Taxation on vehicle fuels: its impacts on switching to cleaner fuels

Vehicular consumption of fossil fuel contributes over 90% of air pollution in Hong Kong. A key strategy to improve Hong Kong's air quality is to discourage dirty fuels (e.g., leaded petrol and high-sulphur diesel) and to promote the use of clean fuels (e.g., low-sulphur diesel and liquefied petroleum gas (LPG)). This paper presents the empirical evidence on the effectiveness of the Government's clean fuel programs that offer tax subsidy to lower the consumption cost of such fuels. For the cases of unleaded petrol and ultra-low-sulphur diesel, lower fuel duties were offered so that the prices of these fuels were below those of leaded petrol and conventional diesel. Conventional petrol and diesel were phased out. In order to decide on the level of fuel duty concessions required to introduce LPG for taxis and bio-diesel for other vehicles, various Government-run trial programs were introduced to obtain cost estimates of using these alternative cleaner fuels. LPG using vehicles were subsequently exempted from the fuel duty in order to attract taxi and light bus operators to switch to LPG. It is apparent that the higher the subsidy, the faster is the rate at which switching to cleaner fuels takes place.     

Solder joint reliability of TFBGA assemblies with fresh and reworked solder balls

In this article, the solder joint reliability of thin and fine-pitch BGA (TFBGA) with fresh and reworked solder balls is investigated. Both package and board level reliability tests are conducted to compare the solder joint performance of test vehicle with fresh and reworked solder balls. For package level reliability test, ball shear test is performed to evaluate the joint strength of fresh and reworked solder balls. The results show that solder balls with rework process exhibit higher shear strength than the ones without any rework process. The results also exhibit that the different intermetallic compound (IMC) formation at solder joints of fresh and reworked solder balls is the key to degradation of shear strength. For board level reliability tests, temperature cycling and bending cyclic tests are both applied to investigate the fatigue life of solder joint with fresh and reworked solder balls. It is observed that package with reworked solder ball has better fatigue life than the one with fresh solder ball after temperature cyclic test. As for bending cyclic test, in addition to test on as-assembled packages, reworked and fresh samples are subjected to heat treatment at 150 °C for 100 h prior to the bending cyclic test. The purpose is to let Au–Ni–Sn IMC resettle at solder joints of fresh solder ball and examine the influence of Au–Ni–Sn IMC on the fatigue life of solder joints (Au embrittlement effect). The final results confirm that reworked solder balls have better reliability performance than fresh one since Au embrittlement dose exist at fresh solder ball.     

Two-stage cut saturation algorithm for designing all-opticalnetworks

We design and optimize the physical topology of all-optical networks. This problem is more challenging than the traditional one for electronic communication networks, because of the wavelength-continuous constraint and it involves routing and wavelength assignment. In this problem, we are given the number of lightpaths required by every node pair and a cost specification, and our objective is to determine a physical topology of minimal cost. We formulate the problem, prove that it is NP-hard, and design an efficient algorithm called two-stage cut saturation algorithm for it. In the first stage, we relax the wavelength-continuous constraint and apply the main idea of the cut saturation method to determine a good initial network. In the second stage, we impose the wavelength-continuous constraint and perform routing and wavelength assignment to establish the specified lightpaths on the initial network. When some lightpaths cannot be established, we apply the main idea of the cut saturation method to optimize the insertion of additional links into the network. Simulation results show the following: (1) the proposed algorithm can efficiently design networks with low costs and high utilization and (2) if wavelength converters are available to support full wavelength conversion, the total cost of the links can be significantly reduced     

Polarization-based cooperative directional MAC protocol for ad hoc networks

Numerous directional medium access control (DMAC) protocols have been developed to enhance the capacity of ad hoc networks using the underlying advanced physical layer techniques, such as beam-forming, multiuser detection (MUD), and multiple-input–multiple-output (MIMO). In this paper, we propose an innovative fully distributed DMAC protocol that cooperatively makes use of polarization diversity in low-mobility urban/suburban outdoor wireless ad hoc network environment. In the proposed cooperative polarization DMAC protocol (CPDMAC), each node directionally senses on both vertical and horizontal polarizations and dynamically adapts polarization that minimizes overall interference in the ad hoc network. Analysis is performed to establish relationship between vertically and horizontally polarized nodes in the network. Further, a theoretical lower bound is derived for probability of successful transmission to show capacity improvement as a function of cross polarization ratio (CPR). Simulation results confirm from 2% up to 400% improvement in average node throughput at data rate of 1.95 Mbps when compared to the traditional DMAC protocol. Moreover, our study clearly shows that the average throughput difference increases with increasing node density when compared to the traditional DMAC protocol.     

