Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

Finding structure in audio for music information retrieval

This paper presents a brief overview of recent approaches to two problems in music information retrieval: query by example and automated source separation. It describes the challenges inherent in musical query by example and the systems that take very different approaches to the problem. The paper also explores approaches to source separation in a musical context, focusing on systems that take distinct approaches to the problem. Finally, it comments about the future directions for digital signal processing (DSP) research in the context of music information retrieval.     

基于USB总线的虚拟频谱分析仪设计

文章详细介绍了基于USB总线的虚拟频谱分析仪的设计过程。该仪器使用嵌入式混合处理器MC56F8323来实现动态信号的实时采集、频谱分析和数字滤波等功能。处理结果由USB2．0接口芯片CY7C68013上传至PC机．以完成数据显示、存储、绘制图形等功能。其中，CY7C68013工作于Slave FIFO模式，以实现与MC56F8323间的数据传输。该系统可同时对两路动态信号进行实时谱分析，每路采样频率高选500kHz。     

WCDMA系统接口信令消息的描述与实现

WCDMA作为第三代移动通信系统的主流标准，能够提供多种类型的多媒体服务。为了实现各种用户平面数据的传输，系统会提前通过控制平面对所需的无线资源进行分配。由于配置过程是通过接口之间发送控制平面应用协议消息来实现的，因此能否正确有效地对信令消息进行编解码成为保证系统稳定工作的关键因素。3GPP标准中，ASN．1语言被用来描述接口信令消息。首先简要介绍了WCDMA系统结构以及主要接口协议，重点描述了ASN．1存在的意义及其编解码规则，最后给出了基于ASN．1的开发环境下应用层网络协议的开发流程。     

Nonlinear crack dynamics and scaling aspects of fracture (experimental and theoretical study)

Nonlinear dynamics of crack propagation are investigated experimentally and theoretically with the goal of clarifying the nature of limiting crack velocity, the transition from steady state to branching regimes of crack dynamics, and the dynamics of crack arrest. The theoretical explanation of limiting steady-state crack velocity and the transition to a branching regime was proposed due to the study of collective behavior of a microcrack ensemble at the crack tip area. The experimental study of crack dynamics was carried out in a preloaded plate PMMA specimen using the high-speed camera coupled with the photo-elasticity method, the point stress recording with a laser system, and the failure surface roughness measurement.     

Nanoscale Crystallization in Amorphous Fe–P–Mn Alloys

Mössbauer effect measurements and physicochemical analysis demonstrate that annealing of amorphous Fe–P–Mn alloys leads to the formation of a nanocrystalline structure.     

Fabrication, assembly, and characterization of molecular electronic components

One of the ultimate miniaturizations in nanotechnology is molecular electronics, where devices will consist of individual molecules. There are many complications associated with the use of molecules in electronic devices, such as the electronic perturbations in the molecule associated with being bonded to an electrode, how electrons traverse the metal-molecule junction, and the difficulty of macroscopically addressing single to very few molecules. Whether fabricating a test structure or a usable device, the use of self-assembly is fundamental to the fabrication of molecular electronic devices. We will discuss how to fabricate self-assembled monolayers into test assemblies and how to use intermolecular interactions to direct molecules into desired positions to create nanostructures and to connect functional molecules to the outside world. These assemblies serve as test structures for measurements on single or bundled molecules. The development of several experimental techniques, including various scanning probes, mercury drop junctions, break junctions, nanopores, crossed wires, and other techniques using nanoparticles have enabled the ability to test these structures and make reproducible measurements on single molecules. Many of these methods have been developed to test molecules with potential for integration into devices such as oligo (phenylene-ethynylene) molecules and other /spl pi/-conjugated molecules, in ensemble or single-molecule measurements.     

On optimal sequential prediction for general processes

This paper considers several aspects of the sequential prediction problem for unbounded, nonstationary processes under pth power loss /spl lscr//sub p/(u,v)=|u-v|/sup p/, 1相似文献   

Kinetic Characteristics of Amino Acid Salt Crystallization in Methanol‐Water System

Nucleation and growth mechanisms and kinetics of crystals of an amino acid salt were investigated in a methanol‐water system by measuring and evaluating the induction time as a function of the supersaturation ratio and temperature in batch salting out crystallization experiments. Discrimination between the possible crystallization mechanisms, and estimation of the kinetic parameters were carried out using nonlinear parameter identification. The results concerning the growth mechanism obtained were checked additionally by measuring the induction time as a function of number density of seed crystals.     

Stability analysis of a feedback-controlled resonant DC-DC converter

This paper reports on the stability analysis of one member of a dual-channel resonant DC-DC converter family. The study is confined to the buck configuration in symmetrical operation. The output voltage of the converter is controlled by a closed loop applying constant-frequency pulsewidth modulation. The dynamic analysis reveals that a bifurcation cascade develops as a result of increasing the loop gain. The trajectory of the variable-structure piecewise-linear nonlinear system pierces through the Poincare plane at the fixed point in state space when the loop gain is small. For stability criterion the positions of the characteristic multipliers of the Jacobian matrix belonging to the Poincare map function defined around the fixed point located in the Poincare plane is applied. In addition to the stability analysis, a bifurcation diagram is developed showing the four possible states of the feedback loop: the periodic, the quasi-periodic, the subharmonic, and the chaotic states. Simulation and test results verify the theory.