数字产品存储器和缓冲器的设计思想

存储器是许多数字产品的关键内置模块.标准的SRAM、DRAM和非易失性存储器(NVMs)是最常用的存储器件.特殊的存储器,例如先进先出存储器,也可提供特定功能或实现特殊性能需求.在下面内容中,我们将回顾这些设计,并介绍一些存储器可能的应用场合.这些设计思路可以应用到SoC(芯片级系统)项目中.     

Full-Vectorial Optical Waveguide Mode Solvers Using Multidomain Pseudospectral Frequency-Domain (PSFD) Formulations

New full-vectorial optical waveguide eigenmode solvers using pseudospectral frequency-domain (PSFD) formulations for optical waveguides with arbitrary step-index profile are presented. Both Legendre and Chebyshev collocation methods are considered in the formulation. By applying Legendre-Lagrange or Chebyshev-Lagrange interpolating polynomials to the approximation of spatial derivatives at collocation points, the Helmholtz equations for the transverse-electric or transverse-magnetic components are converted into a matrix eigenvalue equation which is then solved for the eigenmodes by the shift inverse power method. Suitable multidomain division of the computational domain is arranged to deal with general curved interfaces of the refractive-index profile together with a curvilinear mapping technique for each subdomain so that field continuity conditions can be carefully imposed across the dielectric interfaces, which is essential in achieving high numerical accuracy. The solver is applied to the optical fiber for the assessment of its numerical performance, to the classical benchmark rib waveguide for comparing with existing high-accuracy results, and to the fused fiber structure for demonstrating its robustness in calculating the form birefingence.     

Chaos in wavelength of tunable semiconductor laser diode with time-delayed Fabry-Perot feedback

With time-delayed Fabry-Perot feedback, chaos in the wavelength of a tunable semiconductor laser diode has been successfully demonstrated. The nonlinear feedback function can be easily tuned by varying the optical path difference of a Fabry-Perot cavity. Experimental results are compared with theoretical simulation and good agreement is obtained.     

Analysis of etched long-period fibre grating and its response to external refractive index

Analytical formulas are presented for the first time to describe the shift in the resonance wavelength of a long-period fibre grating (LPFG) in response to etching of the fibre cladding or a change in the external refractive index. The accuracy of the formulas is confirmed by comparison with numerical simulations and experimental results. It is shown that the resonance wavelengths of an etched LPFG are more sensitive to the external refractive index than those of an unetched grating.     

Three-Level AC–DC–AC Z-Source Converter Using Reduced Passive Component Count

This paper presents a three-level AC-DC-AC Z-source converter with output voltage buck-boost capability. The converter is implemented by connecting a low-cost front-end diode rectifier to a neutral-point-clamped inverter through a single X-shaped LC impedance network. The inverter is controlled to switch with a three-level output voltage, where the middle neutral potential is uniquely tapped from the star-point of a wye-connected capacitive filter placed before the front-end diode rectifier for input current filtering. Through careful control, the resulting converter can produce the correct volt-second average at its output, while simultaneously achieving inductive voltage boosting by shooting through either an appropriately selected inverter phase-leg or two phase-legs being commanded simultaneously. More interestingly, these performance features are achieved with no increase in the number of semiconductor commutations, and hence, no increase in switching losses. The proposed converter therefore offers a low-cost alternative to applications that need to ride through frequent input voltage sags. For confirming the converter performance, experimental testing using a constructed laboratory prototype is performed with its captured results presented in a later section of the paper.     

Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application

The thermo-mechanical testing of HYSOL FP4549 polymer-filled underfill materials was conducted under different strain rate and temperature environment. A new specimen preparation procedure and further test methodology are developed to characterize the time–temperature mechanical behaviors of underfill materials. The stress–strain behavior of materials is simulated with constitutive framework, and the dependence of Young’s modulus on temperature and strain rate was evaluated. In addition, the specimens were tested with microforce testing system to evaluate the creep curve of underfill materials as a function of temperature and stress level. In view of the uncertainty of the Young’s modulus determination, the specimens were tested with unloading–reloading technique to verify the test results and investigate its cyclic mechanical behaviors. On the other hand, the adhesion strength of underfill materials are tested between different adhesion surface by different deformation rate after some isothermal and hygro-thermal environments attack, which is to simulate the environment that the electronic components may be encountered. The results reveal that the rise of the temperature and moisture cause the apparent reduction of the surface adhesion strength, due to the microstructure transition of materials and the diffusion and concentration of moisture. For all conditions of the experiment after environmental preconditioning, the specimen fracture surfaces occur between solder mask and FR4 substrates, which means the measured strength is the adhesion strength between solder mask and FR4. Comparing different adhesion surface, the adhesion strength of underfill/FR4 is higher than solder mask/FR4. The interface of solder mask/FR4 is more sensitive to the temperature and moisture. In all of the cases, increasing the moisture level has a varying but significant effect on both fracture strength and absorption energy Ψ. The failure mode transfer and the strength degradation are attributed to the moisture uptake between the FR4/solder mask and solder mask/underfill interface.     

