视场非完全重叠的分布式雷达多目标跟踪方法

在探测能力、波形设计及天线指向等因素制约下,分布式雷达视场并非完全重合,由此造成的观测信息差异给后续信息融合带来了巨大挑战。该文基于高斯混合实现的集势概率假设密度(CPHD)滤波器,提出了一种视场部分重叠下的分布式雷达多目标跟踪方法。首先,利用多目标密度乘积切分出概率假设密度(PHD)中表征共同观测信息的部分;之后,标准的分布式融合(算术平均或几何平均融合)方法作用于切分出的共同观测目标信息以提升跟踪性能,补偿融合则作用于雷达单独观测目标信息以扩展视场范围。该文方法无须视场先验信息,能够适应雷达视场未知时的分布式融合多目标跟踪场景。仿真实验验证了所提出方法在未知、时变雷达视场下跟踪多目标的性能,表明了该文方法比基于高斯混合的聚类方法性能更好。      

编码协作系统准循环重复累积码的联合设计与性能分析

重复累积(RA)码是一种特殊结构的低密度奇偶校验(LDPC)码,不仅具有LDPC码的优点,还能实现差分编码。针对LDPC编码协作系统编码复杂度高、时延长的问题,该文引入准循环RA(QC-RA)码,推导出信源节点和中继节点采用的QC-RA码对应的联合校验矩阵,基于公差构造方法设计该联合校验矩阵,并证明该方法设计的联合校验矩阵不存在围长为girth-4, girth-6的短环。理论分析和仿真结果表明,同等条件下该系统比相应点对点系统具有更优异的误码率性能。仿真结果同时表明,与采用一般构造QC-RA码或基于Z型构造QC-RA码相比,采用基于公差构造的联合设计QC-RA码的多信源多中继协作均可获得更高的编码增益。     

基于B-样条曲线暗通道的图像去雾算法

针对暗原色去雾算法在高亮背景图像中出现光晕（Halo）效应的问题,提出一种基于B-样条曲线加gamma（γ）修正透射率去除Halo效应的算法。通过分析暗原色透射率图像的统计直方图,得出Halo效应的产生是由于HE算法透射率直方图中低灰度值占比较大,因此需要对直方图低灰度包络进行修正。寻找直方图中第1个低灰度波峰,在2个波谷间进行子区间分割,并以区间边界点作为样条区间节点计算三次样条曲线,以拟合低灰度包络。基于透射率图中修正位置对修正结果的关键性作用,采用改进的大津法从横向和纵向两个维度对透射率图进行分割,以确定修正区域,实现精准补偿,提高抗噪性能。根据不同雾图选择合适的γ修正系数修正拟合的灰度包络并对图像进行还原,验证不同修正系数对结果的影响。实验结果表明,当修正系数γ>1.5时,Halo效应能被有效减缓或消除,与HE算法相比,该算法的对比度、信息熵最大可分别提高10.1%和9.9%,算法并行度可达到M或N级。     

Multi-response optimization of the electrical discharge machining of insulating zirconia

In this study, electrical discharge machining has been used to machine insulating zirconia via the assisting electrode method. The process parameter optimization was investigated by combining the Taguchi method with grey relational analysis. The application of Taguchi–grey relational analysis is proven to effectively improve the performance of electrical discharge machining in drilling insulating zirconia. The results of this analysis indicate that the final optimal process parameters are a peak current of 8 A, a pulse duration of 16?µs, a duty cycle of 0.5, and a flushing pressure of 6?MPa. Additionally, the material removal rate, electrode wear rate, and hole taper ratio increase by 39%, 1.5%, and 1.3%, respectively, which improves the grey relational grade by 6.8%. The electrical resistance test confirms that the conductivity of the conductive layer obtained using the final optimal process parameters is better than that of the conductive layer obtained using the initial optimal process parameters. Energy spectrum analysis reveals that the conductive layer is composed of C, Cu, Zn, Zr, and O. Analysis of variance shows that the most significant component of the multi-responses is the peak current, with a 51.4% contribution.     

