Dielectric reliability of stacked Al2O3–HfO2 MIS capacitors with cylinder type for improving DRAM data retention characteristics

Dielectric reliability in Al₂O₃(2–3.1nm)–HfO₂(3nm) stack capacitor with Metal–Insulator–Si(MIS) structure is investigated in this paper. We propose an optimized capacitor process through the Time–Dependent Dielectric Breakdown (TDDB) data under various process conditions. Furthermore, due to asymmetric current at both negative and positive voltage stress polarities, we show different lifetime extrapolation by a fluence–driven model. As a result, the maximum allowed operating voltage is projected to be 1.7V (failure rate 10ppm during 10year @ 85°C) for Data “0” retention lifetime.     

W-band divide-by-3 frequency divider using 0.1 /spl mu/m InAlAs/InGaAs metamorphic HEMT technology

A W-band divide-by-3 frequency divider with wide bandwidth and low power dissipation is presented using harmonic injection-locking technique. A cascode FET is employed for a self-oscillating second-harmonic mixer which is injection-locked by third-harmonic input to obtain the division order of three. The fabricated frequency divider using 0.1 /spl mu/m GaAs metamorphic HEMT technology shows superior performance such as large bandwidth of 6.1 GHz around 83.1 GHz (7.3%) under small DC power consumption of 12 mW.     

2/spl times/4 optical add-drop module with no difference in propagation length

We developed a micromachined X-type 2/spl times/4 optical add-drop module (OADM) featuring no difference in propagation length. Four pairs of lensed fibers are aligned in "X" position, and four micromirrors are located between the pairs of optical fibers. The OADM was fabricated utilizing a silicon-on-insulator process. Electrostatic comb actuators can be driven up to 90 /spl mu/m to change the light path within 1 ms. The insertion loss and the on-off ratio were less than 3 and 70 dB, respectively. The loss uniformity in every channel was 1.5 dB.     

Total and Fractional Performance of Granular Dust Traps in Refractory Production

Methods are proposed for designing interpolation models for the preliminary determination and subsequent forecasting of general and fractional breakthrough coefficients for dust used with granular filters, as employed in energy-saving and high-performance dust trapping from technological gases and ventilation discharges in refractory production. The models are supplied with nomograms, which makes them widely suitable for experts working in environmental protection at refractory-producing organizations. The main factors are identified that influence the performance. The results are of interest to experts in related areas of industry such as building materials and engineering ceramics and so on. Translated from Novye Ogneupory, No. 4, pp. 64–67, April, 2008.     

Study on the c-axis preferred orientation of ZnO film on various metal electrodes

ZnO thin film was deposited on various metal electrodes by reactive sputtering, and c-axis preferred orientation of the film has been studied. ZnO, which has high piezoelectricity, is promising for oscillators or filter devices such as surface acoustic wave (SAW) device, gas sensor, and film bulk acoustic resonator (FBAR). But, for the application of ZnO film for these devices, the film should be grown with c-axis normal to the electrode. In this study, Pt, Al, and Au were deposited on Si wafer, and the surface roughness and crystal structure of the ZnO film on the electrode were investigated using AFM, scanning electron microscopy (SEM), and X-ray diffraction (XRD). Columnar structures of ZnO films were grown with c-axis normal to all electrodes, and among them Pt electrode showed the highest preferred orientation of ZnO film.     

Using classification techniques for informal requirements in the requirements analysis-supporting system

In order to efficiently develop large-scale and complicated software, it is important for system engineers to correctly understand users’ requirements. Most requirements in large-scale projects are collected from various stakeholders located in various regions, and they are generally written in natural language. Therefore, the initial collected requirements must be classified into various topics prior to analysis phases in order to be usable as input in several requirements analysis methods. If this classification process is manually done by analysts, it becomes a time-consuming task. To solve this problem, we propose a new bootstrapping method which can automatically classify requirements sentences into each topic category using only topic words as the representative of the analysts’ views. The proposed method is verified through experiments using two requirements data sets: one written in English and the other in Korean. The significant performances were achieved in the experiments: the 84.28 and 87.91 F1 scores for the English and Korean data sets, respectively. As a result, the proposed method can provide an effective function for an Internet-based requirements analysis-supporting system so as to efficiently gather and analyze requirements from various and distributed stakeholders by using the Internet.     

