Proposal of failure criterion applicable to finite element analysis results for wall-thinned pipes under bending load

In this work, a failure criterion applicable to large strain Finite Element Analysis (FEA) results was proposed in order to predict both the fracture mode (collapse or cracking) and the limit bending load of wall-thinned straight pipes. This work was motivated from the recent experimental results of Tsuji and Meshii (2011); that is, fracture mode is not always collapse, and the fracture mode affects the limit bending load. The key finding in comparing their test results and a detailed large strain FEA results was that the Mises stress distribution at the limit bending load of a flawed cylinder was similar to that of a flawless cylinder; specifically, in case of collapse, the Mises stress exceeded the true yield stress of a material for the whole “volume” of a cylinder with a nominal wall thickness. Based on this finding, a failure criterion applicable to large strain FEA results of wall-thinned straight pipes under a bending load that can predict both fracture mode and limit bending load was proposed and was named the Domain Collapse Criterion (DCC). DCC predicts the limit bending load as the lower value of either the M_c^FEA, which is the load at which the Mises stress exceeds the true yield strength of a straight pipe for the whole “volume” with a nominal wall thickness (fracture mode: collapse), or the M_c^FEAb, which is the load at which the Mises stress in a section of the flaw ligament exceeds the true tensile stress (fracture mode: cracking). The results showed that the DCC could predict the fracture mode appropriately and the experimental limit bending load fundamentally on the conservative side within a maximum 20% difference regardless of the fracture mode. Another advantage of the DCC is that it uses the true yield and true tensile strength as the critical strength of the material and not the ambiguous flow strength.     

Microfabrication of polytetrafluoroethylene using SR direct etching

Polytetrafluoroethylene (PTFE) is a very attractive material for various fields because of its chemical resistance, insulation properties, and hydrophobic properties. However, it is difficult to fabricate PTFE microstructures with conventional techniques such as semiconductor processes or micromachining. We have succeeded in the fabrication of high‐aspect‐ratio microfluidics parts from PTFE by direct in‐vacuum photo‐etching utilizing synchrotron radiation (SR) at energy levels from 2 to 12 keV. This paper presents an analysis of the mechanisms of the PTFE microfabrication process and describes newly discovered processing characteristics of PTFE. © 2011 Wiley Periodicals, Inc. Electr Eng Jpn, 178(4): 49–54, 2012; Published online in Wiley Online Library ( wileyonlinelibrary.com ). DOI 10.1002/eej.21152     

Effect of W-Mo balance and boron nitrides on creep rupture ductility of 9Cr steel

The effect of W-Mo balance and boron nitrides (BN) on creep rupture ductility has been investigated for five heats of 9% Cr steel with 1.5% Mo equivalent, 0.003% boron and 0.05% nitrogen at 600^oC, 650^oC and 700^oC. The maximum time to rupture was 68,718 h at 650^oC. The reduction of area (RA) slightly decreases for up to about 8000 and 1000 h at 600 and 650^oC, respectively, while it significantly decreases above those. The BN particles are responsible for the degradation in RA at low stresses and long times by accelerating the formation of creep voids. At high stresses and short times, the RA decreases with increasing time to rupture and with increasing W concentration and concomitantly with decreasing Mo concentration. The rupture ductility is evaluated by using a semi-logarithmic diagram of the RA and total elongation, showing the necking dominant and void swelling dominant regions.     

Simultaneous B-M-mode scanning method for real-time full-range Fourier domain optical coherence tomography

High-speed complex full-range Fourier domain optical coherence tomography (FD-OCT) is demonstrated. In this FD-OCT, the phase modulation of a reference beam (M scan) and transversal scanning (B scan) are simultaneously performed. The Fourier transform method is applied along the direction of the B scan to reconstruct complex spectra, and the complex spectra comprise a full-range OCT image. Because of this simultaneous B-M-mode scan, the FD-OCT requires only a single A scan for each single transversal position to obtain a full-range FD-OCT image. A simple but slow version of the FD-OCT visualizes the cross section of a plastic plate. A modified fast version of this FD-OCT investigates a sweat duct in a finger pad in vivo and visualizes it with an acquisition time of 27 ms.     

Integrated protocol for optimized link state routing and localization: OLSR-L

Localization protocol is important for estimating node positions in a wireless multi-hop network. Routing protocol is also important for controlling paths. In previous research, localization and routing protocols have been discussed and evaluated separately. In this paper, we propose an integrated protocol for optimized link state routing (OLSR) and OLSR based localization (ROULA). Our protocol enables simultaneous localization and routing. ROULA’s localization is performed using OLSR overhead such as hello packets and routing tables. The routing overheads and the processing procedures can be efficiently integrated. We demonstrate that the integrated protocol for ROULA and OLSR enables simultaneous localization and routing.     

Calculations of heats of formation for nitroaromatics with PM3 and MM2

Abstract

We have attempted to calculate heats of formation (Δ H _f °) for various aromatic nitro compounds with the semi-empirical molecular orbital theory and the molecular mechanics. As the results we may say that PM3, a semi-empirical MO method, and MM2, molecular mechanics, can estimate Δ H _f ° of energetic materials with accuracy enough to use Δ H_f° for energy hazards prediction. In case of aromatic polynitro compounds, both methods may be able to calculate accurate Δ H_f°.     

Vertical liquid transportation through capillary bundle structure using centrifugal force

The use of three-dimensional (3D) microstructures is becoming essential attempt to develop next generations’ microdevices, to integrate many modules and various functions, and enhance the performance of device. In this paper, we present a new concept for lab on a chip using 3D structure and centrifugal pumping for integrated functional fluid systems such as high-throughput screening, and point of care testing systems which has stacked multiple structures with 3D-interconnection. The use of 3D structure brings many benefits for above high throughput systems, such as possibility to integrate various modules enabling to perform total assay operation, from sample preparation for biochemical reaction and their detection on one platform. For this concept, the most important key technology is control of a vertical valving and transportation of liquid between different 2D micro channel networks with different height levels. We demonstrated such vertical liquid transportation in 3D micro channel networks through the high aspect ratio capillary bundle filter by controlling spinning speed of device and centrifugal force as a pumping force, and confirmed capillary bundle could be employed as vertical microvalve for 3D fluidic systems using centrifugal force as a pumping method.     

Ultrasonic-Assisted Soldering of 5056 Aluminum Alloy Using Quasi-Melting Zn-Sn Alloy

To obtain sound butt-joints of 5056 aluminum alloy rods, ultrasonic-assisted soldering was conducted using Zn-18Sn and Zn-60Sn alloys. Each solder foil was inserted between rods of 5056 aluminum alloy. Ultrasonic vibration was propagated to faying surfaces at soldering temperatures below the liquidus temperature of the solder alloys, and then the samples were air cooled to room temperature. The optimum vibration time at the soldering temperature must be more than 2 seconds to have complete wetting and less than 4 seconds to avoid excessive dissolution of the 5056 alloy. The 5056 alloy joints soldered using quasi-melting. Zn-Sn alloys showed greater strength than the joints soldered at the temperatures over its respective liquidus temperature. As the soldering temperature was increased, the increased formation of the intermetallic compound Mg₂Sn or phases containing Mg generated by dissolution of 5056 into the solder layer decreased the joint strength. Ultrasonic-assisted soldering at an optimum temperature between solidus and liquidus of the Zn-Sn alloys is an important consideration for producing sound joints with sufficient strength.