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11.
Copoly(amide-ethers) containing two types of tertiary amine units were made as antistatic modifiers for poly(ethylene terephthalate) (PET) fibers. The filaments of the copolymers were melt-spun and reacted with three alkylating agents in order to quaternize the tertiary amine into a sulfo-betaine, a carbobetaine, and an ammonium ion. The apparent electric resistivity of the filaments was greatly reduced by this reaction, being in the range of 106 to 108 Ω/cm. However, because these quaternized copolymers incurred decomposition during blend spinning with PET, a blend PET fiber containing one type of copoly(amide-ether) was melt-spun and subjected to quaternization of the amino groups as well as to surface crosslinking with various alkylating and epoxy agents. The quaternized blend fibers obtained showed improved antistatic properties compared with the original blend fiber. Particularly, the fibers crosslinked with epoxy compounds were found to have the best antistatic properties that had ever been attained with this type of modification. The antistatic properties were retained even after dyeing, because both hydrophilic and ionic groups had been effectively immobilized on the surface. Since this quaternization and crosslinking could be conducted on-line with spinning and drawing within a short reaction time, this modification technique is called “spin-finishing method”, which should be superior to the conventional methods in terms of cost performance and productivity.  相似文献   
12.
2-Dibutylamino-1,3,5-triazine-4,6-dithiol (DB) and a mixture of DB and triallylisocyanurate (TAIC) were used as a lubricant during steel wire drawing due to a dry process. DB gave a polymer film with 180 nm in thickness to wire surfaces during the wire drawing. The polymer film had a disulfide structure on the backbone and contained a small amount of DB monomer and olygomer. Molecular weight and polymer weight increased with the drawing rate. The mixture of DB and TAIC gave mainly a three-dimensional polymer film with 225 nm in thickness to wire surfaces during drawing. The polymer film insoluble in THF had mono and disulfide structures and contained a small amount of linear polymer, DB, and TAIC. Such tribological polymerizations are estimated as follows: DB produces dithiyl radicals on a nascent surface formed during drawing and in the presence of oxygen and heat. The dithiyl radicals were polymerized by coupling with each other to give disulfide bonds or added to allyl groups in TAIC to give monosulfide bonds. It is concluded that this technique should be possible to use for unifying metal processing and surface treatment. © 1995 John Wiley & Sons, Inc.  相似文献   
13.
A new non-heating technique was developed for the sterilization of food stuff. Applying a roller compactor, ultra-high pressure sterilization has experimentally demonstrated its ability to sterilize dry powders, such as corn flour and Chinese herbs, with little quality deterioration. Also, the degree of food sterilization was found correlated well with the linear press forces between the rollers, roller gaps, and number of compaction passes. In comparison to the conventional high pressure sterilization technique, the new dry continuous processing method has the advantage of lower investment cost and is more versatile for sterilizing various food powders.  相似文献   
14.
Three-dimensional simulation using particle-thermal-fluid coupling scheme with a mixed Lagrangian-Eulerian approach is presented and the scheme is described by extending author's previous research [Y. Shimizu, 2004. “Fluid Coupling in PFC2D and PFC3D”, numerical modeling in micromechanics via particle methods—2004, Proceeding of 2nd International PFC Conference, Balkema, 2004, pp. 281-287]. The scheme solves the continuity, Navier-Stokes (N-S) and thermal energy equations numerically in Eulerian Cartesian coordinates, then derives pressure, velocity vectors and temperature for each fixed cell by considering particle existence. On the other hand, driving forces and thermal energy from fluid are applied to the particles as external body forces and a source term in the force-displacement law and the heat transfer calculations, respectively. This paper describes the thermal scheme for both fluid and particles. Results of two- and three-dimensional simulations involving forced convective heat transfer by fluid and conduction heat transfer within particles are presented.  相似文献   
15.
Three kinds of aramid fabrics, Technora (modified p-aramid), Conex (m-aramid) and Kevlar (p-aramid), were subjected to sputter etching and argon low-temperature plasma treatments after dyeing in black with disperse dyes. The depth of shade increased considerably on Technora and Kevlar with the sputter etching treatment, but not on Conex fabrics. Argon low-temperature plasma treatment had virtually no effect on the depth of shade on the aramid fabrics.  相似文献   
16.
S-menthyloxycarbonylmethyl l- and d-cysteines were prepared by the reaction of l- or d-cysteine and (?)-menthyl chloroacetate in liquid ammonia and were then polymerized to poly(S-menthyloxycarbonylmethyll- and d-cysteines) by the N-carboxyanhydride (NCA) method. From the results obtained by means of infra-red spectra, X-ray diffractions, optical rotatory dispersions (o.r.d.), and circular dichroisms (c.d.), poly(S-menthyloxycarbonylmethyl-l-cysteine) was found to be a right-handed α-helix in the solid state and in ethyl ether/chloroform and chloroform solutions. Similarly, poly(S-menthyloxycarbonylmethyl-d-cysteine) was a left-handed α-helix. The helix-coil transition of these polymers was observed in the vicinity of 3–4% trifluoroacetic acid (TFA) in chloroform/TFA mixtures.  相似文献   
17.
It is necessary for encapsulants to have not only a suitable coefficient of thermal expansion (CTE) compatible to IC devices and a low dielectric constant to reduce the device propagation delay, but also a high thermal conductivity to dissipate large amounts of heat from power-hungry, high-speed IC and high-density packages. Fillers such as silica have been mixed with polymers to improve their properties. Aluminum nitride (AlN) is considered as an alternative one, because it has a higher theoretical thermal conductivity of ∼320 W/mK1, a compatible CTE with silicon chips and a low dielectric constant. Commercial AlN fillers are angular in shape, because they are prepared via grinding coarse AlN powders synthesized by direct nitridation of aluminum metal and classification. The angular AlN are not expected to have high fluidity when mixed with polymers and hence low packing density. Recently, we successfully obtained single-crystalline spherical AlN fillers. Furthermore, polymer composites filled with the spherical AlN showed excellent thermal conductivity (>8 W/mK) as encapsulants for dissipating the heat generated in electronic devices.  相似文献   
18.
A complex perovskite of Sr(Cu x Zn1- x )1/2 W1/2O3 (SCZW) is synthesized by a new combination of wet and dry processess. Mixed oxides containing Cu2+ and Zn2+ (CZ) are prepared by the wet process (coprecipitate method). SCZW is obtained by the dry process (mixed-oxide method) from a mixture of CZ, SrCO3, and WO3. SCZW has practically no compositional, unlike solid solutions prepared by the conventional dry method. The wet–dry process method is useful because the wet process is applied to only B-site cations having the same valence.  相似文献   
19.
Summary The chemical process of preparing poly(vinylchloride)-polypyrrole composite films with high electrical conductivity and transparency has been studied. Pyrrole has been diffused into the poly(vinylchloride) matrix in the swelling medium of n-hexane and acetone mixture. The oxidative polymerization of the diffused pyrrole in the binary solvent system of acetonitrile and methanol gives high conductivity of the polypyrrole as well as the good penetration of the oxidant into the PVC polymer matrix. The analytical testing of the composite film shows the formation of homogeneous mixture of polypyrrole and poly(vinylchloride) conductive layer within the 1.0m of thickness on the film surface. The transparency of the composite film showed about 50–60% at 500 nm. The electrical conductivity of the composite was about 20 s/cm.  相似文献   
20.
Summary: Uniformly sized polymer particles were prepared by an emulsification and polymerization technique utilizing a silica monolithic membrane, namely the “silica monolithic membrane emulsification technique”. In this paper, we utilized silica monolithic membrane as a device for the preparation of uniformly sized polymer particles. A mixture of monomers, diluents and oil‐soluble initiator was emulsified into a continuous medium through the silica monolithic membrane and polymerized. The particles obtained had a higher size uniformity than that of particles prepared by previously reported membrane emulsification techniques, such as the Shirasu Porous Glass (SPG) emulsification technique. Through the silica monolithic membrane emulsification technique, we could prepare particles having availability as a possible packing material for solid‐phase extraction (SPE) and high performance liquid chromatography (HPLC).

SEM photograph of silica particles prepared through capillary plate membrane.  相似文献   

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