Rationalisierung des Zeichnungswesens im Chemie-Apparatebau

Rationalizing drawings for chemical apparatus . For small and medium-sized manufacturers of apparatus, producing drawings may constitute a disproportionate waste of time and personnel, particularly when no new designs are involved but only modification or improvement of drawings supplied by the customer. One possibility for rationalizing drawing is to simplify the old-fashioned approach by using symbols for frequently drawn or standard items, or by listing alphanumerically. This presumes a kind of systematization permitting determination of those symbols and their reasonable use, as well facilitating rationalization by means of data processing. There are different approaches to computer-aided drawing (from computer controlled drawing-board to interactive screens); here a CAD programme is presented which was especially developed for graphic presentation of chemical apparatus, and which can be used without learning a programming language.     

Quantitation of amphetamine,methamphetamine, and their methylenedioxy derivatives in urine by solid-phase microextraction coupled with electrospray ionization-high-field asymmetric waveform ion mobility spectrometry-mass spectrometry

Amphetamine, methamphetamine, and their methylenedioxy derivatives have been identified and measured in a human urine matrix using solid-phase microextraction (SPME) and high-field asymmetric waveform ion mobility spectrometry (FAIMS) in combination with electrospray ionization (ESI) and mass spectrometric detection (MS). Limits of detection in human urine between 200 pg/mL and 7.5 ng/mL have been achieved. The use of a simple extraction method, SPME, combined with the high sensitivity and selectivity of ESI-FAIMS-MS eliminates the need for chromatographic separation and allows for very rapid sample processing.     

On FEM-BEM coupling for fluid-structure interaction analyses in the time domain

The investigation of coupled fluid-structure systems, subjected to dynamic loads, calls for the use of discrete techniques such as the finite element method (FEM) and the boundary element method (BEM). This paper reports on the development of a FEM-BEM coupling procedure, where finite elements are used to model the linear elastic structure, while the adjacent fluid is represented by boundary elements. The new approach is formulated entirely in the time domain to be extensible to non-linear problems. Various numerical calculations are presented which clearly demonstrate the applicability and the merits of the hybrid method. The obtained results are in excellent agreement with solutions stemming from a boundary element analysis which uses subdomain techniques.     

Combustion synthesis of LaSi3N5:Eu2+ phosphor powders

LaSi₃N₅:Eu²⁺ phosphor powders were prepared by a highly efficient combustion synthesis method. It was found that the compositions of the raw powder mixtures had great influences on the phase compositions and particle morphologies of the synthesized powders. By selecting appropriate starting compositions and combustion parameters, single phase LaSi₃N₅:Eu²⁺ phosphors could be synthesized. When excited by a UV light, the LaSi₃N₅:Eu²⁺ phosphors emitted green light. The wavelength and intensity of the emission spectra were affected by the amount of Eu²⁺ dopant. With increasing amount of Eu²⁺ dopant, concentration quenching could occur and emission spectra shifted to longer wavelengths.     

超薄板材上Nd:YAG脉冲激光送粉熔覆研究

研究了为满足特定图案要求在超薄板材 ( 0 1～ 0 15mm)上进行Nd :YAG脉冲激光送粉精细熔覆过程中激光熔覆特性、侧向和同轴喷嘴送粉熔覆、基体的真空吸附夹紧和强迫制冷、熔覆层几何形貌、元素分布和微观组织特性等因素。得到了熔覆层高宽比为 0 88和 0 5、质量良好的熔覆图案     

A hermetic glass-silicon micropackage with high-density on-chipfeedthroughs for sensors and actuators

This paper describes the development of a hermetic micropackage with high-density on-chip feedthroughs for sensor and actuator applications. The packaging technique uses low-temperature (320°C) electrostatic bonding of a custom-made glass capsule (Corning 7740, 2×2×8 mm³) to fine grain polysilicon in order to form a hermetically sealed cavity. High-density on-chip multiple polysilicon feedthroughs (200 per millimeter) are used for connecting external sensors and actuators to the electronic circuitry inside the package. A high degree of planarity over feedthrough areas is obtained by using grid-shaped polysilicon feedthrough lines that are covered with phosphosilicate glass (PSG), which is subsequently reflown at 1100°C in steam for 2 h. Saline and DI water soak tests at elevated temperatures (85 and 95°C) were performed to determine the reliability of the package. Preliminary results have shown a mean time to failure (MTTF) of 284 days and 118 days at 85 and 95°C, respectively, in DI water. An Arrhenius diffusion model for moisture penetration yields an expected lifetime of 116 years at body temperature (37°C) for these packages. In vivo tests in guinea pigs and rats for periods ranging from one to two months have shown no sign of infection, inflammation, or tissue abnormality around the implanted package