番禺30-1砂岩强水驱气藏储层非均质性研究

针对垂向非均质性严重且边底水能量强的番禺30-1气田面临的潜在开发问题，通过岩心分析及测井二次解释，对其夹层特征及储层非均质性等进行了研究，划分出19个流动单元并定量描述了各流动单元的特征参数，建立了该气田的精细地质模型。综合评价表明，新建的地质模型具有较高的精度，为该气藏合理开发提供了坚实的地质基础。     

蜕变——中国气象局华风影视大楼

华风气象影视大楼总面积4万平方米，根据空间功能不同分为办公大楼和商务写字楼两部分，办公大楼是集演播室、制作机房、办公室为一体的九层综合性建筑。设计师杨宇在刚接触到这个项目的时候，面对的是一个既成事实的建筑。     

基于多相滤波器的信道化接收机及其应用研究

本文主要研究了应用多相滤波技术的信道化接收机建模问题。在给定信道频谱划分方案下,推导了基于多相 滤波器的信道化接收机数学模型。并由此模型设计了一个四信道模拟系统。最后用仿真实验结果验证了模型的正确性。     

miPP/ziPP共混体系的流动性能

首次对茂金属聚丙烯(miPP)／齐格勒-纳塔聚丙烯(ziPP)共混体系的流动性进行了系统的研究。研究发现，在miPP／ziPP共混体系中，miPP含量的变化改变了共混体系的相结构，这种相结构会随着温度和剪切速率的变化而产生明显的变化，从而改变了体系的流动性能，且该共混体系在不同剪切速率下的流动曲线可以分别通过两个模型进行模拟。     

全球3G市场管制政策分析

主要对各国3G许可证与使用技术标准的抽绑政策．各国对2G／3G网络漫游的管制规定。以及3G网络之间共享的种类及实施方式等方面做了详尽的讲解，并进行比较和分析。     

Finite element analysis of advanced multilayer capacitors

We establish a systematic methodology to design and analyse electromagnetic components such as advanced multilayer ceramic capacitors (MLCCs) using the finite element (FE) method. We employ a coupled formulation to compute the interaction between the electric and magnetic fields. Unlike a linear distribution of current assumed in the circuit model, an accurate electrostatic solution to model the entire advanced MLCCs (4 × 4 × 27 = 432 cells) is presented. The FE solution is used to compute the lumped parameters for a range of frequencies. These lumped parameters are then used to compute the parasitic elements of the MLCCs. We introduce two algorithms to efficiently analyse the behaviour of a capacitor with changing frequency. The lower frequency (much below the self‐resonant frequency of the capacitor) algorithm separates the effect of the electric and magnetic fields and reduces the computational effort required to solve the FE problem, whereas, the high‐frequency algorithm couples the effect between the electric and the magnetic fields. We use these algorithms in conjunction with a new multiple scale technique to effectively determine the small values of R, L and C in MLCCs. The formulation, the implementation, and the numerical results demonstrate the efficacy of the present FE formulation and establish a systematic methodology to design and analyse advanced electromagnetic components. Copyright © 2003 John Wiley & Sons, Ltd.     

Mass Transfer in a Flat Gas/Liquid Interface using non‐Newtonian Media

Gas/liquid mass transfer has been investigated using a stirred vessel gas/liquid contactor using non‐Newtonian media and carbon dioxide as absorbent and gas phase, respectively. The volumetric mass transfer coefficients at different operational variables have been determined. Non‐Newtonian media (liquid phase) were prepared as aqueous solutions of sodium carboxymethyl cellulose salt. The influence of the rheological properties, polymer concentration, stirring rate, and gas flow rate on mass transfer was studied for these liquid phases. Kinematic viscosity and density experimental data were used to calculate the average molecular weight corresponding to the polymer employed. The Ostwald model has been used to fit the rheological behavior of aqueous solutions of the polymer employed as absorbent phase. Reasonably good agreement was found between the predictions of the proposed models and the experimental data of mass transfer coefficients.     

High-efficiency LEDs of 1.6–2.4 µm spectral range for medical diagnostics and environment monitoring

High efficient LED structures covering the spectral range of 1.6–2.4 μm have been developed on the basis of GaSb and its solid solutions. The electroluminescent characteristics and their temperature and current dependences have been studied. The radiative and nonradiative recombination mechanisms and their effect on the quantum efficiency have been investigated. A quantum efficiency of 40–60% has been obtained in the quasi-steady mode at room temperature. A short-pulse optical power of 170 mW was reached. __________ Translated from Fizika i Tekhnika Poluprovodnikov, Vol. 37, No. 8, 2003, pp. 996–1009. Original Russian Text Copyright ? 2003 by Stoyanov, Zhurtanov, Astakhova, Imenkov, Yakovlev.     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported