Comparative study of micro-BGA reliability under bending stress

The micro-ball grid array (/spl mu/BGA), a form of chip scale package (CSP), was developed as one of the most advanced surface mount devices, which may be assembled by ordinary surface mount technology. In the latest /spl mu/BGA type, eutectic tin-lead solder ball bumps are used instead of plated nickel and gold (Ni/Au) bumps. Assembly and reliability of the /spl mu/BGA's PCB, which is soldered by conventional surface mount technology, has been studied in this paper. The bending cycle test (1000 /spl mu//spl epsi/ to -1000 /spl mu//spl epsi/), is used to investigate the fatigue failure of solder joints of /spl mu/BGA, PBGA, and CBGA packages reflowed with different heating factors (Q/sub /spl eta//), defined as the integral of the measured temperature over the dwell time above liquidus (183/spl deg/C). The fatigue lifetime of the /spl mu/BGA assemblies firstly increases and then decreases with increasing heating factor. The greatest lifetime happens while Q/sub /spl eta// is near 500 second-degree. The optimal Q/sub n/ range is between 300 and 750 s/spl deg/C. In this range, the lifetime of the /spl mu/BGA assembly is greater than 4500 cycles if the assemblies are reflowed in nitrogen ambient. SEM micrographs reveal that both /spl mu/ & P-BGA assemblies fail in the solder joint at all heating factors. All fractures are near and parallel to the PCB pad. In the /spl mu/BGA assemblies cracks always initiate at the point of the acute angle where the solder joint joins the PCB pad, and then propagate in the section between the Ni/sub 3/Sn/sub 4/ intermetallic compound (IMC) layer and the bulk solder. In the CBGA assembly reliability test, the failures are in the form of delamination, at the interface between the ceramic base and metallization pad.     

Study of the self-alignment of no-flow underfill for micro-BGA assembly

As a concept to achieve high throughput low cost flip-chip assembly, a process development activity is underway, implementing next generation flip-chip processing based on large area underfill printing/dispensing, IC placement, and simultaneous solder interconnect reflow and underfill cure. The self-alignment of micro-BGA (ball grid array, BGA) package using flux and two types of no-flow underfill is discussed in this paper. A “rapid ramp” temperature profile is optimized for reflow of micro-BGA using no-flow underfill for self-aligning and soldering. The effect of bonding force on the self-alignment is also described. A SOFTEX real time X-ray inspection system was used to inspect samples to ensure the correct misalignment before reflow, and determine the residual displacement of solder joints after reflow. Cross-sections of the micro-BGA samples are taken using scanning electronic microscope. Our experimental results show that the self-alignment of micro-BGA using flux is very good even though the initial misalignment was greater than 50% from the pad center. When using no-flow underfill, the self-alignment is inferior to that of using flux. However, for a misalignment of no larger than 25% from the pad center, the package is also able to self-align with S1 no-flow underfill. However, when the misalignment is 37.5–50% from the pad center, there are 10–14% residual displacement after reflow. The reason is the underfill resistant force inhibiting the self-alignment of the package due to rapid increment of underfill viscosity during reflow. The self-alignment of micro-BGA package using no-flow underfill allows only <25% misalignment prior to the soldering. During assembling, although the bonding force does not influence on the self-alignment of no-flow underfill, a threshold bonding force is necessary to make all solder balls contact with PCB pads, for good soldering. The no-flow underfill is necessary to modify the fluxing/curing chemistry for overcoming the effect of tin metal salt produced during soldering on underfill curing, and for maintaining the low viscosity during soldering to help self-alignment.     