铸造Al-Cu合金凝固缺陷研究现状

铸造Al-Cu合金的凝固缺陷严重影响了铸件的性能,控制或消除凝固缺陷对提高铸件成品率有重大意义。综述了铸造Al-Cu合金在工程中出现的常见凝固缺陷,如偏析、热裂、显微疏松、缩孔等。重点分析了各类缺陷的形成机理与特点,从合金化、熔铸工艺、热处理工艺、数值模拟等角度提出了减少铸造Al-Cu合金凝固缺陷的方法。     

超声探伤仪水平线性误差测量不确定度评定

本文结合单位实际检测工作,依据JJG746-2004《超声探伤仪》计量检定规程,对超声探伤仪的水平线性误差测量不确定度进行了评定。     

Composite bending-dominated hollow nanolattices: A stiff,cyclable mechanical metamaterial

Manufacturing ultralight and mechanical reliable materials has been a long-time challenge. Ceramic-based mechanical metamaterials provide significant opportunities to reverse their brittle nature and unstable mechanical properties and have great potential as strong, ultralight, and ultrastiff materials. However, the failure of ceramics nanolattice and degradation of strength/modulus with decreasing density are caused by buckling of the struts and failure of the nodes within the nanolattices, especially during cyclic loading. Here, we explore a new class of 3D ceramic-based metamaterials with a high strength–density ratio, stiffness, recoverability, cyclability, and optimal scaling factor. Deformation mode of the fabricated nanolattices has been engineered through the unique material design and architecture tailoring. Bending-dominated hollow nanolattice (B-H-Lattice) structure is employed to take advantages of its flexibility, while a few nanometers of carbonized mussel-inspired bio-polymer (C-PDA) is coherently deposited on ceramics’ nanolayer to enable non-buckling struts and bendable nodes during deformation, resulting in reliable mechanical properties and outperforming the current bending-dominated lattices (B-Lattices) and carbon-based cellulose materials. Meanwhile, the structure has comparable stiffness to stretching-dominated lattices (S-Lattices) while with better cyclability and reliability. The B-H-Lattices exhibit high specific stiffness (>10⁶?Pa·kg^?1·m^?3), low-density (～30?kg/m³), buckling-free recovery at 55% strain, and stable cyclic loading behavior under up to 15% strain. As one of the B-Lattices, the modulus scaling factor reaches 1.27, which is lowest among current B-Lattices. This study suggests that non-buckling behavior and reliable nodes are the key factors that contribute to the outstanding mechanical performance of nanolattice materials. A new concept of engineering the internal deformation behavior of mechanical metamaterial is provided to optimize their mechanical properties in real service conditions.     

Formation of Cu Nanodots on Diamond Surface to Improve Heat Transfer in Cu/D Composites

Diamond‐dispersed copper matrix (Cu/D) composite materials with different interfacial configurations are fabricated through powder metallurgy and their thermal performances are evaluated. An innovative solution to chemically bond copper (Cu) to diamond (D) has been investigated and compared to the traditional Cu/D bonding process involving carbide‐forming additives such as boron (B) or chromium (Cr). The proposed solution consists of coating diamond reinforcements with Cu particles through a gas–solid nucleation and growth process. The Cu particle‐coating acts as a chemical bonding agent at the Cu–D interface during hot pressing, leading to cohesive and thermally conductive Cu/D composites with no carbide‐forming additives. Investigation of the microstructure of the Cu/D materials through scanning electron microscopy, transmission electron microscopy, and atomic force microscopy analyses is coupled with thermal performance evaluations through thermal diffusivity, dilatometry, and thermal cycling. Cu/D composites fabricated with 40 vol% of Cu‐coated diamonds exhibit a thermal conductivity of 475 W m^?1 K^?1 and a thermal expansion coefficient of 12 × 10^?6 °C^?1. These promising thermal performances are superior to that of B‐carbide‐bonded Cu/D composites and similar to that of Cr‐carbide‐bonded Cu/D composites fabricated in this study. Moreover, the Cu/D composites fabricated with Cu‐coated diamonds exhibit higher thermal cycling resistance than carbide‐bonded materials, which are affected by the brittleness of the carbide interphase upon repeated heating and cooling cycles. The as‐developed materials can be applicable as heat spreaders for thermal management of power electronic packages. The copper‐carbon chemical bonding solution proposed in this article may also be found interesting to other areas of electronic packaging, such as brazing solders, direct bonded copper substrates, and polymer coatings.