Bonding silicon wafer to silicon nitride with spin-on glass as adhesive

Using spin-on glass (SOG) as an adhesive, an Si wafer with thermal oxide was successfully bonded to one with an RF-sputtered Si3N4 film. This ensures that SOG films are effective in bonding Si wafers to less reactive surfaces than Si or SiO2 such as silicon nitride. It was also found that the previously reported bonding procedure can be simplified by suppressing the spin-induced radial striations of the SOG films.     

Efficient photodiode-waveguide coupling for hybrid integrated optical circuits

A GalnAsP edge-detecting photodiode was coupled with an SiO2-TiO2 single-mode waveguide in a simple hybrid integration scheme. The newly developed edge-detecting photodiode with a window region was used to improve photodiode durability.     

An image processing system using Image Signal Multiprocessors (ISMPs)

This paper describes an image processing system using Image Signal Multiprocessors (ISMPs) adapted to gray-level image preprocessing for image analysis and image enhancement. It is composed of four ISMPs, five 1H-delay-lines, two 512×512×8-bit frame memories, a video timing controller (VTC), two 256-word ×8-bit ×8-table Look Up Tables (LUTs) and 80 nsec/sampling A/D and D/A converters. This multiprocessor system performs convolution operations such as spatial filters, contrast enhancement, and binarization for gray-level images, thinning, thickening, pattern matching etc. for binary images, and image quality improvement for moving images such as T.V. images. Otherwise, it performs feature extraction operations such as area calculations, fillet coordination, and moment calculations for objective image data. Moreover, this system is capable of applying color image processing by using a multiboard system.     

Measurement of the melting points of oligomers obtained in the manufacture of poly(ethylene terephthalate)

The melting points (T_m) were measured for oligomers obtained by a direct continuous esterification process between terephthalic acid and ethylene glycol. Multiple regression analyses of data were carried out, and an equation was obtained for predicting melting points with correlation coefficient of ～0.99.     

Preparation of poly(p-phenylene terephthalamide)/poly(vinyl chloride) molecular composite and its thermal and mechanical properties

Poly(p-phenylene terephthalamide) (PPTA) was blended with poly(vinyl chloride) (PVC) by solution-blending method. PPTA was metalated for dissolving in dimethyl sulfoxide. Dimethyl sulfoxide was used as a common solvent. In PPTA/PVC composite, PPTA accelerated the thermal degradation of PVC. PPTA molecules are aggregated as microfibrillar form in PVC matrix. Such microfibrils are dispersed homogeneously in PVC matrix, according to polarizing microscopic observation. The average diameter of the microfibrils becomes smaller in the composite with lower content of PPTA. In the surface region of PPTA microfibrils the intermolecular hydrogen bonds between C? Cl of PVC and N? H of PPTA are formed. Young's modulus and the yield stress at room temperature were higher in the composites than those in PVC. The modulus of the composites was higher, especially at the high temperatures above their glass transition temperatures, than that in PVC. The temperature dependence of modulus can be calculated by using the mechanical model equivalent to the quasi-3-dimensional microfibrillar model which will be approximately applied to the composite structure. It becomes apparent that the modulus of the PPTA microfibrils evaluated by using the mechanical model is higher in the higher molecular weight PPTA.     

Temperature Dependence of KIC for High-Pressure Hot-Pressed Si3N4 Without Additives

Temperature dependence of K_IC values for Si₃N₄ bodies sintered at high pressures without additives was studied from room temperature to 1400°C. Little change in K_K was found in this range.     

Hydrothermal Formation of Hydroxyapatite Layers on the Surface of Type-A Zeolite

Type-A zeolite evenly covered with hydroxyapatite thin layers was prepared using hydrothermal treatment at 120°C for 8 h under autogenous pressure. The hydroxyapatite needlelike nanocrystals, 100–200 nm in diameter and 30 nm in thickness, were grown under the reaction between discharged Ca²⁺ ions from type-A zeolite and PO₄³⁻ ions in (NH₄)₃PO₄ solution. The preferential orientations of the c -axis of hydroxyapatite crystals perpendicular to a zeolite surface were observed using transmission electron microscopy. The crystal structure of type-A zeolite was not destroyed under the reaction, but the surface morphology was changed only with complete covering of scaly hydroxyapatite particles.     

The effects of boundary conditions on the basal glide of ice crystals in compression

Creep experiments were conducted on ice crystals in compression to investigate the effects of boundary conditions on a single-slip system deformed in plane strain. Friction at the platens of the deformation apparatus introduces a bending moment which causes a variation in the amount of lattice rotation across the specimen. This is shown to occur in mechanically constrained crystals observed through plane polarized light. Relieving the constraints and minimizing friction at the ice-platen contact leads to the widening of the sample near the specimen-platen interface and the production of tails symmetrically disposed about the longitudinal axis of the deformed crystals. This is interpreted to originate from a bending moment in the opposite sense from that obtained in the constrained crystals, resulting from a progressive increase in slip displacement towards the platens where the segments of the slip plane become shorter. When the crystal ends were constrained but allowed to move sideways, a simple shear regime was established in which lattice slip was concentrated in the centre of the crystal.     

Self-identification algorithm for zeolite-based thermal capacity gas sensor

Microsystem Technologies - We demonstrate a new operation mode of thermal gas sensor based on thermal capacity extraction with identification algorithm. The system is a silicon microstructure...