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41.
High dielectric constant (high-k) polymer composites are of great interest for embedded capacitor applications. Previously, we demonstrated that epoxy—aluminum composites are promising for embedded capacitor applications, because they have a high dielectric constant and a low dielectric loss due to the core—shell structure of the self-passivated aluminum particles. In this work, to further understand the dielectric behavior of aluminum composites, lower-loss polymers such as silicone, polyimide, polynorbornene, and benzocyclobutene were explored as matrices for the aluminum composites. It is found that the polymer matrices can significantly change the dielectric properties of the aluminum composites. A polymer matrix with a lower dielectric constant generally results in a lower dielectric constant of its aluminum composites. In this regard, polymer—aluminum composites have a similar dielectric characteristic as polymer—ceramic composites. Thermomechanical properties of aluminum composites were characterized by a thermomechanical analyzer.  相似文献   
42.
An encryption system with discretized skew tent map has been proposed recently by N. Masuda . However, there is a fundamental weakness with this chaotic cryptographic scheme. In this paper, a chosen plaintext attack requiring only two plaintexts is proposed. An improved version of this attack that narrows the key space need to be searched is also suggested. The test results demonstrate that this encryption cryptosystem is easily broken under the proposed chosen plaintext attack.  相似文献   
43.
Two advanced techniques have been developed for modeling vapor pressure within the plastic IC packages during solder reflow. The first involves the extension of the "wetness" technique to delamination along multimaterial interface and during dynamic solder reflow. Despite its simplicity, this technique is capable of offering reliable and accurate prediction for packages with high flexural rigidity. For packages with low flexural rigidity, the new "decoupling" technique that integrates thermodynamics, moisture diffusion, and structural analysis into a unified procedure has been shown to be more useful. The rigorous technique has been validated on both leadframe-based as well as laminate-based packages. With high accuracy and computational efficiency, these dynamic modeling tools will be valuable for optimization of package construction, materials, and solder reflow profile against popcorn cracking for both SnPb and Pb-free solders  相似文献   
44.
5类网络电缆由四对双绞线组成,并有耐用的外套,这种电缆能为分量视频信号的传输提供一种通用而有良好性价比的选择。三个线对可以承载RGB视频信号,而第四对线可以承载音频信号、同步信号和其它传输信号。不幸的是,5类电缆缺乏屏蔽,因此容易遭受共模噪声耦合  相似文献   
45.
This paper describes the modeling of power-factor-correction converters under average-current-mode control, which are widely used in switch-mode power supply applications. The objective is to identify stability boundaries in terms of major circuit parameters for facilitating design of such converters. The approach employs a double averaging procedure, which first applies the usual averaging over the switching period and subsequently applies generalized averaging over the mains period. The resulting model, after two averaging steps and application of a harmonic balance procedure, is nonlinear and capable of describing the low-frequency nonlinear dynamics of the system. The parameter ranges within which stable operation is guaranteed can be accurately and easily found using this model. Experimental measurements are provided for verification of the analytical results.  相似文献   
46.
We report the growth of erbium monoantimonide (ErSb) thin films on indium antimonide (100) substrates by low-pressure metalorganic chemical vapor deposition. The growth rate of ErSb thin films shows strong dependency on the growth temperature and the Sb/Er precursor molar flow rate ratio. Scanning electron microscopy, energy-dispersive x-ray spectroscopy, and x-ray diffractometry (XRD) were employed to study the ErSb thin films grown under the growth conditions that gave the maximum growth rate in the range we investigated. We also report the growth of two types of nanocomposites in which ErSb nanocolumns or nanoslabs with lengths ~500 nm and diameters 20 nm to 30 nm are embedded in Zn-doped InGaSb (ErSb/InGaSb:Zn) and ErSb nanoparticles with diameters of ~30 nm are embedded in Zn-doped InSbAs (ErSb/InSbAs:Zn). These nanocomposites were intended to increase phonon scattering in a mid-to-long phonon wavelength range to reduce lattice thermal conductivity. We used time-domain thermoreflectance to measure total thermal conductivity for the two types of nanocomposites, obtaining 4.0 ± 0.6 W/mK and 6.7 ± 0.8 W/mK for the ErSb/InAsSb:Zn and ErSb/InGaSb:Zn nanocomposites, respectively, which suggests that the thermal conductivity was close to or slightly smaller than the alloy limit of the two ternary alloy hosts. The two nanocomposites were further studied by transmission electron microscopy (TEM) to reveal their microscopic features and by XRD to assess their crystalline structures.  相似文献   
47.