Birefringence in benzocyclobutene strip optical waveguides

We report the fabrication of benzocyclobutene strip optical waveguides and the measurement of their birefringence properties. To take into account the stress-induced birefringence in the waveguide, we generalize the formulas reported previously for the analysis of strip waveguides. Our experimental results are shown to agree closely with the theoretical calculation. The condition for achieving zero modal birefringence by control of the aspect ratio of the strip of the waveguide is highlighted. The dependence of the birefringence in the waveguides on the temperature is also measured and discussed.     

Colossal Barocaloric Effect by Large Latent Heat Produced by First-Order Intersite-Charge-Transfer Transition

Materials which show novel thermal properties can be used to make highly efficient and environmentally friendly energy systems for thermal energy storage and refrigeration through caloric effects. An A-site-ordered quadruple perovskite-structure oxide, NdCu₃Fe₄O₁₂, is found to release significant latent heat, 25.5 kJ kg⁻¹ (157 J cc⁻¹), at the intersite-charge-transfer transition temperature near room temperature. The transition is first-order and accompanied by an unusual magnetic ordering and a large negative-thermal-expansion-like volume change, and thus, it causes a large entropy change (84.2 J K⁻¹ kg⁻¹). The observed entropy change is comparable to the largest changes reported in inorganic solid materials, and more importantly, it is utilized through a colossal barocaloric effect. The adiabatic temperature change by applying 5.1 kbar pressure is estimated to reach 13.7 K, which means efficient refrigeration can be realized through this effect.     

Thermal resistance analysis and validation of flip chip PBGA packages

This work proposes a finite element numerical methodology to predict the thermal resistance of both flip chip-plastic ball grid array (FC-PBGA) with a bare die and FC-PBGA with a metal cap. The 3D finite element model was initially constructed to simulate the thermal resistance of FC-PBGA. A thermal resistance experiment was performed to verify the FEM results, following the construction of specimens of FC-PBGA with a bare die and with an aluminum cap, using six-layered substrate. The verified finite element model was employed to determine the thermal resistance of FC-PBGA with a copper cap using four-layered and six-layered substrates. Experimental results demonstrated that FC-PBGA with a metal cap improves thermal performance by 35% over with a bare die. FC-PBGA with a copper cap slightly improves thermal performance from 2% to 2.8% over that of FC-PBGA with an aluminum cap. The thermal resistance of FC-PBGA with a four-layered substrate is reduced by 4.0% to 5.9% from that of FC-PBGA with a six-layered substrate, since the four-layered substrate contains less metal. The finite element numerical results negligibly differ from the experimental results by 6% to 8.1%. A finite element numerical methodology is here proposed to predict the thermal resistance of FC-PBGA. The methodology is effective in researching and developing new products or improving existing packages.     

A wafer-level microcap array to enable high-yield microsystem packaging

Packaging represents a significant and expensive obstacle in commercializing microsystem technology (MST) devices such as microelectromechanical systems (MEMS), microopticalelectromechanical systems (MOEMS), microsensors, microactuators, and other micromachined devices. This paper describes a novel wafer-level protection method for MSTs which facilitate improved manufacturing throughput and automation in package assembly, wafer-level testing of devices, and enhanced device performance. The method involves the use of a wafer-sized microcap array. This array consists of an assortment of small caps molded onto a material with adjustable shapes and sizes to serve as protective structures against the hostile environments associated with packaging. It may also include modifications which enhance its adhesion to the MST wafer or increase the MST device function. Depending on the application, the micromolded cap can be designed and modified to facilitate additional functions, such as optical, electrical, mechanical, and chemical functions, which are not easily achieved in the device by traditional means. The fabrication and materials selection of the microcap device is discussed in this paper. The results of wafer-level microcap packaging demonstrations are also presented.