Simultaneous all-optical inverted and noninverted wavelength conversion using a single-stage fiber-optical parametric amplifier

We have demonstrated, for the first time to our knowledge, simultaneous all-optical inverted and noninverted wavelength conversion by using a single-stage two-pump fiber-optical parametric amplifier with an extinction ratio between 7 and 14 dB over 24 nm.     

Shift-full-rank matrices and applications in space-time trellis codes for relay networks with asynchronous cooperative diversity

To achieve full cooperative diversity in a relay network, most of the existing space-time coding schemes require the synchronization between terminals. A family of space-time trellis codes that achieve full cooperative diversity order without the assumption of synchronization has been recently proposed. The family is based on the stack construction by Hammons and El Gamal and its generalizations by Lu and Kumar. It has been shown that the construction of such a family is equivalent to the construction of binary matrices that have full row rank no matter how their rows are shifted, where a row corresponds to a terminal (or transmit antenna) and its length corresponds to the memory size of the trellis code on that terminal. We call such matrices as shift-full-rank (SFR) matrices. A family of SFR matrices has been also constructed, but the memory sizes of the corresponding space-time trellis codes (the number of columns of SFR matrices) grow exponentially in terms of the number of terminals (the number of rows of SFR matrices), which may cause a high decoding complexity when the number of terminals is not small. In this paper, we systematically study and construct SFR matrices of any sizes for any number of terminals. Furthermore, we construct shortest (square) SFR (SSFR) matrices that correspond to space-time trellis codes with the smallest memory sizes and asynchronous full cooperative diversity. We also present some simulation results to illustrate the performances of the space-time trellis codes associated with SFR matrices in asynchronous cooperative communications.     

A Study on the Pd/a-Si/Ni Seed Layer for Metal-Induced Lateral Crystallization and Poly-Si TFTs

The effect of Pd on the growth rate of metal-induced lateral crystallization (MILC) from Ni seed and the electrical properties of thin-film transistors (TFTs) fabricated on the films crystallized by MILC were investigated. When the Pd metal is placed on the amorphous-silicon/Ni-seed layer, the MILC growth rate is two to three times faster than that of conventional Ni-MILC, without any degradation of TFTs. These results were explained by a stress that is generated by the formation of Pd₂Si     

Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards

Multi-layered printed circuit boards (PCBs) contain a multi-layered structure that is suitable for high-speed and high-frequency applications. Hence, they are used extensively in electronic packaging assemblies for high-density applications. However, numerous composite parts and complex material properties of multi-layer PCBs complicate the reliability simulation of PCB model. This paper deals with a finite element analysis intended to describe numerically the behavior of multi-layered multi-materials PCB model (combination of metallic and composite plies) in the drop-impact performance. Through the comparison of physical drop test results, the fully multi-layered model illustrates higher accuracy if compared with that of the traditional simplified isotropic model and orthotropic model. The effects of material properties for the multi-layer PCB under drop-impact shock have also been investigated.     

Microstructure evolution of the Sn–Ag–y%Cu interconnect

The lead free Sn–Ag–y%Cu (y = 0.0, 0.5, 1.0 and 2.0) interconnect interfacial microstructures and the microstructure evolution under thermal treatment (isothermal aging, 150 °C/1000 h) were studied in detail by using surface microetching microscopy and cross section microscopy. The corresponding mechanical and reliability behaviors were evaluated by performing shear test and fracture mode analysis before and after the thermal treatment. The results indicate: (i) The interconnects could have different microstructures and intermetallic compound (IMC), depending on the Cu content. The Cu–Sn IMC could have microstructures that were clusters or protrusion-like, Augustine grass leaf-like, scissor-like, tweezers-like, etc. (ii) Ag₃Sn IMCs were not observed at time zero for any interconnect groups, but they occurred after the aging for all groups. The Ag₃Sn IMC could have different microstructures, again depending on Cu content. For low Cu content, the Ag₃Sn IMCs were granules or nodules; for higher Cu content, Ag₃Sn IMCs were plate-like. (iii) The growth of Ag₃Sn plates was promoted by the growth of Cu–Sn IMCs, but indirectly linked to the Cu content. (iv) High Cu content (1.0 wt% and higher) could degrade the mechanical and reliability performances of the LF interconnect by providing a brittle joint, which was mainly achieved through the substantial growth of Cu–Sn IMCs and Ag₃Sn plates.     

