On tangible user interfaces,humans and spatiality

Like the prehistoric twig and stone, tangible user interfaces (TUIs) are objects manipulated by humans. Tangible user interface success will depend on how well they exploit spatiality, the intuitive spatial skills humans have with the objects they use. In this paper, we carefully examine the relationship between humans and physical objects, and related previous research. From this examination, we distill a set of observations and turn these into heuristics for incorporation of spatiality into TUI application design, a cornerstone for their success. Following this line of thought, we identify spatial TUIs, the subset of TUIs that mediate interaction with shape, space and structure. We then examine several existing spatial TUIs using our heuristics.     

Detoxification of bisphenol A and nonylphenol by purified extracellular laccase from a fungus isolated from soil

Purified laccase from a fungus (family Chaetomiaceae) was used for the enzymatic oxidation of bisphenol A and nonylphenol, endocrine-disrupting chemicals. It rapidly oxidized both chemicals in the absence of mediators and within 24 h their estrogenic activities were completely removed.     

Production of anti-CD2 chimeric antibody by recombinant animal cells

Expression vectors for chimeric anti-CD2 antibody were constructed in order to clarify the importance of the expression ratio of heavy (H-) and light (L-) chains of antibody to antibody production in animal cells. The antibody genes were introduced into cells using plasmid DNA vectors or replication-defective retroviral vectors. Productivity was maximal when the expression ratio of H-and L-chains was 1:1, and decreased when the ratio was not equal. We also examined the expression of antibody using one-packed vectors in which the bicistronic expression of H- and L-chain genes was mediated by an internal ribosomal entry site (IRES) sequence derived from encephalomyocarditis virus (EMCV). The translation efficiency was unbalanced between 5'Cap- and IRES-dependent genes. Using the retroviral vectors, it was estimated that the IRES-dependent translation efficiency was 5-fold lower than the 5'Cap-dependent translation efficiency. The cells exhibiting an unbalanced expression of H- and L-chains tended to accumulate H-chain protein.     

Variation in molecular species of polar lipids from Thermoplasma acidophilum depends on growth temperature

Five types of molecular species of C₄₀ isoprenoid chains, having different numbers of cyclopentane rings, were detected in the ether core lipid of Thermoplasma acidophilum. The average cyclization number of the hydrocarbon chains in the lipids increased with increasing growth temperatures.     

Enhancement of bone ingrowth in a titanium fiber mesh implant by rhBMP-2 and hyaluronic acid

The present study was designed to evaluate the efficacy of high molecular weight hyaluronic acid (HA) used as a carrier of recombinant human bone morphogenetic protein-2 (rhBMP-2) adsorbed to a titanium fiber mesh implant (TFMI) in vivo. The quantity of HA in the TFMI rapidly decreased during the initial 3-day period after implantation. BMP particles were trapped by the meshwork of HA as observed by scanning electron microscopy (SEM). TFMIs containing LF-6, HA, rhBMP-2, or HA combined with rhBMP-2 were implanted on the cranium of rats. Analysis of digitized SEM images of samples obtained six weeks post-implantation was performed to determine the area occupied by new bone. The area fraction of Ca relative to that of the pores of TFMI in the HA group was larger than that in the Ti group (p<0.05). The area fraction of Ca in both the BMP and HA+BMP groups was larger than that in both the Ti and HA groups (p<0.01), and that in the HA+BMP group was larger than that in the BMP group (p<0.05). It is suggested that HA is not only an effective carrier of BMP, but also it may have a positive effect on the generation of new bone in the TFMI. © 2001 Kluwer Academic Publishers     

