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991.
The newly developed ingot growing techniques, as the three-grain and the columnar multigrain ingot processes, are now offering the possibility of slicing thinner wafers (≤ 100 μm). In this paper we present the results obtained on p type large area (≥ 100 cm2) and 100 μm thick wafers by using both conventional and reverse cell manufacturing technologies.The conventional cells are provided with aluminium or boron BSF plus screen-printed silver mirror or a silver-aluminium net; the reverse cells have a FSF and the deep back junction completely covered by a screen-printed or CVD silver layer.The constructing parameters have been chosen on the base of one and two dimensions modeling and both raw material and devices have been completely characterized.This work shows that very thin wafers do not introduce serious problems for the conventional manufacturing of solar cells. The efficiencies of the normal and of the reverse cells are found to be comparable and are of the same order than those of thicker cells, however at a significant lower cost. The main obtained result has to be related to the demonstration of a cell manufacturing feasibility starting from very thin wafers.  相似文献   
992.
993.
The effect of a realistic residual stress field on the predicted initiation of brittle and ductile fracture in a pressure and axially loaded circumferentially cracked pipe is examined using finite element analysis, micromechanical models of fracture initiation, andJ-Q theory. The study confirms that residual stresses contribute to the driving force and reduce fracture loads early in the loading history. In addition, results show that the residual stresses severely alter theJ-value (i.e., fracture toughness) predicted for the onset of brittle fracture. The reason for this decrease is found to be the increase in constraint generated by the residual stress field. In contrast, the effect of residual stresses on the ductile fracture initiation toughness is shown to be negligible. kw]Key words kw]residual stress kw]fracture initiation kw]micromechanics  相似文献   
994.
A method, apparatus and results of measurements of the degradation of semiconductor optoelectronic components (light-emitting diodes and photodiodes) are described. The difficulties that occur in such investigations are pointed out. Translated from Izmeritel'naya Tekhnika, No. 10, pp. 33–35, October, 1996.  相似文献   
995.
Analysis of adhesive bonded composite lap joints with transverse stitching   总被引:1,自引:0,他引:1  
The effect of transverse stitching on the stresses in the adhesive is investigated using an adhesive sandwich model with nonlinear adhesive properties and a transverse stitching model for adhesive bonded composite single-lap and double-lap joints. Numerical results indicate that, among all stitching parameters, thread pretension and stitch density have significant effect on the peel stresses in the adhesive; increase in the thread pretension and the stitch density leads to a decrease in peel stress in the adhesive, while an increase in other parameters generally results in a negligible reduction in peel stress. The effect of stitching was found to be negligible on the shear stresses in the adhesive. Thus it is concluded that stitching is effective for the joints where peel stresses are critical and ineffective for those where shear stresses are critical.  相似文献   
996.
997.
Griseofulvin solid dispersions were prepared using polyethylene glycol 6000 (PEG), talc, and their combination as carriers by the solvent method. The dissolution of griseofulvin from these dispersions was studied. It was found that in these carriers the drug dissolution rate was a function of drug loading. The dissolution rate from dispersions prepared using PEG was similar to that from PEG/talc dispersions, especially at a low percentage of drug loading. Dispersions of PEG and PEG/talc provided dissolution rates faster than those from dispersions of talc. The incorporation of talc in PEG yielded dispersions with properties of less tackiness and ease for handling. Dissolution kinetics, based on the Hixson-Crowell equation, was used to determine the characteristics of griseofulvin particles in dispersions. Linear relationships were obtained for PEG and PEG/talc dispersions that indicated the presence of a uniformly sized monoparticulate system, whereas deviation from linearity was observed for talc dispersions. This appeared to be a multiparticulate system in which particles were present as free form and adsorbed form on the surface of talc.  相似文献   
998.
An InGaAsP/InP laser monolithically integrated with a rear facet monitor and a fiber V-groove has been demonstrated for the first time. The integrated device incorporates an etched-facet laser fabricated using an in situ, multistep, reactive ion etch process. The integrated V-groove, which is etched directly into the InP substrate, is designed to enable passive alignment of an optical fiber to the active region of the laser. Passive coupling efficiencies of 18% and 8% have been obtained using cleaved multimode and single mode fibers, respectively. Responsivities of the rear facet monitor were as high as 0.49 A/W  相似文献   
999.
Lewis  L. Dreo  G. 《IEEE network》1993,7(6):44-51
Network management in large heterogeneous communication environments requires the incorporation of more advanced tools than are currently available, especially in the area of fault management. By providing an informational infrastructure for documenting network behavior and maintenance activities, TTSs (trouble ticket systems) have provided some relief for the fault management problem. Researchers have recognized TTSs as a means for realizing more advanced functions in network management platforms to effect automatic trouble ticket generation, fault diagnostics, and the correlation of multiple views network problems and behavior. The authors describe current research trends towards understanding and implementing these advanced functions in a TTS framework  相似文献   
1000.
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