Structural reliability assessment of multi-stack package (MSP) under high temperature storage (HTS) testing condition

Wire ball open failure at the interface of the gold wire and bonding pad of a multi-stack package (MSP) under high temperature storage (HTS) condition of 150 °C is studied. Failure analysis using FIB-SEM was conducted by in-plane moiré interferometry and FEA to clarify the failure mechanism. The ball open failure due to Kirkendall void that results from metal diffusion at high temperature was accelerated by the tensile stress imposed at the gold wire. The tensile stress developed at the gold wire when packages showing different warpage behaviours were stacked. Mechanical interaction between top and bottom packages caused unstable warpage, readily twisted and saddled. The wire came in contact with the photo-sensitive solder resist (PSR) dam because of the unstable warpage and this contact resulted in tensile stress at the gold wires. Solder flux residues reacted with the encapsulant, and as a result, the encapsulant of the top package adhered to the chip of the bottom package, and this adherence created additional tensile stress at the gold wires. To reduce the tensile stress at the wires, the PSR dam was removed, loop shape was altered from 45° to 90°, water soluble flux was applied, and cleaning process was added. HTS reliability was significantly improved and guaranteed after reducing the tensile stress at the wires.     

网页数据智能抽取方法

根据所要抽取网页的特点，提出了一种基于网页结构和ontology领域知识的自动网页数据抽取。并且使得ontology在数据抽取的过程中自动扩充。     

基于模糊AHP的TOPSIS评估方法研究

对于模糊环境下的评估,存在固有的不确定性和不精确性信息比较的情况。在AHP的框架下,通过三角模糊数表示元素之间的比较比率,定义了两个模糊数之间的距离,利用模糊综合扩展分析方法构造决策矩阵。根据理想近似方法,通过计算到正理想解和负理想解的距离求出每个方案的贴近系数,得出候选者的评估顺序,并举例说明了应用这个方法的计算过程。     

基于ARM的广播发射机微控制器硬件系统设计

应用Samsung公司的S3C44B0X嵌入式芯片构建硬件平台,设计广播发射机微控制器。按照其在广播发射机监测控制系统中的控制特点,介绍和论述该微控制器的硬件结构。与传统的基于8/16位单片机构建的系统相比,由于S3C44B0X芯片内置多种实用外设可大大简化电路,从而提高了系统的可靠性,增强了系统抗干扰能力。     

A Continuum Mechanics Approach for Crack Initiation and Crack Growth Predictions

Very often, different approaches are used for crack initiation and crack growth predictions. The current article introduces a recently developed approach that can be used for the predictions of both crack initiation and crack propagation. A basic assumption is that both crack nucleation and crack growth are governed by the same fatigue damage mechanisms and a single fatigue damage criterion can model both stages. A rule is that any material point fails to form a fresh crack if the total accumulated fatigue damage reaches a limit. For crack initiation predictions, the stresses and strains are obtained either directly from experiments or though a numerical analysis. For the prediction of crack growth, the approach consists of two steps. Elastic‐plastic stress analysis is conducted to obtain the detailed stress‐strain responses. A general fatigue criterion is used to predict fatigue crack growth. Compact specimens made of 1070 steel were experimentally tested under constant amplitude loading with different R‐ratios and the overloading influence. The capability of the approach to predict both crack initiation and the crack growth under these loading conditions was demonstrated by comparing the predictions with the experimental observations.