High pressure consolidation of B6O-diamond mixtures

Sintered composites in the B₆O-xdiamond (x= 0–80 vol%) system were prepared under high pressure and high temperature conditions (3–5 GPa, 1400–1800°C) from the mixture of in-laboratory synthesized B₆O powder and commercially available diamond powder with various grain sizes (<0.25, 0.5–3, and 5–10 m). Relationship among the formed phases, microstructures, and mechanical properties of the sintered composites was investigated as a function of sintering conditions, added diamond content, and grain size of diamond. Sintered composites were obtained as the B₆O-diamond mixed phases when using diamond with grain sizes greater than 0.5 m, while the partial formation of the diamond-like carbon was observed when using diamond grain sizes less than 0.25 m. Microhardness of the sintered composite was found to increase with treatment temperature and pressure, and the fracture toughness slightly decreased. A maximum microhardness of H _v57 GPa was measured in the B₆O-60 vol% diamond (grain size < 0.25 m) sintered composite under the sintering conditions of 5 GPa, 1700°C and 20 min.     

Nonresonant Microwave Absorption in Bi2212 Single Crystal: Second Peak and Microwave Power Dependence

Nonresonant microwave absorption (NMA) measurements were carried out at liquid-nitrogen temperature on a high quality Bi2212 single crystal, as a function of microwave power in three mutual orientations of crystal ab plane, dc field (H_dc), and microwave magnetic field (H_w). NMA line shapes in Bi2212 crystal are complicated with a narrow peak (P₁ peak) located near zero field, followed by a much broader second peak (P₂ peak) in the particular orientations. More excitingly, we show that the P₂ peak qualitatively evolves as a function of microwave power in the orientation of H_dc ab plane, plane, and H_dc H_w. In this configuration, as the microwave power is progressively increased, the broad P₂ peak first gets smeared off and then a multiple peak structure appears, which develops into another narrower second peak (P_s-peak) at high enough microwave powers. In the orientation of plane, H_w ab plane, and H_dc H_w, we report for the first time the appearance and disappearance of a new second peak (P₂-like peak) as a function of microwave power.     

Photoluminescence properties of GaN with dislocations induced by plastic deformation

Fresh (a/3)[1120] dislocations on the (1100) prismatic plane were introduced into GaN bulk crystals by plastic deformation at 950–1000°C. In photoluminescence studies at 11 K, the near-band-edge (3.48 eV) luminescence intensity decreased remarkably in the deformed GaN, which was attributed to the introduction of high-density nonradiative recombination centers during plastic deformation. The yellow-band luminescence (2.22 eV) decreased due to plastic deformation, while several luminescence bands centered at 1.79, 1.92, and 2.4 eV developed. The dependence of PL features on deformation and annealing suggests that yellow luminescence is not related to the native structure of edge dislocations in GaN.     

Dual-mode composite-right/left-handed transmission line ring resonator

The phase response of composite right/left-handed transmission lines is used in the design of a dual-mode ring resonator. The phase can be designed to change the spacing of the resonant modes. Simulation and measured results for a dual-mode ring demonstrate this technique. The designed structure exhibits the elimination of the singlemode resonance at the second harmonic.     

Bumpless interconnect through ultrafine Cu electrodes by means of surface-activated bonding (SAB) method

In this paper, we demonstrate the feasibility of ultrahigh-density bumpless interconnect by realizing the ultrafine pitch bonding of Cu electrodes at room temperature. The bumpless interconnect is a novel concept of bonding technology that enables a narrow bonding pitch of less than 10 /spl mu/m by overcoming the thermal strain problem. In the bumpless structure, two thin layers including an insulator and metallic interconnections on the same surface are bonded at room temperature by the surface-activated bonding (SAB) method. In order to realize the bumpless interconnect, we invented a SAB flip-chip bonder that enabled the alignment accuracy of /spl plusmn/1 /spl mu/m in the high vacuum condition. Moreover, the fabrication process of ultrafine Cu electrodes was developed by using the damascene process and reactive ion beam etching (RIE) process, and the bumpless electrodes of 3 /spl mu/m in diameter, 10 /spl mu/m in pitch, and 60 nm in height were formed. As a result, we succeeded in the interconnection of 100 000 bumpless electrodes with the interfacial resistance of less than 1 m/spl Omega/. An increase of the resistance was considerably small after thermal aging at 150/spl deg/C for 1000 h.