Joint decision of product configuration and remanufacturing for product family design

Product family design (PFD) is a popular method for increasing product variety to satisfy the needs of diversified markets. With the increasing concern for environmental friendliness in society, more and more companies develop launching remanufactured products and include them in their product families. Therefore, PFD should be considered in a broad decision space where configuration of product variants and remanufacturing are considered simultaneously. However, this issue was not addressed properly in previous research. In this paper, a methodology for joint decision of product configuration and remanufacturing is proposed in which a bi-objective mixed integer programming model is formulated to determine the configurations of both new and remanufactured products for minimising product cost, maximising total market share, and satisfying reliability requirements. Then, Non-dominated Sorting Genetic Algorithm II (NSGAII) is adopted to solve the optimization problem. Computational experiments were conducted and their results show that NSGAII is convergent to the model well. A case study is presented to illustrate the applicability and effectiveness of the proposed methodology.     

Photocatalytic mechanism of high-activity anatase TiO<Subscript>2</Subscript> with exposed (001) facets from molecular-atomic scale: HRTEM and Raman studies

Anatase TiO₂ with a variant percentage of exposed (001) facets was prepared under hydrothermal processes by adjusting the volume of HF, and the photocatalytic mechanism was studied from atomic-molecular scale by HRTEM and Raman spectroscopy. It was revealed that: 1) From HRTEM observations, the surface of original TiO₂ with exposed (001) facets was clean without impurity, and the crystal lattice was clear and completed; however, when mixed with methylene blue (MB) solution, there were many 1 nm molecular absorbed at the surface of TiO₂; after the photocatalytic experiment, MB molecules disappeared and the TiO₂ lattice image became fuzzy. 2) The broken path of the MB chemical bond was obtained by Raman spectroscopy, i.e., after the irradiation of the light, the vibrational mode of C-N-C disappeared due to the chemical bond breakage, and the groups containing C-N bond and carbon rings were gradually decomposed. Accordingly, we propose that the driving force for breaking the chemical bond and the disappearance of groups is from the surface lattice distortion of TiO₂ during photocatalyzation.     

Integration of geometric variation and part deformation into variation propagation of 3-D assemblies

This paper introduces a novel modelling method for variation propagation calculation of 3-D assemblies taking into account geometric variation and part deformation, which are neglected in most models in tolerance analysis. Initially, numerical studies are carried out in order to illustrate the characteristics of strain distribution in components and contact forces on the mating surfaces of a 3-D assembly. According to these characteristics, a linear equivalent model using springs to represent the elastic mating surfaces with geometric variation was presented. Then, the equilibrium criterions corresponding to actual contact situations and iterative searching algorithm of the equilibrium status of contacting were developed. The proposed modelling and calculation method were finally applied to the assembly of two machined parts, on which finite-element analyses and experimental tests were conducted to validate the effectiveness and accuracy. This linear contact model also shows an important advantage on modelling and calculating efficiency, which enable the practical application to variation propagation calculation in both tolerance design and assembly process.     

A performance analytical model of automated material handling system for semiconductor wafer fabrication system

To effectively analyse and evaluate the performances of closed-loop automated material handling system (AMHS) with shortcut and blocking in semiconductor wafer fabrication system, a modified Markov chain model (MMCM) has been proposed. The system characteristics, such as vehicle blockage and system’s shortcut configuration, are well considered in the MMCM. The state space explosion problem and computational challenge due to the increase of AMHS scale can be effectively eliminated. With production data from Interbay material handling system of a 300-mm semiconductor wafer fabrication line, the proposed MMCM is compared with simulation analysis model. The results demonstrate that the proposed MMCM is an effective modelling methodology for AMHS’s performance analysis at system design stage.