Submicrometer Comb-Drive Actuators Fabricated on Thin Single Crystalline Silicon Layer

Electrostatic comb-drive microactuators were fabricated by electron beam lithography on a 260-nm-thick silicon layer of a silicon-on-insulator wafer. The actuators consisted of comb electrodes, springs, and a frame. Two kinds of microactuators with doubly clamped and double-folded springs were designed and fabricated. The comb electrode was as small as 2.5 mum wide and 8 mum long and was composed of 250-nm-wide, 260-nm-thick, and 2-mum-long fingers. The air gap between the fingers was 350 nm. The spring was 250 nm wide, 260 nm thick, and 17.5 mum long, and the spring constant was 0.11 N/m. The force and displacement generated by the microactuator were 2.3 x 10^-7N and 1.0 mum, respectively. Applying an ac voltage, the oscillation amplitude became maximum at a frequency of 132 kHz. The mechanical and electrical characteristics of the fabricated actuators were investigated quantitatively.     

Fabrication method for IC-oriented Si single-electron transistors

A new fabrication method for Si single-electron transistors (SETs) is proposed. The method applies thermal oxidation to a Si wire with a fine trench across it on a silicon-on-insulator substrate. During the oxidation, the Si wire with the fine trench is converted, in a self-organized manner, into a twin SET structure with two single-electron islands, one along each edge of the trench, due to position-dependent oxidation-rate modulation caused by stress accumulation. Test devices demonstrated, at 40 K, that the twin SET structure can operate as two individual SET's. Since the present method produces two SET's at the same time in a tiny area, it is suitable for integrating logic circuits based on pass-transistor type logic and CMOS-type logic, which promises to lead to the fabrication of single-electron logic LSIs     

Comparative study of absorbing boundary conditions for thetime-domain beam propagation method

Various absorbing boundary conditions (ABCs) are compared in the analysis of the time-domain finite-difference beam propagation method. For a one-dimensional problem, the following ABCs are tested: Higdon's absorbing boundary, Ramahi's complementary operators method (COM), its concurrent version (C-COM) and Berenger's perfectly matched layer (PML). It is found that the second- and third-order C-COMs with three and four boundary cells are comparable to the PMLs with eight and 16 cells, respectively. The effectiveness of the C-COM is also discussed in a two-dimensional problem     

A multigigabit DRAM technology with 6F2 open-bitlinecell, distributed overdriven sensing, and stacked-flash fuse

A multigigabit DRAM technology was developed that features a low-noise 6F² open-bitline cell with fully utilized edge arrays, distributed overdriven sensing for operation below 1 V, and a highly reliable post-packaging repair scheme using a stacked-flash fuse. This technology, which can be used to fabricate a 0,13-μm 180-mm² 1-Gb DRAM assembled in a 400-mil package, was verified using a 57.6-mm², 200-MHz array-cycle, 256-Mb test chip with 0.109-μm² cells     

InP optical switch array module high frequency performance: measurements and analysis

An injection-mode InP optical switch array has been characterised at high frequency. A switched optical pulse settling anomaly, which limits the switching performance of the array, is associated with recombination and junction heating effects at the switch heterojunction interface. A simple model describing the effects is presented. Critical design parameters are also identified.<>     

Highly reliable copper dual-damascene interconnects with self-formed MnSi/sub x/O/sub y/ barrier Layer

Copper (Cu) dual-damascene interconnects with a self-formed MnSi/sub x/O/sub y/ barrier layer were successfully fabricated. Transmission electron microscopy shows that approximately 2-nm thick and continuous MnSi/sub x/O/sub y/ layer was formed at the interface of Cu and dielectric SiO/sub 2/, and that no barrier was formed at the via bottom because no oxygen was at the via bottom during annealing. No leakage-current increase was observed, and electron energy loss analysis shows that no Cu was in SiO/sub 2/, suggesting that MnSi/sub x/O/sub y/ layer has sufficient barrier properties for Cu, and that the concept of self-forming barrier process works in Cu dual-damascene interconnects. Via chain yield of more than 90% and 50% reduction in via resistance were obtained as compared with physical vapor deposited tantalum barrier, because there is no barrier at the via bottom. In addition, no failure in the stress-induced voiding measurement was found even after a 1600-h testing. No failure in electromigration (EM) testing was found, as the electron flow is from the lower level interconnects through via up to upper level interconnects even after 1000-h testing. At least, four times EM lifetime improvement was obtained in the case of electron flow from upper level interconnect through via down to lower level interconnects. Significant EM lifetime improvement is due to no flux divergence site at the via bottom, resulting from there being no bottom barrier at the via.     