Molecular organization behavior and visible light absorption ability are important factors for organic materials to be used in efficient bulk heterojunction solar cells applications. In this context, a series of monosubstituted fluorenyl hexa‐peri‐hexabenzocoronene (FHBC) are synthesized with the aim to combine the self‐association property of the FHBC unit with broadened light absorption of a small molecule organic dye, bisthienylbenzothiadiazole (TBT). Optical and electrochemical properties of the FHBC compounds vary according to their structures. Introduction of a TBT unit into the FHBC system broadens the absorption. All of the FHBC compounds show strong ππ intermolecular association in solution. X‐ray scattering measurements on thermally extruded filaments and thin films showed ordered alignment of these compounds in the solid state. In atomic force microscopy experiments, nanoscale phase separation is observed in thin films of FHBC and fullerene derivative blends. Solar cell devices with these compounds as donors are fabricated. FHBC compounds with the TBT unit show higher short circuit current while the high open circuit voltages are maintained. With C60 derivative as acceptor, power conversion efficiency of 1.12% is achieved in the unoptimized solar cell devices under simulated solar irradiation. The efficiency was further improved to 1.64% when C70 derivative was used as the acceptor.  相似文献   
48.
A series of solution‐processable and strongly visible‐light absorbing polyplatinynes containing oligothienyl–fluorene ring hybrids were synthesized and characterized. These rigid‐rod organometallic materials are soluble in polar organic solvents and show intense absorptions in the visible spectral region, rendering them excellent candidates for bulk heterojunction polymer solar cells. The photovoltaic behavior depends significantly on the number of thienyl rings along the polymer chain, and some of these polymer solar cells show high power conversion efficiencies (PCEs) of up to 2.9% and a peak external quantum efficiency to 83% under AM1.5 simulated solar illumination. The effect of oligothienyl chain length on improving the polymer solar cell efficiency and on their optical and charge transport properties is elucidated in detail. At the same blend ratio of 1:5, the light‐harvesting capability and PCE increase markedly with increasing number of thienyl rings. The power dependencies of the solar cell parameters (including the short‐circuit current density, open‐circuit voltage, fill‐factor, and PCE) were also examined. The present work opens up an attractive avenue to developing conjugated metallopolymers with broad and strong solar energy absorptions and tunable solar cell efficiency and supports the potential of metalated conjugated polymers for efficient power generation.  相似文献   
49.
对采用金属诱导单一方向横向晶化(metal induced unilaterally crystallization,MIUC)并结合激光后退火技术,以提高多晶硅薄膜晶体管的性能,进行了深入研究.MIUC薄膜晶体管已具有良好的器件性能和均匀性,再加以三倍频YAG激光退火后的MIUC薄膜晶体管,其场效应迁移率则可提高近一倍.器件的多种性能和参数的均匀性与所用修饰性的激光处理条件密切相关,具有规律性,故而是可控的,这为工业化技术的掌控提供了基础.  相似文献   
50.
Carbon nanotube (CNT) arrays/films were transferred onto copper substrates via eutectic tin/lead (SnPb) solder pastes. The morphologies, thermal stabilities, adhesion to substrates, and electrical properties of the as-transferred CNT arrays were studied. The CNT arrays generated negligible expansion or contraction below 250°C. The adhesion of CNT arrays to the substrate was significantly improved by the transfer process. An ohmic contact was formed between the transferred CNT arrays and the Sn-Pb solder. Four-probe electrical measurements yielded the resistance of the as-transferred CNT films under the electrode to be around 0.0056 Ω, from which the resistivity of each individual CNT tube was calculated to be 2.44 × 10−4 Ω cm.  相似文献   
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