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11.
We demonstrate the first programmable group-delay module based on polarization switching. With a unique binary tuning mechanism, the device can generate any differential group delay value from -45 to +45 ps with a resolution of 1.40 ps, or any true-time-delay value from 0 to 45 ps with a resolution of 0.7 ps. The delay varying speeds for both applications are under 1 ms and can be as fast as 0.1 ms. We evaluate both the dynamic and static performances of the device while paying special attention to its dynamic figures of merit for polarization-mode dispersion emulation and compensation applications. Our experiment shows that the device exhibits a negligible transient-effect induced power penalty (<0.2 dB) in a 10-Gb/s nonreturn-to-zero system.  相似文献   
12.
The effect of the atomic mobility on a film surface has been studied by using a three-dimensional atomistic thin-film deposition model which simulates three-dimensional thin-film images, surface profiles and cross-sectional area pictures. In addition, quantitative results of surface RMS roughness, average film thickness, atomic coordination number and its distribution, and solid fraction of the deposited thin films, were obtained from the simulations. When the film surface mobility increased from 0.3 to 3.0, RMS roughness decreased from 6.5 to 1.1, solid fraction increased from 0.27 to 0.56 and average film thickness decreased from 40 to 28, due to the reduction of the voids within the film. The full-width half magnitude of the atomic coordination distribution became narrower indicating the increased degree of crystallization. With increase in surface mobility crossing the boundary to 1.5, the film evolved from a porous or loose columnar structure with voids, to a densely packed fibrous grain structure which can be categorized by the zone structure models.  相似文献   
13.
转移法色交换   总被引:1,自引:0,他引:1  
将图G的着色由一种变为中一种,通常用Kempe法以交换。但是,对于某些情况,用此法无效。针对这个问题,本文提出了一种转移法色交换,它适用于平面图着色,方法直观,清晰且有效。  相似文献   
14.
15.
The semiconductor device trend for increasing functionalities and performances yet with smaller overall feature sizes presents escalating obstacles to the decreasing form factor along with demanding thermal carrying capability required at the package level. To confront this compounding issue, ultrafine-pitch wirebond interconnect coupled with thermally enhanced copper heat spreader attached to the package are introduced. However, the additional copper heat spreader thickness introduced within the package challenges the design of the package's wire, its loop height, and the molding process control to prevent wire sweeping occurrences. This study investigates the impact of different ultrafine pitched wire types, wire loop designs, copper heat spreader structures, and mold material types on eliminating device short from occurring due to the wire sweeping phenomena. A full factorial experiment is performed using an active silicon device packaged in a thermally enhanced ball grid array (BGA) test vehicle. In addition, test characterization is carried out using x-ray and multiinsertions hot/cold continuity tests. Then, a detailed failure analysis is performed by package decapsulation and scanning electron microscopy/energy-dispersive x-ray (SEM/EDX) to confirm the experimental findings. In conclusion, the study finds that for an ultrafine-pitched thermally enhanced BGA package, wire type is insignificant to reduce wire shorting occurrences. However, mold material and copper heat spreader structure using an optimized wire loop design are significant factors in eliminating wiresweep shorting phenomena. This study concludes with a wirebond interconnect and heat slug design recommended along with an improved process parameters and assembly material sets found from the experiment.  相似文献   
16.
Crystallite growth characteristics of coprecipitated superfine zirconia powders have been investigated. It was found that the crystallite growth in powders follows a cubic law at 800 and 1000°C; however, the crystallite size data for compacts of both Y-TZP and YSZ cannot be fitted with a traditional parabolic or cubic law, but with a linear relation between crystallite size and the logarithm of time. In addition, it was also found that the degree of agglomeration of the powders can affect the crystallite growth.  相似文献   
17.
The paper describes some geotechnical properties of the soft soils in Guangzhou College City, China, which are difficult to both sample and test. Laboratory and in situ tests were carried out to assess the physical and mechanical indices of the soils. The data were statistically analyzed and linear regression undertaken such that equations could be developed by which the geotechnical properties of the soft soils can be predicted. The statistical validity of the degree of correlation confirmed that using these equations, the mechanical indices can be estimated from physical indices determined by routine testing.   相似文献   
18.
This paper addresses the general single-machine earliness-tardiness problem with distinct release dates, due dates, and unit costs. The aim of this research is to obtain an exact nonpreemptive solution in which machine idle time is allowed. In a hybrid approach, we formulate and then solve the problem using dynamic programming (DP), while incorporating techniques from branch-and-bound (BB). This approach (DP-BB) has been proven to be effective in solving certain types of scheduling problems. We further propose a new adaptation of the approach to a general problem with a nonregular objective function. To address some shortcomings of DP-BB, we also apply a BB approach in which partial dynamic programming dominance (BB-PDP) is exploited. Computational experiments were conducted with randomly generated test instances in order to evaluate the effectiveness of the two approaches. The results clearly showed that our new approaches can solve all the instances with up to 40 jobs and most of the instances with 50 jobs, which outperforms those frequently used approaches in scheduling research.  相似文献   
19.
20.
现场总线控制系统浅谈   总被引:1,自引:0,他引:1  
简述了现场总线控制系统的结构及其显优点。现场总线控制系统的结构包括:主控器、总线接口、电源、输入/输出接点、总线电揽和终端电阻。另外对其显优点做了逐一介绍。现场总线控制系统可在工业自动化控制系统中推广应用。  相似文献   
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