Design, modeling, and hardware correlation of a 3.2Gb/s/pair memory channel

With the rapid advance of silicon process technology, it is now possible to design input/output (I/O) circuits that operate at multigigabit data rates. As a result, accurate modeling and analysis of high-speed interconnect systems is essential to optimize the performance of the overall system. This paper describes the interconnect design, modeling, simulation, and characterization methodologies that are essential to achieve multigigabit data rates. It focuses on the physical layer verification and hardware correlation of functional systems and silicon to ensure robust system operation over 3.2Gb/s data rate using conventional low-cost packaging and printed circuit board (PCB) technologies. In order to capture conductor and dielectric losses, as well as other high-frequency effects of three-dimensional structures, accurate measurement-based simulation techniques that directly incorporate frequency-domain parameters from measurement or electromagnetic solver parameters into circuit simulation tools using fast Fourier transform (FFT) and bandlimiting windowing techniques are developed. Finally, simulation waveforms are correlated with prototypes at both component and system levels in both time and frequency domains.     

Process and design analysis for ultrafine-pitched wiresweep elimination in advanced copper heat spreader BGA package

The semiconductor device trend for increasing functionalities and performances yet with smaller overall feature sizes presents escalating obstacles to the decreasing form factor along with demanding thermal carrying capability required at the package level. To confront this compounding issue, ultrafine-pitch wirebond interconnect coupled with thermally enhanced copper heat spreader attached to the package are introduced. However, the additional copper heat spreader thickness introduced within the package challenges the design of the package's wire, its loop height, and the molding process control to prevent wire sweeping occurrences. This study investigates the impact of different ultrafine pitched wire types, wire loop designs, copper heat spreader structures, and mold material types on eliminating device short from occurring due to the wire sweeping phenomena. A full factorial experiment is performed using an active silicon device packaged in a thermally enhanced ball grid array (BGA) test vehicle. In addition, test characterization is carried out using x-ray and multiinsertions hot/cold continuity tests. Then, a detailed failure analysis is performed by package decapsulation and scanning electron microscopy/energy-dispersive x-ray (SEM/EDX) to confirm the experimental findings. In conclusion, the study finds that for an ultrafine-pitched thermally enhanced BGA package, wire type is insignificant to reduce wire shorting occurrences. However, mold material and copper heat spreader structure using an optimized wire loop design are significant factors in eliminating wiresweep shorting phenomena. This study concludes with a wirebond interconnect and heat slug design recommended along with an improved process parameters and assembly material sets found from the experiment.     

间接原子吸收分光光度法测定聚丙烯、聚乙烯中的微量(?)

介绍用原子吸收分光光度法测定PE、PP氯含量。该方法采用氧气燃烧法处理样品,用Ag~+沉淀Cl~-,经分离后用原子吸收光谱测溶液中剩余Ag~+浓度,从而得到样品中氯含量。讨论了仪器参数、操作条件对测定结果的影响,结果表明,在分离前存放4～30分钟对测试结果无影响。火焰法的测定条件为波长328.1nm、灯电流7.5mA、狭缝宽度0.4nm、C_2H_2压力0.025MPa、空气压0.16MPa、燃烧器高度7.5mm。实验采用的离心转速2000r/min、时间5分钟、HNO_3浓度1%。该法灵敏度可达0.1μg/ml、相对标准误差<2%。     

破片式战斗部优化设计技术研究

侧重研究了破片式战斗部装药外形的优化设计技术。提出了装药外形与破片飞散特性（如破片飞散角，分布带宽等）之间的数学描述；建立了圆弧和对数螺线装药外形母线与战斗部其他设计参数间的数学模型。在假定约束条件下，优化设计了破片了聚焦式战斗部的结构参数；静爆试验结果表明，破片分布与理论计算吻合较好。     

MX345芯片及单片机控制

MX345芯片用于产生模拟信令—CTCSS单音.本文在介绍MX345编码/解码器工作原理的基础上,设计出MX345芯片与单片机的接口电路.最后给出控制软件.     

Crystallite growth characteristics in superfine zirconia powders and compacts

Crystallite growth characteristics of coprecipitated superfine zirconia powders have been investigated. It was found that the crystallite growth in powders follows a cubic law at 800 and 1000°C; however, the crystallite size data for compacts of both Y-TZP and YSZ cannot be fitted with a traditional parabolic or cubic law, but with a linear relation between crystallite size and the logarithm of time. In addition, it was also found that the degree of agglomeration of the powders can affect the crystallite growth.     

高度有序多孔氧化铝模板的制备工艺与生长机制的研究

采用二次氧化法制备出高度有序的多孔氧化铝模板，结合扫描电镜和原子力显微镜对其结构、形貌进行观察和表征。研究了铝箔预处理和温度等对多孔氧化铝模板孔洞有序性的影响，讨论了有序孔洞的自组织生长机理。     

-35~#轻柴油的生产

为满足市场发展的需求 ,胜利炼油厂用胜利混合原油为原料 ,根据用户要求成功开发生产了 -3 5 #轻柴油新产品。该产品完全符合国家标准GB2 5 2 -2 0 0 0中 -3 5 #轻柴油的各项质量指标要求 ,为胜利炼油厂赢得市场 ,增加了经济效益