核磁共振谱的岩石孔喉结构分析

刘堂宴 ,王绍民 ,傅容珊 ,周明顺 ,李艳华 ,罗曼 .核磁共振谱的岩石孔喉结构分析 .石油地球物理勘探 ,2 0 0 3,38(3) :32 8～ 333岩心核磁共振 T2 谱和压汞分析数据均在一定程度上反映了岩石的孔喉结构 ,理论分析表明 ,这两组数据具有相关性。应用岩心核磁共振 T2 谱研究岩石孔喉结构 ,关键是确定 T2 与 Pc的转换系数。但以前的方法在 T2与 Pc 的转换过程中 ,需要涉及某些岩石特性参数 ,实用中有一定困难。本文直接利用岩心核磁共振 T2 谱和压汞分析数据之间的相关性 ,客观地确定 T2 与 Pc之间的转换系数 ,避免了确定岩石特性参数的困难。应用本文方法 ,对 6块岩心的多种核磁共振分析数据进行了对比分析 ,做出了 NMR (Nuclear Magnetic Resonance,简称NMR) T2 毛管力曲线和孔喉半径分布 ,并将这些结果与压汞分析的结果进行了对比。结果表明 ,岩心 NMR T2谱在实用性和评价精度上均略显优势 ;至少是在饱含油的条件下 ,岩心的 NMR T2 谱可以用于研究孔喉结构分布 ,油气的弛豫特性作为影响背景值存在 ,对于评价结果没有明显的影响 ;在全部 6块岩心中 ,T2 与 Pc 的转换系数位于 2 5 0 0～ 4 0 0 0μs· MPa之间。     

The Region 1 & 3 Broadcasting‐Satellite Service Plan after WRC‐03

The 1977 Broadcasting‐Satellite Service (BSS) Plan for Region 1 & 3 had been widely acknowledged to be out‐of‐date by the late 1980s. Development of digital modulation in the early 1990s provided an opportunity to update the technical provisions of the Plan to make it more economically viable. After a decade of work and three World Radiocommunication Conferences (WRCs), the revision of Region 1 & 3 BSS Plan was finally completed in 2003. The new Plan increased channel assignments from 5 to 10 analog‐equivalent channels for each country in Region 1, and from 4 to 12 channels for each country in Region 3. Yet, despite the increase in capacity, the new Plan is surprisingly similar to the original one in terms of the technical parameters. It is still based on national coverage, and the channel plan, orbital location, orbital spacing, and polarization are also the same. As a result, the new Plan is no more economically viable to implement than the old. To create economically viable BSS systems would most likely require modifications to the assignment in the Plan. Yet, modification procedures were made more difficult to apply after replanning. Less future implementation of BSS networks than would otherwise have occurred can be expected, and an inefficient usage of these frequency bands will likely result. On the other hand, less implemented systems will mean more capacity set aside for future use. This is important for countries that currently do not have satellite operations. In the end, BSS replanning reflects the eternal conflict between efficient usage and guaranteed future access. Copyright © 2005 John Wiley & Sons, Ltd.     

3D optical interconnects for high-speed interchip and interboardcommunications

Metal-based communications between subsystems and chips has become the limiting factor in high-speed computing. Maturing optics-based technologies offer advantages that may unplug this bottleneck. Optical interconnects offer high-speed computers key advantages over metal interconnects. These include (1) high spatial and temporal bandwidths, (2) high-speed transmission, (3) low crosstalk independent of data rates, and (4) high interconnect densities. Although faster device switching speeds will eventually be necessary for future massively parallel computing systems, the deciding factor in determining system performance and cost will be subsystem communications rather than device speed. Free-space optical interconnects, by virtue of their inherent parallelism, high data bandwidth, small size and power requirement, and relative freedom from mutual interference of signals, already show great promise in replacing metal interconnects to solve communication problems