What is the best method of surgical training?: A report of America's leading senior surgeons

OBJECTIVES: To characterize the career choices and developments made by leading senior surgeons in this country and to examine hypothetically whether application of a short tracking program would have hindered their career decisions. DESIGN: A survey pertaining to each surgeon's career, decisions, and opinions concerning surgical training. SETTING AND PARTICIPANTS: Senior surgeons of regional and national surgical societies. MAIN OUTCOME MEASURE: Survey responses. RESULTS: A total of 352 surveys (41.4%) were received. Respondents answered that the most common reasons for choosing a specialty were role models or mentors (56%), research (51%), and available patient population (23%). The 2 most common stages in a career at which the respondents became interested in a specialty, or an area of expertise, were at the junior residency level (when the specialty was chosen) and at the assistant professor level (when a more specific topic within the specialty was chosen). The most common stage at which the group believed they acquired their expertise was also at the assistant professor level. Seventy-one percent of respondents believed broad training was superior to a short tracking system, although none had participated in shortened surgical training. CONCLUSIONS: Most leading senior surgeons in this country still believe that broad surgical training is superior and should be maintained. Because career specialties in this surveyed group were generally chosen in early residency, a hypothetical application of the short tracking system would have still allowed for these important decisions to be made. Also, it seems likely that specialty and career development would not have been hindered because "expertization" mostly occurred after training was completed. Regardless of training method, a role model or mentor seems most important in career choices and developments.     

Controlling patterns of geospatial phenomena

Modeling spatially distributed phenomena in terms of its controlling factors is a recurring problem in geoscience. Most efforts concentrate on predicting the value of response variable in terms of controlling variables either through a physical model or a regression model. However, many geospatial systems comprises complex, nonlinear, and spatially non-uniform relationships, making it difficult to even formulate a viable model. This paper focuses on spatial partitioning of controlling variables that are attributed to a particular range of a response variable. Thus, the presented method surveys spatially distributed relationships between predictors and response. The method is based on association analysis technique of identifying emerging patterns, which are extended in order to be applied more effectively to geospatial data sets. The outcome of the method is a list of spatial footprints, each characterized by a unique “controlling pattern”—a list of specific values of predictors that locally correlate with a specified value of response variable. Mapping the controlling footprints reveals geographic regionalization of relationship between predictors and response. The data mining underpinnings of the method are given and its application to a real world problem is demonstrated using an expository example focusing on determining variety of environmental associations of high vegetation density across the continental United States.     

Device reliability under electrical stress and photo response of oxide TFTs

Abstract— The stability of oxide TFTs has been the main focus of this research and is probably the most crucial requirement for the successful application to flat‐panel displays. Although the high Fermi level of oxide semiconductors makes TFTs basically stable under electrical stress, the device reliability under diverse variations of electrical stress is affected by materials such as active semiconductors and gate insulators, processes for the formation of back/front channels and passivation layers, and device configurations among other things. How these factors affect the device reliability have been investigated and a review of the stability is presented. In addition, several categories of the light instability of oxide TFTs is presented and the origin is discussed.     

Michell cantilevers constructed within a half strip. Tabulation of selected benchmark results

The paper delivers the benchmark results for the Michell cantilevers constructed within a half strip, for selected values of the σ _T /σ _C ratio, σ _T , σ _C being the admissible stresses in tension and compression, respectively.     

Adaptive product tracking in RFID-enabled large-scale supply chain

The Radio Frequency Identification (RFID) technology is gradually being adopted and deployed for product flow management in the supply chain. In order to track RFID-tagged products efficiently in the RFID-enabled, large-scale supply chain, this paper first presents the design of a product tracking system that can collaborate with the EPC Network, a suite of network services for RFID data management in the supply chain. Next, we explain a product monitoring procedure that is performed by comparing the actual path of a product with its planned path. Finally, we develop an adaptive product search algorithm based on a reinforcement learning technique to efficiently locate a product deviated from its planned path. Experiment results are provided to show the performance of the search algorithm.     

Intelligent adaptive process control using dynamic deadband for semiconductor manufacturing

This paper proposes an efficient control method to minimize process error and to reduce process variance in semiconductor manufacturing. The photolithography (photo) process forms a complex semiconductor circuit and is important for quality. Obstacles to the process include the facility itself, vibration, wear and tear, product/process changes and environmental influences. Control methodologies being currently used to address these issues often amplify the variation of the process by failing to perform adequate process control. Therefore, this paper proposes an effective process control method to reduce process variance by quickly detecting and identifying process disturbances and accurately reflecting the degree of change to process control. This study proposes dynamic deadband control that uses a region (band) to detect the status of a process change. It adjusts the process control based on the changes detected. In this research, the semiconductor manufacturing company is supported to perform control that is more precise and reduces fluctuations by producing products of uniform quality. In addition, it can contribute to yield due to the quality incentive and increased process control of semiconductor manufacturing.     

TSV constraints related to temperature excursion, pressure during molding, materials used and handling loads

The current paper focuses on several mechanical aspects of a waferlevel packaging approach using a direct face-to-face Chip-to-Wafer (C2W) bonding of a MEMS device on an ASIC substrate wafer. Requirements of minimized inherent stress from packaging and good decoupling from forces applied in manufacturing and application are discussed with particular attention to the presence of through-silicon vias (TSV) in the substrate wafer. The paper deals with FEM analysis of temperature excursion, pressure during molding, materials used and handling load influence on mechanical stress within the TSV system and on wafer level, which can be large enough to disintegrate the system.