Reliability of fine-pitch through-vias in glass interposers and packages for high-bandwidth computing and communications

Glass is an ideal substrate material to enable 2.5D and 3D packaging of ICs at low cost and high performance. However, it is a brittle material and is prone to failures during fabrication and operation. Large coefficient of thermal expansion (CTE) mismatch between copper and glass leads to thermomechanical stresses that can lead to glass cracking and delamination from glass interfaces. This paper focuses on modeling and reliability characterization of copper-plated through-package-vias (TPV) in glass packages. Thermomechanical simulations were carried out to obtain design guidelines for reliable TPVs in glass. Test-vehicles with different glass thicknesses and copper TPV fabrication conditions were fabricated for thermal cycling tests, resistance monitoring and failure analysis. The reliability characterization results showed good thermomechanical reliability of TPVs in ultra-thin glass panels.     

Tuned test problems for numerical methods in engineering

When numerical methods are applied in engineering, verification is essential. Test problems can help in meeting this requirement. This is especially so when these problems are tuned to the application at hand. Unfortunately, in practice such tuned test problems are not always directly available. For these cases, this paper describes an approach for constructing tuned test problems. The approach may be used on ordinary or partial differential equations, be they linear or non-linear. This is demonstrated on a number of applications drawn from dynamics, solid mechanics, and fluid mechanics. © 1997 John Wiley & Sons, Ltd.     

Transistors Formed from a Single Lithography Step Using Information Encoded in Topography

This paper describes a strategy for the fabrication of functional electronic components (transistors, capacitors, resistors, conductors, and logic gates but not, at present, inductors) that combines a single layer of lithography with angle‐dependent physical vapor deposition; this approach is named topographically encoded microlithography (abbreviated as TEMIL). This strategy extends the simple concept of ‘shadow evaporation’ to reduce the number and complexity of the steps required to produce isolated devices and arrays of devices, and eliminates the need for registration (the sequential stacking of patterns with correct alignment) entirely. The defining advantage of this strategy is that it extracts information from the 3D topography of features in photoresist, and combines this information with the 3D information from the angle‐dependent deposition (the angle and orientation used for deposition from a collimated source of material), to create ‘shadowed’ and ‘illuminated’ regions on the underlying substrate. It also takes advantage of the ability of replica molding techniques to produce 3D topography in polymeric resists. A single layer of patterned resist can thus direct the fabrication of a nearly unlimited number of possible shapes, composed of layers of any materials that can be deposited by vapor deposition. The sequential deposition of various shapes (by changing orientation and material source) makes it possible to fabricate complex structures—including interconnected transistors—using a single layer of topography. The complexity of structures that can be fabricated using simple lithographic features distinguishes this procedure from other techniques based on shadow evaporation.     

The effect of electrochemical lithiation on physicochemical properties of RF-sputtered Sn thin films

Thin films of Sn were deposited on Pt/Si substrates by sputtering technique and subjected to electrochemical lithiation studies. Electrochemical lithiation of Sn resulted in the formation of Sn–Li alloys of different compositions. Charging of Sn-coated Pt/Si electrodes was terminated at different potentials and the electrodes were examined for physicochemical properties. The scanning electron microscopy and atomic force microscopy images suggested that the Sn films expanded on lithiation. Roughness of the film increased with an increase in the quantity of Li present in Sn–Li alloy. Electrochemical impedance data suggested that the kinetics of charging became sluggish with an increase in the quantity of Li in Sn–Li alloy.     

Solid-state synthesis and effect of temperature on optical properties of Cu-ZnO, Cu-CdO and CuO nanoparticles

Controlling novel morphologies and developing effective doping strategies are two important tasks for advancing ZnO and CdO based nanomaterials. Modulation of band energies through size control offers new ways to control photoresponse and photoconversion efficiencies of the solar cell. The P-type semiconductors of copper oxide and zinc oxide are an important functional material used for photovoltaic cells. CuO is attractive as a selective solar absorber since it has high solar absorbance and a low thermal emittance. This work describes the synthesis and characterization of semiconducting nanoparticles (ZnO, CuO, CdO, Cu-ZnO, Cu-CdO) via one-step, solid-state reaction in the presence of polyethylene glycol 400.Solid-state mechanochemical processing—which is not only a physical size reduction process in conventional grinding but also a chemical reaction that is mechanically activated at the nanoscale during grinding. The present method is a simple and efficient method for the preparation of nanoparticles with high yield at low cost. The structural and chemical composition of the nanoparticles were analyzed by X-ray diffraction, field emission scanning electron microscopy and energy-dispersive spectrometer (FESEM/EDAX). Optical properties and band gap were studied by UV-vis absorption spectra. XRD data has been concluded that the Cu doping induced the lattice constants to change to some extent. These results have showed that the band gap energy decreases with increase in annealing temperature, which can be attributed to the improvement in crystallinity of the samples. The band gap of the Cu-ZnO and Cu-CdO crystals can be tuned in the range of 3.34-3.28 eV and 2.80-2.21 eV respectively, by the use of dopants.     

Incorporation of bromo-octadecane into long-chain ester monolayers at the air/water interface

Surface compatibility of 2-methoxy ethyl stearate and oleate esters with 1-bromo-octadecane (RBr) has been investigated at the air/water interface with a Langmuir film balance. The methoxy ethyl head group in the esters promotes flat conformation at the air/water interface as observed from its higher surface area (stearate, 22.41 Ų/molecule; oleate, 57.20 Ų/molecule) in comparison to the corresponding acids. The stearate ester forms a homogeneous mixed monolayer with maximal incorporation of 0.5 mole fraction of RBr. This is indicated by the retention of liquid condensed and solid condensed phases of stearate ester, and the positive deviation of the mean molecular area of the mixed film from the calculated additive areas. When the mole fraction of RBr (x ₂) exceeds 0.5, the onset of formation of heterogeneous mixed film is indicated by the appearance of initial and final collapse pressures. On the contrary, oleate ester shows the least compatibility with RBr, which is indicated by the progressive decrease in mean molecular area with x ₂. The more liquid expanded-phase structure of oleate ester probably does not promote compatibility with RBr at the air/water interface.     

Sensitive and Reversible Detection of Methanol and Water Vapor by In Situ Electrochemically Grown CuBTC MOFs on Interdigitated Electrodes

The in situ electrochemical growth of Cu benzene‐1,3,5‐tricarboxylate (CuBTC) metal–organic frameworks, as an affinity layer, directly on custom‐fabricated Cu interdigitated electrodes (IDEs) is described, acting as a transducer. Crystalline 5–7 µm thick CuBTC layers are grown on IDEs consisting of 100 electrodes with a width and a gap of both 50 µm and a height of 6–8 µm. These capacitive sensors are exposed to methanol and water vapor at 30 °C. The affinities show to be completely reversible with higher affinity toward water compared to methanol. For exposure to 1000 ppm methanol, a fast response is observed with a capacitance change of 5.57 pF at equilibrium. The capacitance increases in time followed diffusion‐controlled kinetics (k = 2.9 mmol s^?0.5 g^?1_CuBTC). The observed capacitance change with methanol concentration follows a Langmuir adsorption isotherm, with a value for the equilibrium affinity K _e = 174.8 bar^?1. A volume fraction f _MeOH = 0.038 is occupied upon exposure to 1000 ppm of methanol. The thin CuBTC affinity layer on the Cu‐IDEs shows fast, reversible, and sensitive responses to methanol and water vapor, enabling quantitative detection in the range of 100–8000 ppm.