An iatrogenic arterial foreign body

The creation, possible complications and retrieval of an unusual, perhaps unique, arterial foreign body are described.     

Megavolt arsenic implantation into silicon

Implantations of arsenic at 11 MeV have been performed into Si(100) substrates at room and liquid nitrogen temperatures. The residual damage after annealing has been observed using Rutherford backscattering and cross-sectional transmission electron microscopy. In situ annealing is shown to be more important for room temperature implantation compared with liquid nitrogen temperature implantation. Spreading resistance has been used to determine active carrier concentrations, and the measured range of 4.4 μm agrees with Linhard-Scharff-Schi?tt calculations. Buried interconnects with a sheet resistance of 50 Ω/? have been fabricated and tested.     

Free nor-adrenaline and adrenaline excretion in relation to complications in acute myocardial infarction

The authors report on the clinical data, operating technique, postoperative complications, and late results in a series of 31 epidermoid and 21 dermoid cysts of the central nervous system.     

风景园林的未来

<正>当习近平主席指点"美丽中国"之时,他也表达出了一套由全球风景园林专业所秉承的价值观念,那就是——设计和审美的重要性、对环境的关爱、审慎的改造。中国风景园林行业的快速发展也揭示了这个国家已经与这个职业的宗旨紧密相连。不幸的是,并不是每个国家的风景园林行业都有像中国这样的发展速度和作为。2008年以来的经济衰退导致了很多国家的风景园林事务所裁员。现在美国和世界其它国家的经济已经回暖,枕戈待旦,风景园林人也必须在技术上吐故纳新,为公共健康谋福利。1新的技术用于风景园林实践的技术进步包括一系     

Single Crystal Flexible Electronics Enabled by 3D Spalling

Flexible and stretchable electronics are becoming increasingly important in many emerging applications. Due to the outstanding electrical properties of single crystal semiconductors, there is great interest in releasing single crystal thin films and fabricating flexible electronics with these conventionally rigid materials. In this study the authors report a universal single crystal layer release process, called “3D spalling,” extending beyond prior art. In contrast to the conventional way of removing blanket layers from their substrates, the new process reported here enables 3D control over the shape and thickness of the removed regions, allowing direct formation of arbitrarily shaped structures of released film and locally specified thickness for each region. As an exemplary demonstration, silicon flexible tactile sensors are fabricated with sensitivities comparable to those of high performance sensors on rigid substrates. Finite element modeling indicates that the size and thickness of the selectively released features can be tuned over a wide range.