A 63-mW H.264/MPEG-4 audio/visual codec LSI with module-wise dynamic Voltage/frequency scaling

A single-chip H.264 and MPEG-4 audio-visual LSI for mobile applications including terrestrial digital broadcasting system (ISDB-T / DVB-H) with a module-wise, dynamic voltage/frequency scaling architecture is presented for the first time. This LSI can keep operating even during the voltage/frequency transition, so there is no performance overhead. It is realized through a dynamic deskewing system and an on-chip voltage regulator with slew rate control. By the combination with traditional low power techniques such as embedded DRAM and clock gating, it consumes only 63 mW in decoding QVGA H.264 video at 15 frames/sec and MPEG-4 AAC LC audio simultaneously.     

A non‐repudiable negotiation protocol for security service level agreements

Security service level agreements (SSLAs) provide a systematic way for end users at home or in the office to guarantee sufficient security level when doing business or exchanging sensitive personal or organizational data with an online service. In this paper, we propose an SSLA negotiation protocol that implements non‐repudiation with cryptographic identities and digital signatures and includes features that make it resistant to denial of service attacks. The basic version of the protocol does not rely on the use of a trusted third party, and it can be used for all kinds of simple negotiations. For the negotiation about SSLAs, the protocol provides an option to use an external knowledge base that may help the user in the selection of suitable security measures. We have implemented a prototype of the system, which uses JSON Web Signature for the message exchange and made some performance tests with it. The results show that the computational effort required by the cryptographic operations of the negotiation protocol remains at a reasonable level. Copyright © 2014 John Wiley & Sons, Ltd.     

Crystallographic, Thermoelectric, and Mechanical Properties of Polycrystalline Ba8Al x Si46−x Clathrates

The Al content dependence of crystallographic, thermoelectric, and mechanical properties is reported for polycrystalline Ba₈Al _x Si_46?x (nominal x = 15 to 17) clathrates prepared by combining arc melting and spark plasma sintering methods. The elastic constants and the coefficient of thermal expansion (CTE), which are also important properties for designing thermoelectric devices, are presented. Powder x-ray diffraction, scanning electron microscopy, and energy-dispersive x-ray spectroscopy (EDX) indicate that the type I clathrate is the major phase of the samples but impurity phases (mainly BaAl₂Si₂, Si, and Al) are included in the samples with high Al contents. The actual Al content x determined by EDX ranges from approximately 14 to 15. The absolute value of the Seebeck coefficient increases and the electrical conductivity decreases as the Al content increases. The changes in Seebeck coefficient and electrical conductivity are explained in terms of the dependence of the carrier concentration on the Al content. The elastic constants and the CTE of the samples depend weakly on the Al content. Some of the properties are compared with reported data of single crystals of Ba₈Al₁₆Ge₃₀, Ba₈Ga₁₆Ge₃₀, Sr₈Ga₁₆Ge₃₀, silicon, and germanium as standard references. The effective mass, Hall carrier mobility, and lattice thermal conductivity, which govern the transport properties, are determined to be ~ 2.4m ₀, ~ 7 cm² V^?1 s^?1, and ~ 1.3 W m^?1 K^?1, respectively, for actual Al content x of about 14.77. The thermoelectric figure of merit ZT is estimated to be about 0.35 at 900 K for actual Al content x of about 14.77.     

Tunable Terahertz Device Using Refractive Index Control

We measured the thermal dependencies of the refractive index and the absorption coefficient of high-resistivity silicon. We found that the refractive index varied slightly with temperature, and the absorption coefficient was very low and remained approximately constant as the temperature was changed. As a result, the conditions for terahertz propagation in silicon could be controlled by changing the refractive index without any absorption loss. As one application of this effect, we developed a terahertz time delay generator that can generate a terahertz time delay by changing the temperature of the medium through which the terahertz beam passes, without the need for any mechanical delay. We demonstrated generation of a terahertz time delay of approximately 6.6 ps.