Comparative study of micro-BGA reliability under bending stress

The micro-ball grid array (/spl mu/BGA), a form of chip scale package (CSP), was developed as one of the most advanced surface mount devices, which may be assembled by ordinary surface mount technology. In the latest /spl mu/BGA type, eutectic tin-lead solder ball bumps are used instead of plated nickel and gold (Ni/Au) bumps. Assembly and reliability of the /spl mu/BGA's PCB, which is soldered by conventional surface mount technology, has been studied in this paper. The bending cycle test (1000 /spl mu//spl epsi/ to -1000 /spl mu//spl epsi/), is used to investigate the fatigue failure of solder joints of /spl mu/BGA, PBGA, and CBGA packages reflowed with different heating factors (Q/sub /spl eta//), defined as the integral of the measured temperature over the dwell time above liquidus (183/spl deg/C). The fatigue lifetime of the /spl mu/BGA assemblies firstly increases and then decreases with increasing heating factor. The greatest lifetime happens while Q/sub /spl eta// is near 500 second-degree. The optimal Q/sub n/ range is between 300 and 750 s/spl deg/C. In this range, the lifetime of the /spl mu/BGA assembly is greater than 4500 cycles if the assemblies are reflowed in nitrogen ambient. SEM micrographs reveal that both /spl mu/ & P-BGA assemblies fail in the solder joint at all heating factors. All fractures are near and parallel to the PCB pad. In the /spl mu/BGA assemblies cracks always initiate at the point of the acute angle where the solder joint joins the PCB pad, and then propagate in the section between the Ni/sub 3/Sn/sub 4/ intermetallic compound (IMC) layer and the bulk solder. In the CBGA assembly reliability test, the failures are in the form of delamination, at the interface between the ceramic base and metallization pad.     

Study of the self-alignment of no-flow underfill for micro-BGA assembly

As a concept to achieve high throughput low cost flip-chip assembly, a process development activity is underway, implementing next generation flip-chip processing based on large area underfill printing/dispensing, IC placement, and simultaneous solder interconnect reflow and underfill cure. The self-alignment of micro-BGA (ball grid array, BGA) package using flux and two types of no-flow underfill is discussed in this paper. A “rapid ramp” temperature profile is optimized for reflow of micro-BGA using no-flow underfill for self-aligning and soldering. The effect of bonding force on the self-alignment is also described. A SOFTEX real time X-ray inspection system was used to inspect samples to ensure the correct misalignment before reflow, and determine the residual displacement of solder joints after reflow. Cross-sections of the micro-BGA samples are taken using scanning electronic microscope. Our experimental results show that the self-alignment of micro-BGA using flux is very good even though the initial misalignment was greater than 50% from the pad center. When using no-flow underfill, the self-alignment is inferior to that of using flux. However, for a misalignment of no larger than 25% from the pad center, the package is also able to self-align with S1 no-flow underfill. However, when the misalignment is 37.5–50% from the pad center, there are 10–14% residual displacement after reflow. The reason is the underfill resistant force inhibiting the self-alignment of the package due to rapid increment of underfill viscosity during reflow. The self-alignment of micro-BGA package using no-flow underfill allows only <25% misalignment prior to the soldering. During assembling, although the bonding force does not influence on the self-alignment of no-flow underfill, a threshold bonding force is necessary to make all solder balls contact with PCB pads, for good soldering. The no-flow underfill is necessary to modify the fluxing/curing chemistry for overcoming the effect of tin metal salt produced during soldering on underfill curing, and for maintaining the low viscosity during soldering to help self-alignment.     

Modal Analysis of Microstrip Antenna on Fiber Reinforced Anisotropic Substrates

In this communication, microstrip antenna on fiber reinforced anisotropic substrates has been considered in aerospace applications; however, the antenna's optical axis may not necessarily be colinear with any of the substrate's principal axes and that leads to a nondiagonal permittivity matrix (tensor). This work extends the studies of microstrip antenna on isotropic substrate and on uniaxial substrate to analyze antenna performance on fiber reinforced anisotropic substrates, where the permittivity matrix has five dielectric constants because of the substrate's fiber direction. The solution is based on modal analysis so that the wave immittance can be derived in a closed form. Analyses and experimental verification show that the antenna performance is strongly influenced not only by the permittivity along the principal axes but also by the fiber direction of the substrate.     

Design of Stepped-Impedance Combline Bandpass Filters With Symmetric Insertion-Loss Response and Wide Stopband Range

An enhanced stepped-impedance combline bandpass filter employs an array of stepped-impedance resonators with tapped-transformer coupling at input and output is presented in this study. This filter has enhanced performance, including symmetric insertion-loss response around the passband and wider stopband range. The structure is compact and suitable for multilayer realization because it is free of lumped capacitors and has fewer via-hole grounds. The circuit is investigated with the characteristic mode theory of coupled lines to prove the existence of multiple transmission zeros around the passband. Numerous diagrams are given for circuit design purposes. The second- and fourth-order bandpass filters at 2.45 GHz were designed, measured, and compared with the conventional combline structure to demonstrate their performance enhancement.     

CMOS Outphasing Class-D Amplifier With Chireix Combiner

This letter presents a CMOS outphasing class-D power amplifier (PA) with a Chireix combiner. Two voltage-mode class-D amplifiers used in the outphasing system were designed and implemented with a 0.18-mum CMOS process. By applying the Chireix combiner technique, drain efficiency of the outphasing PA for CDMA signals was improved from 38.6% to 48% while output power was increased from 14.5 to 15.4 dBm with an adjacent channel power ratio of -45 dBc.     

Coherent frequency/phase modulation scheme

An L-phase-levelled coherent frequency/phase modulation (LCFPM) scheme is proposed and analysed for additive white Gaussian noise channels. The optimised LCFPM scheme with L>2 is found to have superior bandwidth efficiency to the conventional dual-frequency quadrature frequency/phase modulation scheme