Role of interfacial potential in coagulation of cuprammonium cellulose solution

The electric potential, copper ion flux, and ammonia flux across the interface of cuprammonium cellulose solution (CCS) and various 1.0 equiv/Lelectrolyte solutions (ES) at 25°C were measured. The interfacial potentials were strongly negative (–10 to –35 mV) with H₂SO_4, HCI, and (NH₄)₂SO₄ as ES, weakly positive (6 to 8 mV) with NaCl, KCl, LiCl, CsCL, and RbCl as ES, and strongly positive (19 to 34 mV) with KOH and NaOH as ES, generally showing values similar to the diffusion potentials for electrolyte solutions comprising ions of the same absolute charge. The ammonia flux (about 1 X 10^-4 mol/cm₂/s) was relatively unaffected by the interfacial potential, but the copper ion flux was clearly dependent on it. These results, together with the observed rates of CCS coagulation, indicate that the mechanism of the coagulation was largely determined by the interfacial potential, with strongly negative potential gradients accelerating the Cu²⁺ flux into the ES and CCS coagulation proceeding rapidly by Cu²⁺ removal, strongly positive potential gradients accelerating the Na⁺ flux into the CCS and coagulation proceeding rapidly via the formation of cellulose-Na⁺ complex, and the absence of a strong potential gradient capable of accelerating the ion flux resulting in slow coagulation by ammonia removal. It may therefore be possible to control the interfacial potential and the ion flux by the ES composition, and thus to influence the structure of regenerated cellulosic fibers and membranes. © 1996 John Wiley & Sons, Inc.     

Mechanism of Catalytic Effects on AMMO/HMX Composite Propellants Combustion Rates

Thermal decomposition and the burning properties of AMMO/HMX propellants have been investigated. The heat generated by the AMMO decomposition initiated and accelerated the thermal decomposition of HMX, and the reaction between decomposed AMMO and HMX depended upon the heating rate. The rate determining step of the reaction path was different in higher and lower heating rate conditions. 2,2-bis(ethylferrocenyl)propane (CFe) and copper chromite (CuC) significantly altered the mechanisms of the thermal decomposition and the burning properties. CFe showed an increase in burning rate with a slight increase in burning rate exponent. However, CuC yielded high values for the burning rate exponent. The combined additive yielded the highest burning rate with the lowest burning rate exponent. The influence of CuC on the burning rate exponent disappeared by the combination with CFe. Though CFe and the combination additive improved the ignitability of the propellants, the propellant with CuC was difficult to ignite because of the relatively small quantity of heat feedback and/or heat released by the decomposition.     

Antimicrobial susceptibilities of Salmonella isolates obtained from layer chicken houses on a commercial egg-producing farm in Japan, 1997 to 2002

Susceptibility to antimicrobial agents was examined for 325 isolates of Salmonella enterica serotypes Cerro, Infantis, Livingstone, and Montevideo isolated from layer houses on a commercial egg-production farm in the western region of Japan between 1997 and 2002. No antimicrobials were used for therapeutic purposes on the farm during this period. From 1.8 to 3.1% of the isolates were resistant to ampicillin, chloramphenicol, and tetracycline. Resistance to streptomycin and sulfisoxazole was found in 52.9 and 65.5%, respectively, of Salmonella Montevideo isolates and in 0 to 13.2% of the isolates of the other serotypes. All the streptomycin-resistant isolates of Salmonella Montevideo also exhibited resistance to sulfisoxazole. Salmonella Montevideo isolates were first isolated in 1998, and 80.0% of the isolates obtained in this year were resistant to streptomycin and sulfisoxazole. The results suggest that Salmonella Montevideo isolates that had already acquired resistance may have been introduced into the layer houses, although the route and vehicle of transmission were uncertain. The proportion of Salmonella Montevideo isolates resistant to streptomycin and sulfisoxazole significantly decreased (P < 0.01) from 79.5% for 1998 through 1999 to 37.3% for 2000 through 2002. This decrease probably was due to the fact that no antimicrobials were used on the farm. Among 10 isolates from different serotypes obtained from 1997 to 2002 that were resistant to ampicillin, two and five isolates harbored 42- and 63-kb R plasmids and identical DraI restriction enzyme digest patterns, respectively, and carried the blaTEM gene. The results suggest that the ampicillin resistance determinants were transferred among different serotypes of Salmonella in the layer houses.     

