250 nm a strong connection between the grain structure within the lines and the overburden copper is present at least after sufficient annealing. Once the lines are as small as 80 nm the grain structure within the lines are only weakly connected to the overburden copper grown above.     

Modular Assembly of Red Blood Cell Superstructures from Metal–Organic Framework Nanoparticle-Based Building Blocks

Bio/artificial hybrid nanosystems based on biological matter and synthetic nanoparticles (NPs) remain a holy grail of materials science. Herein, inspired by the well-defined metal–organic framework (MOF) with diverse chemical diversities, the concept of “armored red blood cells” (armored RBCs) is introduced, which are native RBCs assembled within and protected by a functional exoskeleton of interlinked MOF NPs. Exoskeletons are generated within seconds through MOF NP interlocking based on metal-phenolic coordination and RBC membrane/NP complexation via hydrogen-bonding interactions at the cellular interface. Armored RBC formation is shown to be generalizable to many classes of MOF NPs or any NPs that can be coated by MOF. Moreover, it is found that armored RBCs preserve the original properties of RBCs (such as oxygen carrier capability and good ex ovo/in vivo circulation property) and show enhanced resistance against external stressors (like osmotic pressure, detergent, toxic NPs, and freezing conditions). By modifying the physicochemical properties of MOF NPs, armored RBCs provide the capability for blood nitric oxide sensing or multimodal imaging. The synthesis of armored RBCs is straightforward, reliable, and reversible and hence, represent a new class of hybrid biomaterials with a broad range of functionalities.     

Evaluation of process parameter space of bulk FinFETs using 3D TCAD

Using full 3D TCAD, an evaluation of process parameter space of bulk FinFET is presented from the point of view of DRAM, SRAM and I/O applications. Process and device simulations are performed with varying uniform fin doping, anti-punch implant dose and energy, fin width, fin height and gate oxide thickness. Bulk FinFET architecture with anti-punch implant is introduced beneath the channel region to reduce the punch-through and junction leakage. For 30 nm bulk FinFET, anti-punch implant with low energy of 15 to 25 keV and dose of 5.0 × 10¹³ to 1.0 × 10¹⁴ cm⁻² is beneficial to effectively suppress the punch-through leakage with reduced GIDL and short channel effects. Our simulations show that bulk FinFETs are approximately independent of back bias effect. With identical fin geometry, bulk FinFETs with anti-punch implant show same I_ON-I_OFF behavior and approximately equal short channel effects like SOI FinFETs.     

Toroidal Protein Adaptor Assembles Ferrimagnetic Nanoparticle Fibers with Constructive Magnetic Coupling

Inspired by nature, the synthesis of biohybrid nanocomposites containing inorganic nanoparticles (NPs) and biopolymers such as DNA and peptides as templates offers great potential for a wide range of applications. Using selective recognition schemes of 3D protein spaces for the assembly of magnetic nanocrystals is a challenge with great promise in the field of biomedicine and magnetic data storage. Here we apply the toroidal protein Hcp1 as an interparticle connector for the directed molecular assembly and ferrimagnetic coupling of biohybrid cobalt ferrite NP wires. The resulting biohybrid NP composites show bundles of nanofibers ranging from nano‐ to the microscale in length verified by TEM, EDX analysis and focused ion beam cut. Their magnetic characterization reveals an increase of the coercive field (+12%) reaching values of high‐end Nd₂Fe₁₄B bulk magnets, enhanced saturation (+28%) and remanence magnetization (+38%) at 2 K compared to NPs lacking the protein connector. Thus, the combination of the nanoscale alignment of magnetic NPs with the molecular precision of the protein connectors leads to constructive addition of the magnetization reversal energy. This approach can be used to control magnetic properties for the design of materials with enhanced coercivity applicable for magnetic data storage, hyperthermia and theranostics.     

In?Situ Synchrotron Characterization of Melting, Dissolution, and Resolidification in Lead-Free Solders

Melting and solidification of SAC 305 lead-free solder joints in a wafer-level chip-scale package were examined in situ with synchrotron x-ray diffraction. The chips with balls attached (but not assembled to a circuit board) were reflowed one to three times using a temperature and time history similar to an industrial reflow process. Diffraction patterns from the same joint were collected every 0.5 s during the melting and solidification process. The solidification of the Sn phase in the solder joint occurred between 0.5 s and 1 s. During melting, most of the Sn melted in about 0.5 s, but in some cases took 2–5 s for the Sn peak to completely disappear. In one instance, the Sn peak persisted for 30 s. The Ag₃Sn peaks dissolved in about 1–2 s, but the Cu₆Sn₅ peaks from the interface were persistent and did not change throughout the melting and solidification process. Completely different Sn crystal orientations were always developed upon resolidification.