滚动式冷床在高钢级油管生产线中的应用

根据石油开采业对石油机械产品的需求 ,利用机械理论基础知识 ,通过实践设计 ,提出了对几何尺寸长的金属管类进行调质处理后的均匀冷却方法 ,以满足其性能要求。     

设备管理在安全工作中的地位

以事故轨迹交叉理论为基础，论述了企业设备管理在安全工作中所占的地位及作用，通过几起典型事故案例分析，指出企业搞好设备管理的重要性。根据机械设备故障率的特性，从设计、制造、安装、调试、运转及维护等方面，提出了控制或消除设备故障的具体措施，确保安全生产。     

油酸酯与ZDDP复配的摩擦学特性研究

研究了油酸酯与ZDDP复配的润滑油品，其PB值是46号液压油的1．88倍，摩擦行程6h，终止摩擦系数为0．008，是46号液压油终止摩擦系数的1／3，摩擦行程26．0km，摩擦副的磨损量为0．07mg。     

新型高k栅介质材料研究进展

随着半导体技术的不断发展，MOSFET（metal-oxide-semiconductor field effect transistor）的特征尺寸不断缩小，栅介质等效氧化物厚度已小至nm数量级。这时电子的直接隧穿效应将非常显著，将严重影响器件的稳定性和可靠性。因此需要寻找新型高k介质材料，能够在保持和增大栅极电容的同时，使介质层仍保持足够的物理厚度来限制隧穿效应的影响。本文综述了研究高k栅介质材料的意义；MOS栅介质的要求；主要新型高k栅介质材料的最新研究动态；展望了高k介质材料今后发展的主要趋势和需要解决的问题。     

螺旋焊管内涂层涂敷挥发份的清除

针对大口径螺旋焊管内涂层涂敷作业时，钢管内残留的涂料挥发份如何清除的问题，介绍了一种自行设计制造的内涂层涂敷挥发份吹除装置。     

具有除草活性的双膦酸衍生物的研究动态

许多含双膦酸结构单元的化合物都显示了良好的除草活性,本文对这类化合物的结构特点、生物活性以及相关的研究动态进行了归纳和概述。     

反渗透膜仓用韧性环氧树脂基体研究

工业上广泛使用反渗透膜仓制备高纯水,为了用玻璃钢替代不锈钢,研究了一种适合湿法缠绕的反渗透膜仓用韧性环氧基体。在配方中采用液体酸酐固化剂甲基四氢邻苯二甲酸酐和高效活性增韧剂,对树脂基体和复合材料力学性能及耐水性能的研究表明该树脂基体具有许多优良性能,如拉伸强度≥86.2MPa,断裂延伸率≥5.2%,弯曲强度≥139MPa,制得膜仓爆破时纤维强度转化率高达88.7%,耐疲劳达10万次而无损伤。此外,配方体系室温下粘度为0.35～0.4Pa·s,适用期≥8h,室温下在水中浸泡180d后吸水率低于0.5%,同不锈钢相比成本降低1/2。实验结果表明,该韧性环氧基体完全适用于反渗透膜仓使用。     

Stimulation of negative magnetoresistance by an electric field and light in silicon doped with boron and manganese

It is experimentally ascertained that light stimulates the negative magnetoresistance observed in a high electric field in silicon doped with boron and manganese. The optimum conditions (the electric field, temperature, illumination, and resistivity of the material) for observation of the largest magnitude of negative magnetoresistance in (Si:B):Mn are determined. The dependence of the negative magnetoresistance on the concentration of compensating impurity is established.     

Stress analysis of spontaneous Sn whisker growth

Spontaneous Sn whisker growth is a surface relief phenomenon of creep, driven by a compressive stress gradient. No externally applied stress is required for the growth, and the compressive stress is generated within, from the chemical reaction between Sn and Cu to form the intermetallic compound Cu₆Sn₅ at room temperature. To obtain the compressive stress gradient, a break of the protective oxide on the Sn surface is required because the free surface of the break is stress-free. Thus, spontaneous Sn whisker growth is unique that stress relaxation accompanies stress generation. One of the whisker challenging issues in understanding and in finding effective methods to prevent spontaneous Sn whisker growth is to develop accelerated tests of whisker growth. Use of electromigration on short Sn stripes can facilitate this. The stress distribution around the vicinity and the root of a whisker can be obtained by using the micro-beam X-ray diffraction utilizing synchrotron radiation. A discussion of how to prevent spontaneous Sn whisker growth by blocking both stress generation and stress relaxation is given.