A Two-dimensional Stress Analysis and Strength of Single-lap Adhesive Joints of Dissimilar Adherends Subjected to External Bending Moments

The stress distributions of single-lap adhesive joints of dissimilar adherends subjected to external bending moments are analyzed as a three-body contact problem by using a two-dimensional theory of elasticity (plane strain). In the analysis, dissimilar adherends and an adhesive are replaced by finite strips. In the numerical calculations, the effects of the ratio of Young's moduli of adherends, the adherend thickness ratio and the adherend length ratio between dissimilar adherends on the stress distributions at the interfaces are examined. The results show that the stress singularity occurs at the ends of the interfaces, and its intensity is greater at the interface of the adherend with smaller Young's modulus. It is also noted that the singular stress is greater at the interface of the thinner adherend. It is found that the effect of the adherend length ratio on the stress singularity at the interfaces is very small. Joint strength is predicted by using the interface stress and it was measured by experiments. From the analysis and the experiments, it is found that the joint strength increases as Young's modulus of adherends and the adherend thickness increase while the effect of the adherend lengths on the joint strength is small. For verification of the analysis, a finite element analysis (FEA) is carried out. A fairly good agreement of the interface stress distribution is seen between the analytical and the FEA results.     

High thermal conductivity of spark plasma sintered silicon carbide ceramics with yttria and scandia

A fully dense SiC ceramic with a room‐temperature thermal conductivity of 262 W·(m·K)^?1 was obtained via spark plasma sintering β‐SiC powder containing 0.79 vol% Y₂O₃‐Sc₂O₃. High‐resolution transmission electron microscopy revealed two different SiC‐SiC boundaries, that is, amorphous and clean boundaries, in addition to a fully crystallized junction phase. A high thermal conductivity was attributed to a low lattice oxygen content and the presence of clean SiC‐SiC boundaries.     

Fabrication of Translucent Magnesium Aluminum Spinel Ceramics

A precursor for magnesium aluminum spinel powder, composed of crystalline ammonium dawsonite hydrate (NH₄Al(OH)₂CO₃·H₂O) and hydrotalcite (Mg₆Al₂(CO₃)(OH)₁₆·4H₂O) phases, was synthesized via precipitation, using ammonium bicarbonate as the precipitant. The precursor was characterized by differential thermal analysis/thermogravimetry, X-ray diffractometry, and scanning electron microscopy. Reactive spinel powder, which could be densified to translucency under vacuum at 1750°C in 2 h without additives, was obtained by calcining the precursor at 1100°C for 2 h.     

Preparation of Cu(In,Ga)(S,Se)2 thin films by sequential evaporation and annealing in sulfur atmosphere

Cu(In,Ga)(S,Se)₂ thin films with high Ga/III ratio (around 0.8) were prepared by sequential evaporation from CuGaSe₂, CuInSe₂, In₂Se₃ and Ga₂Se₃ compounds and then annealing in H₂S gas atmosphere. The annealing temperature was varied from 400 to 500 °C. These samples were characterized by means of XRF, EPMA, XRD and SEM. The S/(S+Se) mole ratio in the thin films increased with increase in the annealing temperature, keeping the Cu, In and Ga contents nearly constant. The open circuit voltage increased and the short circuit current density decreased with increase in the annealing temperature. The best solar cell using Cu(In,Ga)(S,Se)₂ thin film with Ga/(In+Ga)=0.79 and S/(S+Se)=0.11 annealed at 400 °C demonstrated V_oc=535 mV, I_sc=13.3 mA/cm², FF=0.61 and efficiency=4.34% without AR-coating.