基于下视图像的打击效果评估系统研究

研究了打击效果评估的基本概念及该技术在国外的发展与应用情况,提出了基于下视图像的毁伤特征提取方法与典型目标毁伤评估准则。从物理级、功能级和系统级三个层次对打击效果评估进行了描述,提出了基于变化检测的物理级毁伤效果评估方法、基于自动目标识别的物理级毁伤评估方法和基于专家知识库的功能级毁伤评估方法,开发实现了基于下视图像的典型目标打击效果评估系统。仿真结果表明,所提出打击效果评估方法是有效的。     

基于S3F9488与CP2512的电子产品应用设计

运用电容触摸检测芯片CP2512与单片机S3F9488进行电路设计.触摸检测芯片CP2512通过检测电容的变化量来感知外界数据的变化,通过I2C协议把CP2512采集的数据送到S3F9488,S3F9488根据采集到的数据进行相应的功率控制.本文给出了CP2512与S3F9488的硬件设计图.该方案的设计可以使家电产品更加耐用、美观;能有效地提高产品的抗干扰能力,提升产品的品质.该电路的设计为家电产品提够了一种低成本解决方案,最终在电磁炉中得到了实现.     

Stretchable Anti-Fogging Tapes for Diverse Transparent Materials

Surface wetting prevents surface fogging on transparent materials by facilitating filmwise condensation with specific chemistry, but suffers from material and geometry selectivity. Extreme environments associated with high humidity and mechanical loading further limit their anti-fogging persistence. Here, a stretchable anti-fogging tape (SAT) that can be applied to diverse transparent materials with varied curvatures for persistent fogging prevention is reported. The SAT consists of three synergistically combined transparent layers: i) a stretchable and tough layer with large elastic recovery, ii) an endurant anti-fogging layer insensitive to ambient humidity, and iii) a robustly and reversibly adhesive layer. The SAT maintains high total transmittance (>90%) and low diffuse transmittance (<5%) in high-humidity environments, under various modes of mechanical deformations, and over a prolonged lifetime (193 days tested so far). Two applications are demonstrated, including the SAT-adhered eyeglasses and goggles for clear fog-free vision, and the SAT-adhered condensation cover for efficient solar-powered freshwater production.     

基于IMU数据与双星定位系统组合的机载SAR运动补偿

该文主要介绍了机载SAR平台运动误差中惯性测量单元(IMU)系统误差的补偿方法。由于双星定位系统误差不随时间递增,该文利用双星定位系统(GEOSTAR)与IMU进行组合,消除随时间递增的IMU系统误差,提高IMU定位精度,从而减轻SAR成像处理器运动补偿的负担。     

Effect of a cover layer on the edge admittance of a wide microstrip

The canonical problem of a grounded dielectric slab with a truncated upper conductor and a dielectric cover layer is solved by the Wiener-Hopf technique. The method yields the value of the reflection coefficient at the open edge and the equivalent edge admittance. Numerical results show that the presence of a cover layer increases both the conductance and the susceptance. An increase in the value of edge conductance corresponds to an increase in the radiated power and surface-wave power. An increase in the value of the susceptance corresponds to an increase in the fringing capacitance at the edge. This results in a reduction of the physical length of a resonant rectangular patch. On the basis of Wiener-Hopf analysis it is seen that the space-wave power and the power carried by the surface wave are separated from the total radiated power. The numerical results show that the radiation efficiency decreases with an increase in the cover layer thickness     

氧化铝模板法制备Ge纳米线

采用氧化铝模板法结合具有高真空背景的低压化学气相沉积技术制备出 Ge纳米线 .在氧化铝模板的背面喷金作为催化剂 ,合成了 Ge纳米线 .采用原子力显微镜、X射线衍射、透射电镜、能量散射谱等手段对 Ge纳米线进行了分析 .Ge纳米线的直径约为 30 nm,长度超过 6 0 0 nm.对 Ge纳米线的生长机理进行了探讨 .     

关于科技档案与文书档案跨界归档问题的探讨

科技档案和文书档案的跨界归档问题，是指有些文件具有科技档案和文书档案的双重性，本文结合引黄工程档案管理的实践，给出了几种处理临界归档的具体办法     

龙滩碾压混凝土芯样试件特性试验研究

介绍龙滩碾压混凝土现场芯样试件特性研究成果，内容包括碾压混凝土强度、弹性模量、超声波速度、动力特性和断裂特性等资料。论证了建造200m级龙滩碾压混凝土重力坝的可行性。